JPS6439093A - Manufacture of electronic part mounting board - Google Patents
Manufacture of electronic part mounting boardInfo
- Publication number
- JPS6439093A JPS6439093A JP19580387A JP19580387A JPS6439093A JP S6439093 A JPS6439093 A JP S6439093A JP 19580387 A JP19580387 A JP 19580387A JP 19580387 A JP19580387 A JP 19580387A JP S6439093 A JPS6439093 A JP S6439093A
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- bonding agent
- semi
- agent layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To prevent position deviation due to sliding of both boards, by laminating the first board and the second board with a semi-hardening bonding agent layer having no fluidity or less fluidity. CONSTITUTION:A through hole 2 is provided for mounting an electronic part in a first board 3. A semi-hardening bonding agent layer 4 is formed on the rear surface of the first board 3. A through hole 6, which is larger than the through-hole 2, is provided in the second board 5. The inner surface part of the through-hole 2 is made to protrude from the inner surface of the through-hole 6. The second board 5 is laminated on the rear surface of the first board 3. A metal plate 7, which is enclosed in the through-hole 6, is brought into contact with the rear surface of the inner surface of the through-hole 2. Thereafter, the semi-hardening bonding agent layer 4 is hardened, and the second board 5 and the metal plate 7 are bonded to the rear surface of the first board 3. The first board 3 and the second board 5 are laminated with the semi- hardening bonding agent layer 4 having no fluidity or low fluidity. Thus, the position deviation of both boards 5 due to the sliding when the first board 3 and the second board 5 are laminated can be prevented. The extrusion of the bonding agent of the semi-hardening bonding agent layer 4 from the inner surface of the through-hole 2 is prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19580387A JPS6439093A (en) | 1987-08-05 | 1987-08-05 | Manufacture of electronic part mounting board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19580387A JPS6439093A (en) | 1987-08-05 | 1987-08-05 | Manufacture of electronic part mounting board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6439093A true JPS6439093A (en) | 1989-02-09 |
Family
ID=16347239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19580387A Pending JPS6439093A (en) | 1987-08-05 | 1987-08-05 | Manufacture of electronic part mounting board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6439093A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229451B2 (en) * | 1972-12-12 | 1977-08-02 | ||
JPS60247992A (en) * | 1984-05-23 | 1985-12-07 | 株式会社日立製作所 | Integrated circuit chip mounting substrate |
JPS6134990A (en) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | Substrate for placing electronic part and method of producing same |
JPS61189697A (en) * | 1985-02-19 | 1986-08-23 | イビデン株式会社 | Substrate for carrying electronic component and manufacture thereof |
JPS61202495A (en) * | 1985-03-05 | 1986-09-08 | イビデン株式会社 | Substrate for carrying electronic component and manufacture thereof |
-
1987
- 1987-08-05 JP JP19580387A patent/JPS6439093A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5229451B2 (en) * | 1972-12-12 | 1977-08-02 | ||
JPS60247992A (en) * | 1984-05-23 | 1985-12-07 | 株式会社日立製作所 | Integrated circuit chip mounting substrate |
JPS6134990A (en) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | Substrate for placing electronic part and method of producing same |
JPS61189697A (en) * | 1985-02-19 | 1986-08-23 | イビデン株式会社 | Substrate for carrying electronic component and manufacture thereof |
JPS61202495A (en) * | 1985-03-05 | 1986-09-08 | イビデン株式会社 | Substrate for carrying electronic component and manufacture thereof |
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