JPH0369191B2 - - Google Patents

Info

Publication number
JPH0369191B2
JPH0369191B2 JP59090775A JP9077584A JPH0369191B2 JP H0369191 B2 JPH0369191 B2 JP H0369191B2 JP 59090775 A JP59090775 A JP 59090775A JP 9077584 A JP9077584 A JP 9077584A JP H0369191 B2 JPH0369191 B2 JP H0369191B2
Authority
JP
Japan
Prior art keywords
copper plating
plating
alumina substrate
alumina
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59090775A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60234395A (ja
Inventor
Shigeo Shioda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9077584A priority Critical patent/JPS60234395A/ja
Publication of JPS60234395A publication Critical patent/JPS60234395A/ja
Publication of JPH0369191B2 publication Critical patent/JPH0369191B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9077584A 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法 Granted JPS60234395A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9077584A JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9077584A JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Publications (2)

Publication Number Publication Date
JPS60234395A JPS60234395A (ja) 1985-11-21
JPH0369191B2 true JPH0369191B2 (enrdf_load_stackoverflow) 1991-10-31

Family

ID=14007977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9077584A Granted JPS60234395A (ja) 1984-05-07 1984-05-07 アルミナ基板への銅めつき方法

Country Status (1)

Country Link
JP (1) JPS60234395A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524645B1 (en) * 1994-10-18 2003-02-25 Agere Systems Inc. Process for the electroless deposition of metal on a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607026B2 (ja) * 1979-05-12 1985-02-21 株式会社村田製作所 銅被膜の熱処理法
JPS58128789A (ja) * 1982-01-27 1983-08-01 株式会社日立製作所 プリント基板の製法

Also Published As

Publication number Publication date
JPS60234395A (ja) 1985-11-21

Similar Documents

Publication Publication Date Title
JPS5810880B2 (ja) 銅被膜の密着性向上方法
JPS6227393A (ja) セラミツク基材に銅膜を形成する方法
JPH0369191B2 (enrdf_load_stackoverflow)
US3676087A (en) Technique for the fabrication of a photolithographically definable,glass covered gold conductor pattern
JPH10168577A (ja) 成形回路部品などのめっき部品の製法
JPS6347382A (ja) 窒化アルミセラミック配線基板の製法
JPH0297686A (ja) ホウロウ基板の製造方法
JPS63168043A (ja) リ−ドフレ−ム
US5198264A (en) Method for adhering polyimide to a substrate
JPH0297687A (ja) ホウロウ基板の製造方法
JPS6037794A (ja) 印刷配線板の製造方法
JPS63149392A (ja) 電解Ｎｉめつき方法
JPH11193461A (ja) 銅層を有する基材の製造方法
JPH0563108B2 (enrdf_load_stackoverflow)
JPS62172788A (ja) セラミツクス配線基板の製法
JPS6182493A (ja) セラミツク配線基板の製造方法
JPH01235291A (ja) 抵抗体付セラミック回路板の製法
JPS62252343A (ja) ガラスの金属化方法
JPH0263747A (ja) 樹脂被覆金属基体の製造方法およびサーマルヘッドの製造方法
JPS6034094A (ja) 印刷配線板の製造方法
JPS6335484A (ja) セラミツクスの表面粗化法
JPS58104745A (ja) 銅張積層板の製造方法
JPS61243447A (ja) パタ−ン形成方法
JPH0455358B2 (enrdf_load_stackoverflow)
JPH01120855A (ja) リードフレームの製造方法