JPS6038867B2 - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS6038867B2
JPS6038867B2 JP56085741A JP8574181A JPS6038867B2 JP S6038867 B2 JPS6038867 B2 JP S6038867B2 JP 56085741 A JP56085741 A JP 56085741A JP 8574181 A JP8574181 A JP 8574181A JP S6038867 B2 JPS6038867 B2 JP S6038867B2
Authority
JP
Japan
Prior art keywords
metal plate
composite metal
plate
semiconductor device
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56085741A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57201058A (en
Inventor
保敏 栗原
芳博 鈴木
三千男 大上
耕明 八野
光雄 柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56085741A priority Critical patent/JPS6038867B2/ja
Priority to DE19823221199 priority patent/DE3221199A1/de
Priority to US06/386,071 priority patent/US4556899A/en
Publication of JPS57201058A publication Critical patent/JPS57201058A/ja
Publication of JPS6038867B2 publication Critical patent/JPS6038867B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP56085741A 1981-06-05 1981-06-05 絶縁型半導体装置 Expired JPS6038867B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56085741A JPS6038867B2 (ja) 1981-06-05 1981-06-05 絶縁型半導体装置
DE19823221199 DE3221199A1 (de) 1981-06-05 1982-06-04 Halbleiteranordnung des isolierten typs
US06/386,071 US4556899A (en) 1981-06-05 1982-06-07 Insulated type semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56085741A JPS6038867B2 (ja) 1981-06-05 1981-06-05 絶縁型半導体装置

Publications (2)

Publication Number Publication Date
JPS57201058A JPS57201058A (en) 1982-12-09
JPS6038867B2 true JPS6038867B2 (ja) 1985-09-03

Family

ID=13867264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56085741A Expired JPS6038867B2 (ja) 1981-06-05 1981-06-05 絶縁型半導体装置

Country Status (3)

Country Link
US (1) US4556899A (en, 2012)
JP (1) JPS6038867B2 (en, 2012)
DE (1) DE3221199A1 (en, 2012)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
DE3469827D1 (en) * 1983-08-23 1988-04-14 Bbc Brown Boveri & Cie Ceramic-metallic element
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
JPS60239051A (ja) * 1984-05-11 1985-11-27 Mitsubishi Electric Corp 半導体装置
US4635092A (en) * 1984-06-04 1987-01-06 General Electric Company Tape automated manufacture of power semiconductor devices
US4716124A (en) * 1984-06-04 1987-12-29 General Electric Company Tape automated manufacture of power semiconductor devices
EP0181975B1 (en) * 1984-11-15 1989-03-29 Fuji Electric Co., Ltd. Semiconductor device comprising a support body
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten
DE3522703A1 (de) * 1985-06-25 1987-01-08 Leitron Leiterplatten Leiterplatte mit keramischen chip-traeger-material
DE3604075A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Verpackung von leistungsbauelementen
US4858073A (en) * 1986-12-10 1989-08-15 Akzo America Inc. Metal substrated printed circuit
EP0322434B1 (de) * 1987-07-03 1993-10-20 DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter Flacher körper, insbesondere zur verwendung als wärmesenke für elektronische leistungsbauelemente
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
DE3731624A1 (de) * 1987-09-19 1989-03-30 Asea Brown Boveri Ausgleichsronde fuer leistungshalbleitermodule
US5194934A (en) * 1988-07-27 1993-03-16 Semiconductor Energy Laboratory Co., Ltd. Mounting structure for a semiconductor chip having a buffer layer
DE3930858C2 (de) * 1988-09-20 2002-01-03 Peter H Maier Modulaufbau
DE3837618A1 (de) * 1988-11-05 1990-05-10 Semikron Elektronik Gmbh Elektrische oder elektronische anordnung
DE3837617A1 (de) * 1988-11-05 1990-05-10 Semikron Elektronik Gmbh Traegerkoerper zur elektrisch isolierten anordnung von bauteilen
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
US4965710A (en) * 1989-11-16 1990-10-23 International Rectifier Corporation Insulated gate bipolar transistor power module
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
DE69013310T2 (de) * 1989-12-22 1995-04-27 Westinghouse Electric Corp Gehäuse für Leistungshalbleiterbauelemente.
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
DE4017181C2 (de) * 1990-05-29 1998-08-27 Daimler Benz Aerospace Ag Elektrisches Bauelement
JP2777464B2 (ja) * 1990-07-18 1998-07-16 株式会社日立製作所 電子装置と、これを用いたエンジンの点火装置
JP2505065B2 (ja) * 1990-10-04 1996-06-05 三菱電機株式会社 半導体装置およびその製造方法
DE4208604A1 (de) * 1991-11-29 1993-06-03 Schulz Harder Juergen Verbundmaterial zur verwendung als traeger elektrischer schaltkreise sowie unter verwendung des verbundmaterials hergestellter elektrischer schaltkreis
JP2838625B2 (ja) * 1992-09-08 1998-12-16 株式会社日立製作所 半導体モジュール
FR2697125B1 (fr) * 1992-10-20 1994-12-09 Thomson Csf Procédé de montage d'une microstructure et microstructure montée selon le procédé.
JPH0794633A (ja) * 1993-09-24 1995-04-07 Ngk Spark Plug Co Ltd 金属部材を接合したセラミック基板
US5614763A (en) * 1995-03-13 1997-03-25 Zetetic Institute Methods for improving performance and temperature robustness of optical coupling between solid state light sensors and optical systems
SE512366C2 (sv) * 1998-07-07 2000-03-06 Ericsson Telefon Ab L M Anordning och metod för montering på mönsterkort för elektronik
DE10062108B4 (de) * 2000-12-13 2010-04-15 Infineon Technologies Ag Leistungsmodul mit verbessertem transienten Wärmewiderstand
DE10126508B4 (de) * 2001-05-30 2008-11-13 Infineon Technologies Ag Vorrichtung mit mittels Spritzgusstechnik verpackten elektronischen Bauteilen, Spritzgusswerkzeug und Verfahren zum Verpacken von elektronischen Bauteilen
US6922272B1 (en) * 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
DE102008005747A1 (de) * 2008-01-24 2009-07-30 Bayerische Motoren Werke Aktiengesellschaft Leistungselektronikmodul

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1121226B (de) * 1960-06-23 1962-01-04 Siemens Ag Halbleiteranordnung
US3248681A (en) * 1962-03-30 1966-04-26 Westinghouse Electric Corp Contacts for semiconductor devices
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3597658A (en) * 1969-11-26 1971-08-03 Rca Corp High current semiconductor device employing a zinc-coated aluminum substrate
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same
US4057825A (en) * 1975-07-18 1977-11-08 Hitachi, Ltd. Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
US4227036A (en) * 1978-09-18 1980-10-07 Microwave Semiconductor Corp. Composite flanged ceramic package for electronic devices
JPS5568661A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Structure for mounting power transistor
DE2853951A1 (de) * 1978-12-14 1980-07-03 Demetron Kontaktplatte fuer halbleiter-bauelemente
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package

Also Published As

Publication number Publication date
JPS57201058A (en) 1982-12-09
US4556899A (en) 1985-12-03
DE3221199C2 (en, 2012) 1988-03-31
DE3221199A1 (de) 1983-01-27

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