JPS60234395A - アルミナ基板への銅めつき方法 - Google Patents

アルミナ基板への銅めつき方法

Info

Publication number
JPS60234395A
JPS60234395A JP9077584A JP9077584A JPS60234395A JP S60234395 A JPS60234395 A JP S60234395A JP 9077584 A JP9077584 A JP 9077584A JP 9077584 A JP9077584 A JP 9077584A JP S60234395 A JPS60234395 A JP S60234395A
Authority
JP
Japan
Prior art keywords
copper plating
alumina substrate
plating
alumina
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9077584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0369191B2 (enrdf_load_stackoverflow
Inventor
重雄 塩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9077584A priority Critical patent/JPS60234395A/ja
Publication of JPS60234395A publication Critical patent/JPS60234395A/ja
Publication of JPH0369191B2 publication Critical patent/JPH0369191B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9077584A 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法 Granted JPS60234395A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9077584A JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9077584A JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Publications (2)

Publication Number Publication Date
JPS60234395A true JPS60234395A (ja) 1985-11-21
JPH0369191B2 JPH0369191B2 (enrdf_load_stackoverflow) 1991-10-31

Family

ID=14007977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9077584A Granted JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Country Status (1)

Country Link
JP (1) JPS60234395A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0708581A3 (en) * 1994-10-18 1997-10-29 At & T Corp Method for depositing a metal stream without current

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152161A (en) * 1979-05-12 1980-11-27 Murata Mfg Co Ltd Thermal treatment of copper coating
JPS58128789A (ja) * 1982-01-27 1983-08-01 株式会社日立製作所 プリント基板の製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152161A (en) * 1979-05-12 1980-11-27 Murata Mfg Co Ltd Thermal treatment of copper coating
JPS58128789A (ja) * 1982-01-27 1983-08-01 株式会社日立製作所 プリント基板の製法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0708581A3 (en) * 1994-10-18 1997-10-29 At & T Corp Method for depositing a metal stream without current

Also Published As

Publication number Publication date
JPH0369191B2 (enrdf_load_stackoverflow) 1991-10-31

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