JPS6156637B2 - - Google Patents

Info

Publication number
JPS6156637B2
JPS6156637B2 JP56135515A JP13551581A JPS6156637B2 JP S6156637 B2 JPS6156637 B2 JP S6156637B2 JP 56135515 A JP56135515 A JP 56135515A JP 13551581 A JP13551581 A JP 13551581A JP S6156637 B2 JPS6156637 B2 JP S6156637B2
Authority
JP
Japan
Prior art keywords
copper
layer
printed circuit
adhesion
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56135515A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128097A (en
Inventor
Toshinori Takagi
Tatsuichiro Nishama
Unosuke Uchida
Junji Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Shingijutsu Kaihatsu Jigyodan
Original Assignee
Sumitomo Bakelite Co Ltd
Shingijutsu Kaihatsu Jigyodan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Shingijutsu Kaihatsu Jigyodan filed Critical Sumitomo Bakelite Co Ltd
Priority to JP13551581A priority Critical patent/JPS57128097A/ja
Publication of JPS57128097A publication Critical patent/JPS57128097A/ja
Publication of JPS6156637B2 publication Critical patent/JPS6156637B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP13551581A 1981-08-31 1981-08-31 Method of producing printed circuit board Granted JPS57128097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13551581A JPS57128097A (en) 1981-08-31 1981-08-31 Method of producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13551581A JPS57128097A (en) 1981-08-31 1981-08-31 Method of producing printed circuit board

Publications (2)

Publication Number Publication Date
JPS57128097A JPS57128097A (en) 1982-08-09
JPS6156637B2 true JPS6156637B2 (enrdf_load_stackoverflow) 1986-12-03

Family

ID=15153560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13551581A Granted JPS57128097A (en) 1981-08-31 1981-08-31 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS57128097A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128593A (ja) * 1984-11-27 1986-06-16 株式会社　麗光 プリント回路用蒸着フイルム
JPS6219778U (enrdf_load_stackoverflow) * 1985-07-19 1987-02-05
JPH0368194A (ja) * 1989-08-05 1991-03-25 Nippon Mektron Ltd 可撓性回路基板に於ける両面導通部の形成法
JPH0368193A (ja) * 1989-08-05 1991-03-25 Nippon Mektron Ltd 可撓性回路基板の両面導通部及びその形成法
JP3447070B2 (ja) * 1992-09-17 2003-09-16 三井化学株式会社 フレキシブル回路基板用材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225868A (en) * 1975-08-20 1977-02-26 Sekisui Chemical Co Ltd Method of producing thermoplastic resin bend

Also Published As

Publication number Publication date
JPS57128097A (en) 1982-08-09

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