JPS60218257A - 保護フイルムの剥離方法 - Google Patents

保護フイルムの剥離方法

Info

Publication number
JPS60218257A
JPS60218257A JP7254684A JP7254684A JPS60218257A JP S60218257 A JPS60218257 A JP S60218257A JP 7254684 A JP7254684 A JP 7254684A JP 7254684 A JP7254684 A JP 7254684A JP S60218257 A JPS60218257 A JP S60218257A
Authority
JP
Japan
Prior art keywords
protective film
adhesive tape
article
peeling
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7254684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319149B2 (enrdf_load_stackoverflow
Inventor
Minoru Ametani
雨谷　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP7254684A priority Critical patent/JPS60218257A/ja
Priority to GB08416030A priority patent/GB2157193B/en
Priority to US06/626,083 priority patent/US4631103A/en
Priority to DE3425192A priority patent/DE3425192C2/de
Priority to FR8410999A priority patent/FR2562528B1/fr
Publication of JPS60218257A publication Critical patent/JPS60218257A/ja
Priority to US06/900,952 priority patent/US4732642A/en
Publication of JPH0319149B2 publication Critical patent/JPH0319149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/20—Separating articles from piles using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP7254684A 1984-04-10 1984-04-10 保護フイルムの剥離方法 Granted JPS60218257A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP7254684A JPS60218257A (ja) 1984-04-10 1984-04-10 保護フイルムの剥離方法
GB08416030A GB2157193B (en) 1984-04-10 1984-06-22 Process for peeling protective film off a thin article
US06/626,083 US4631103A (en) 1984-04-10 1984-06-29 Process for peeling protective film off a thin article
DE3425192A DE3425192C2 (de) 1984-04-10 1984-07-09 Verfahren und Vorrichtung zum Abziehen eines Schutzfilms von einem dünnen Gegenstand
FR8410999A FR2562528B1 (fr) 1984-04-10 1984-07-11 Procede pour decoller un film protecteur d'un objet mince et appareil pour sa mise en oeuvre
US06/900,952 US4732642A (en) 1984-04-10 1986-08-27 Apparatus for peeling protective film off a thin article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7254684A JPS60218257A (ja) 1984-04-10 1984-04-10 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
JPS60218257A true JPS60218257A (ja) 1985-10-31
JPH0319149B2 JPH0319149B2 (enrdf_load_stackoverflow) 1991-03-14

Family

ID=13492460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7254684A Granted JPS60218257A (ja) 1984-04-10 1984-04-10 保護フイルムの剥離方法

Country Status (1)

Country Link
JP (1) JPS60218257A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639122A (ja) * 1986-06-30 1988-01-14 Teikoku Seiki Kk シリコンウエハ−保護用マスキングシ−トの剥離方法
JPS63112361A (ja) * 1986-10-28 1988-05-17 Matsushita Electric Ind Co Ltd カバ−フイルム剥離装置
JPH0429562U (enrdf_load_stackoverflow) * 1990-06-29 1992-03-10
JPH07291521A (ja) * 1994-04-21 1995-11-07 Niyuurongu Seimitsu Kogyo Kk 板材保護フィルム剥離装置
KR20040083579A (ko) * 2003-03-24 2004-10-06 이종수 접착테이프를 이용한 보호필름 제거방법 및 장치
KR100507259B1 (ko) * 1997-06-20 2005-10-24 린텍 가부시키가이샤 시트 박리 장치 및 방법
KR100849699B1 (ko) 2006-09-30 2008-08-01 전익희 인쇄회로기판 보호필름 박리장치
JP2013239509A (ja) * 2012-05-14 2013-11-28 Lintec Corp シート剥離装置及び剥離方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347773A (en) * 1976-10-13 1978-04-28 Hitachi Ltd Peering method for unnecessarily formed layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347773A (en) * 1976-10-13 1978-04-28 Hitachi Ltd Peering method for unnecessarily formed layer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639122A (ja) * 1986-06-30 1988-01-14 Teikoku Seiki Kk シリコンウエハ−保護用マスキングシ−トの剥離方法
JPS63112361A (ja) * 1986-10-28 1988-05-17 Matsushita Electric Ind Co Ltd カバ−フイルム剥離装置
JPH0429562U (enrdf_load_stackoverflow) * 1990-06-29 1992-03-10
JPH07291521A (ja) * 1994-04-21 1995-11-07 Niyuurongu Seimitsu Kogyo Kk 板材保護フィルム剥離装置
KR100507259B1 (ko) * 1997-06-20 2005-10-24 린텍 가부시키가이샤 시트 박리 장치 및 방법
KR20040083579A (ko) * 2003-03-24 2004-10-06 이종수 접착테이프를 이용한 보호필름 제거방법 및 장치
KR100849699B1 (ko) 2006-09-30 2008-08-01 전익희 인쇄회로기판 보호필름 박리장치
JP2013239509A (ja) * 2012-05-14 2013-11-28 Lintec Corp シート剥離装置及び剥離方法

Also Published As

Publication number Publication date
JPH0319149B2 (enrdf_load_stackoverflow) 1991-03-14

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