JPH0558262B2 - - Google Patents

Info

Publication number
JPH0558262B2
JPH0558262B2 JP58168025A JP16802583A JPH0558262B2 JP H0558262 B2 JPH0558262 B2 JP H0558262B2 JP 58168025 A JP58168025 A JP 58168025A JP 16802583 A JP16802583 A JP 16802583A JP H0558262 B2 JPH0558262 B2 JP H0558262B2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
hole
plug
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58168025A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6059756A (ja
Inventor
Katsumi Mabuchi
Osamu Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP58168025A priority Critical patent/JPS6059756A/ja
Publication of JPS6059756A publication Critical patent/JPS6059756A/ja
Publication of JPH0558262B2 publication Critical patent/JPH0558262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H10W72/07551—
    • H10W72/50—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58168025A 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法 Granted JPS6059756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58168025A JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58168025A JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Publications (2)

Publication Number Publication Date
JPS6059756A JPS6059756A (ja) 1985-04-06
JPH0558262B2 true JPH0558262B2 (enExample) 1993-08-26

Family

ID=15860416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58168025A Granted JPS6059756A (ja) 1983-09-12 1983-09-12 プラグインパッケ−ジとその製造方法

Country Status (1)

Country Link
JP (1) JPS6059756A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313366A (en) * 1992-08-12 1994-05-17 International Business Machines Corporation Direct chip attach module (DCAM)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923624A (enExample) * 1972-06-22 1974-03-02
JPS5529584B2 (enExample) * 1972-10-04 1980-08-05
JPS5489273U (enExample) * 1977-12-08 1979-06-23
JPS5517472U (enExample) * 1978-07-20 1980-02-04
JPS55103751A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS6223691Y2 (enExample) * 1979-08-17 1987-06-17
JPS56103491A (en) * 1980-01-23 1981-08-18 Hitachi Ltd Semiconductor device
JPH0134351Y2 (enExample) * 1980-11-14 1989-10-19
JPS5810840A (ja) * 1981-07-10 1983-01-21 Fujitsu Ltd 半導体装置
JPS5810848A (ja) * 1981-07-14 1983-01-21 Toshiba Corp 混成集積回路用リ−ドピン
JPS58159355A (ja) * 1982-03-17 1983-09-21 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6059756A (ja) 1985-04-06

Similar Documents

Publication Publication Date Title
JP3541491B2 (ja) 電子部品
JP3619395B2 (ja) 半導体素子内蔵配線基板およびその製造方法
CN1327499C (zh) 制造半导体组件的方法
JP6027001B2 (ja) 放熱回路基板
JPH09199635A (ja) 回路基板形成用多層フィルム並びにこれを用いた多層回路基板および半導体装置用パッケージ
CN215266272U (zh) 基于铜箔载板的高散热板级扇出封装结构
JPH0558262B2 (enExample)
JPH0582060B2 (enExample)
JP2614495B2 (ja) 電子部品搭載用基板
JPH0846084A (ja) 表面実装型半導体パッケージ及びその製造方法並びに半導体装置
JPH0358552B2 (enExample)
JP3684517B2 (ja) 半導体装置
JP2612468B2 (ja) 電子部品搭載用基板
JPS6095943A (ja) プラグインパツケ−ジとその製造方法
JP3281864B2 (ja) 混成集積回路装置の製造方法
JPS6134989A (ja) 電子部品搭載用基板
KR102787140B1 (ko) 반도체 패키지 및 이의 제조방법
JPH11163197A (ja) 半導体実装用基板
JP3382516B2 (ja) 半導体パッケージ
JP3733181B2 (ja) 半導体搭載用基板及びその製造方法
JPS60111489A (ja) 電子部品塔載用基板およびその製造方法
JPH06104375A (ja) 半導体集積回路装置
JPH0358551B2 (enExample)
JP2003282771A (ja) 放熱板付き配線基板
JP3378680B2 (ja) 半導体パッケージ