JPS6059756A - プラグインパッケ−ジとその製造方法 - Google Patents

プラグインパッケ−ジとその製造方法

Info

Publication number
JPS6059756A
JPS6059756A JP58168025A JP16802583A JPS6059756A JP S6059756 A JPS6059756 A JP S6059756A JP 58168025 A JP58168025 A JP 58168025A JP 16802583 A JP16802583 A JP 16802583A JP S6059756 A JPS6059756 A JP S6059756A
Authority
JP
Japan
Prior art keywords
plug
board
substrate
package
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58168025A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558262B2 (enExample
Inventor
Katsumi Mabuchi
勝美 馬淵
Osamu Fujikawa
治 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP58168025A priority Critical patent/JPS6059756A/ja
Publication of JPS6059756A publication Critical patent/JPS6059756A/ja
Publication of JPH0558262B2 publication Critical patent/JPH0558262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58168025A 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法 Granted JPS6059756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58168025A JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58168025A JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Publications (2)

Publication Number Publication Date
JPS6059756A true JPS6059756A (ja) 1985-04-06
JPH0558262B2 JPH0558262B2 (enExample) 1993-08-26

Family

ID=15860416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58168025A Granted JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Country Status (1)

Country Link
JP (1) JPS6059756A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112271A (ja) * 1992-08-12 1994-04-22 Internatl Business Mach Corp <Ibm> ダイレクト・チップ・アタッチ・モジュール

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923624A (enExample) * 1972-06-22 1974-03-02
JPS4957372A (enExample) * 1972-10-04 1974-06-04
JPS5489273U (enExample) * 1977-12-08 1979-06-23
JPS5517472U (enExample) * 1978-07-20 1980-02-04
JPS55103751A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS5631872U (enExample) * 1979-08-17 1981-03-28
JPS56103491A (en) * 1980-01-23 1981-08-18 Hitachi Ltd Semiconductor device
JPS5784750U (enExample) * 1980-11-14 1982-05-25
JPS5810848A (ja) * 1981-07-14 1983-01-21 Toshiba Corp 混成集積回路用リ−ドピン
JPS5810840A (ja) * 1981-07-10 1983-01-21 Fujitsu Ltd 半導体装置
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923624A (enExample) * 1972-06-22 1974-03-02
JPS4957372A (enExample) * 1972-10-04 1974-06-04
JPS5489273U (enExample) * 1977-12-08 1979-06-23
JPS5517472U (enExample) * 1978-07-20 1980-02-04
JPS55103751A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS5631872U (enExample) * 1979-08-17 1981-03-28
JPS56103491A (en) * 1980-01-23 1981-08-18 Hitachi Ltd Semiconductor device
JPS5784750U (enExample) * 1980-11-14 1982-05-25
JPS5810840A (ja) * 1981-07-10 1983-01-21 Fujitsu Ltd 半導体装置
JPS5810848A (ja) * 1981-07-14 1983-01-21 Toshiba Corp 混成集積回路用リ−ドピン
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112271A (ja) * 1992-08-12 1994-04-22 Internatl Business Mach Corp <Ibm> ダイレクト・チップ・アタッチ・モジュール

Also Published As

Publication number Publication date
JPH0558262B2 (enExample) 1993-08-26

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