JPS60231341A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60231341A
JPS60231341A JP8682584A JP8682584A JPS60231341A JP S60231341 A JPS60231341 A JP S60231341A JP 8682584 A JP8682584 A JP 8682584A JP 8682584 A JP8682584 A JP 8682584A JP S60231341 A JPS60231341 A JP S60231341A
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor device
cap
recess
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8682584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH031835B2 (enrdf_load_html_response
Inventor
Masahide Yamauchi
山内 眞英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8682584A priority Critical patent/JPS60231341A/ja
Publication of JPS60231341A publication Critical patent/JPS60231341A/ja
Publication of JPH031835B2 publication Critical patent/JPH031835B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8682584A 1984-04-27 1984-04-27 半導体装置 Granted JPS60231341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8682584A JPS60231341A (ja) 1984-04-27 1984-04-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8682584A JPS60231341A (ja) 1984-04-27 1984-04-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS60231341A true JPS60231341A (ja) 1985-11-16
JPH031835B2 JPH031835B2 (enrdf_load_html_response) 1991-01-11

Family

ID=13897585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8682584A Granted JPS60231341A (ja) 1984-04-27 1984-04-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS60231341A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPH031835B2 (enrdf_load_html_response) 1991-01-11

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term