FR2562528B1 - Procede pour decoller un film protecteur d'un objet mince et appareil pour sa mise en oeuvre - Google Patents

Procede pour decoller un film protecteur d'un objet mince et appareil pour sa mise en oeuvre

Info

Publication number
FR2562528B1
FR2562528B1 FR8410999A FR8410999A FR2562528B1 FR 2562528 B1 FR2562528 B1 FR 2562528B1 FR 8410999 A FR8410999 A FR 8410999A FR 8410999 A FR8410999 A FR 8410999A FR 2562528 B1 FR2562528 B1 FR 2562528B1
Authority
FR
France
Prior art keywords
taking
protective film
thin object
implementing same
implementing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8410999A
Other languages
English (en)
Other versions
FR2562528A1 (fr
Inventor
Keigo Funakoshi
Kozo Nomura
Minoru Ametani
Kenji Ohnishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7254684A external-priority patent/JPS60218257A/ja
Priority claimed from JP10719184A external-priority patent/JPS60250642A/ja
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Publication of FR2562528A1 publication Critical patent/FR2562528A1/fr
Application granted granted Critical
Publication of FR2562528B1 publication Critical patent/FR2562528B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1906—Delaminating means responsive to feed or shape at delamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR8410999A 1984-04-10 1984-07-11 Procede pour decoller un film protecteur d'un objet mince et appareil pour sa mise en oeuvre Expired FR2562528B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7254684A JPS60218257A (ja) 1984-04-10 1984-04-10 保護フイルムの剥離方法
JP10719184A JPS60250642A (ja) 1984-05-25 1984-05-25 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
FR2562528A1 FR2562528A1 (fr) 1985-10-11
FR2562528B1 true FR2562528B1 (fr) 1987-09-04

Family

ID=26413682

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8410999A Expired FR2562528B1 (fr) 1984-04-10 1984-07-11 Procede pour decoller un film protecteur d'un objet mince et appareil pour sa mise en oeuvre

Country Status (4)

Country Link
US (2) US4631103A (fr)
DE (1) DE3425192C2 (fr)
FR (1) FR2562528B1 (fr)
GB (1) GB2157193B (fr)

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ATE116510T1 (de) * 1985-08-16 1995-01-15 Somar Corp Verfahren und vorrichtung zum abziehen eines films.
US4828640A (en) * 1987-05-28 1989-05-09 Mitsui Petrochemical Industries, Ltd. Method of producing films using a peeling jig
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
GB8806292D0 (en) * 1988-03-17 1988-04-13 Automotive Prod Plc Power hydraulic system
US4840694A (en) * 1988-07-18 1989-06-20 Philip Morris Incorporated Methods and apparatus for handling double-sided adhesive tabs
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JP2773320B2 (ja) * 1989-11-20 1998-07-09 ブラザー工業株式会社 印字装置
US5006190A (en) * 1990-02-05 1991-04-09 Motorola, Inc. Film removal method
US5106450A (en) * 1990-12-20 1992-04-21 International Business Machines Corporation Dry film resist transport and lamination system for semiconductor wafers
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
US5318659A (en) * 1992-06-29 1994-06-07 Eastman Kodak Company Apparatus for making a photographic image set
JP3123263B2 (ja) * 1992-11-17 2001-01-09 松下電器産業株式会社 導電膜の貼着状態の良否判定方法
US5658416A (en) * 1994-06-17 1997-08-19 Polaroid Corporation Method and apparatus for peeling a laminate
JPH0853264A (ja) * 1994-08-10 1996-02-27 Seiko Epson Corp 剥離紙付き粘着テープの剥離紙分離構造
EP0848415A1 (fr) * 1995-08-31 1998-06-17 Nitto Denko Corporation Procede et appareil de decollage de la bande de protection adhesive d'une tranche de semi-conducteurs
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
US5830306A (en) * 1996-10-16 1998-11-03 Alcatel Na Cable Systems, Inc. Method and kit for accessing optical fibers in an optical fiber ribbon
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KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
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JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
KR100390450B1 (ko) * 1999-09-20 2003-07-07 앰코 테크놀로지 코리아 주식회사 반도체 패키지의 마크 정착성 테스트 장치 및 방법
KR100386633B1 (ko) * 1999-12-30 2003-06-02 앰코 테크놀로지 코리아 주식회사 반도체칩 부착용 접착부재의 커버 필름 제거장치 및 이를이용한 커버 필름 제거 방법
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JP4538242B2 (ja) * 2004-01-23 2010-09-08 株式会社東芝 剥離装置及び剥離方法
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JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
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JP5977024B2 (ja) * 2011-12-26 2016-08-24 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
CN103863609A (zh) * 2012-12-17 2014-06-18 昆山杰士德精密工业有限公司 自动贴膜机
CN103395508B (zh) * 2013-08-15 2015-06-17 友达光电（苏州）有限公司 贴胶治具
US20150114553A1 (en) * 2013-10-30 2015-04-30 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing glass core
CN104943900B (zh) * 2015-06-23 2017-03-22 广东韦达尔科技有限公司 一种自动贴膜设备
JP6216750B2 (ja) * 2015-08-31 2017-10-18 リンテック株式会社 シート剥離装置および剥離方法
CN105857715B (zh) * 2016-05-31 2018-02-27 江苏杰士德精密工业有限公司 多工位自动化贴膜设备
CN106428749A (zh) * 2016-11-29 2017-02-22 无锡特恒科技有限公司 薄膜的调节机构
CN110697123B (zh) * 2019-10-29 2021-11-09 中山市恺特自动化科技有限公司 贴膜装置、采用该贴膜装置的电视机边框自动贴膜设备
CN110775337B (zh) * 2019-11-04 2021-06-22 深圳市新嘉智诚自动化有限公司 一种张力式贴膜结构及动力电池贴膜机
CN111231295A (zh) * 2020-01-16 2020-06-05 张东亚 一种贴膜定位器
US11130329B2 (en) 2020-02-07 2021-09-28 The Boeing Company Apparatus and method for peeling a liner away from a substrate
CN111453030A (zh) * 2020-04-10 2020-07-28 湖北文理学院 料带自动缠绕装置及加工机床
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TWI793005B (zh) * 2022-05-06 2023-02-11 鴻鉑科技有限公司 薄膜剝離模組（二）
TWI793004B (zh) * 2022-05-06 2023-02-11 鴻鉑科技有限公司 薄膜剝離模組（一）

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Also Published As

Publication number Publication date
US4732642A (en) 1988-03-22
GB2157193B (en) 1987-08-19
GB8416030D0 (en) 1984-07-25
FR2562528A1 (fr) 1985-10-11
US4631103A (en) 1986-12-23
DE3425192A1 (de) 1985-10-24
GB2157193A (en) 1985-10-23
DE3425192C2 (de) 1986-08-07

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