JPH0358551B2 - - Google Patents

Info

Publication number
JPH0358551B2
JPH0358551B2 JP60030803A JP3080385A JPH0358551B2 JP H0358551 B2 JPH0358551 B2 JP H0358551B2 JP 60030803 A JP60030803 A JP 60030803A JP 3080385 A JP3080385 A JP 3080385A JP H0358551 B2 JPH0358551 B2 JP H0358551B2
Authority
JP
Japan
Prior art keywords
recess
substrate
electronic component
board
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60030803A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61189697A (ja
Inventor
Hajime Yatsu
Katsumi Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60030803A priority Critical patent/JPS61189697A/ja
Publication of JPS61189697A publication Critical patent/JPS61189697A/ja
Publication of JPH0358551B2 publication Critical patent/JPH0358551B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP60030803A 1985-02-19 1985-02-19 電子部品搭載用基板およびその製造方法 Granted JPS61189697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60030803A JPS61189697A (ja) 1985-02-19 1985-02-19 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60030803A JPS61189697A (ja) 1985-02-19 1985-02-19 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS61189697A JPS61189697A (ja) 1986-08-23
JPH0358551B2 true JPH0358551B2 (enExample) 1991-09-05

Family

ID=12313835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60030803A Granted JPS61189697A (ja) 1985-02-19 1985-02-19 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS61189697A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207095A (ja) * 1985-03-11 1986-09-13 イビデン株式会社 薄型ｉｃカ−ド用プリント配線基板
JPS6218084A (ja) * 1985-07-16 1987-01-27 新藤電子工業株式会社 半導体素子実装用プリント配線板の製造方法
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board

Also Published As

Publication number Publication date
JPS61189697A (ja) 1986-08-23

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