JPS60187537A - エポキシ樹脂積層板の製造法 - Google Patents
エポキシ樹脂積層板の製造法Info
- Publication number
- JPS60187537A JPS60187537A JP59043239A JP4323984A JPS60187537A JP S60187537 A JPS60187537 A JP S60187537A JP 59043239 A JP59043239 A JP 59043239A JP 4323984 A JP4323984 A JP 4323984A JP S60187537 A JPS60187537 A JP S60187537A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- less
- content
- alpha
- diol group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 5
- 229920003986 novolac Polymers 0.000 claims abstract description 4
- 150000002009 diols Chemical group 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000013040 bath agent Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract 2
- 239000002966 varnish Substances 0.000 abstract 2
- 230000032798 delamination Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- -1 enylimidazole Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- XDKUKGIJDNUFGK-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CN=C[N]1 XDKUKGIJDNUFGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012084 conversion product Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/001—Producing wall or panel-like structures, e.g. for hulls, fuselages, or buildings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59043239A JPS60187537A (ja) | 1984-03-07 | 1984-03-07 | エポキシ樹脂積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59043239A JPS60187537A (ja) | 1984-03-07 | 1984-03-07 | エポキシ樹脂積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60187537A true JPS60187537A (ja) | 1985-09-25 |
| JPH0557291B2 JPH0557291B2 (enrdf_load_stackoverflow) | 1993-08-23 |
Family
ID=12658346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59043239A Granted JPS60187537A (ja) | 1984-03-07 | 1984-03-07 | エポキシ樹脂積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60187537A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195934A (ja) * | 1984-10-17 | 1986-05-14 | 東芝ケミカル株式会社 | 銅張積層板 |
| JPS61207424A (ja) * | 1985-03-11 | 1986-09-13 | Sumitomo Chem Co Ltd | 耐薬品性に優れたエポキシ樹脂組成物 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3413320A (en) * | 1960-03-14 | 1968-11-26 | Shell Oil Co | High purity diepoxide |
| JPS509100A (enrdf_load_stackoverflow) * | 1973-05-30 | 1975-01-30 | ||
| JPS543900A (en) * | 1977-06-13 | 1979-01-12 | Mitsubishi Petrochem Co Ltd | Novel alpha-glycol resin composition and its preparation |
| JPS5482100A (en) * | 1977-12-13 | 1979-06-29 | Hitachi Chemical Co Ltd | Preeplague composite mica sheet provided with backing material |
| JPS5490400A (en) * | 1977-12-20 | 1979-07-18 | Shell Int Research | Preparation of polyglycidyl ethers |
| JPS5626961A (en) * | 1979-07-06 | 1981-03-16 | Toyo Seikan Kaisha Ltd | Metal can paint having excellent adhesiveness with time |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
| JPS58141235A (ja) * | 1982-02-15 | 1983-08-22 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| US4412056A (en) * | 1981-12-22 | 1983-10-25 | Shell Oil Company | Polyglycidyl ethers, their preparation and use in curable compositions |
| JPS59184250A (ja) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | 電子部品封止または積層用樹脂組成物 |
| JPS61211345A (ja) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | エポキシ樹脂積層板の製造法 |
| JPS6226649A (ja) * | 1985-07-29 | 1987-02-04 | Mitsubishi Electric Corp | 光学ヘツド装置 |
| JPH0557291A (ja) * | 1991-08-30 | 1993-03-09 | Tokai Univ | ｐＨ調節材及びｐＨ調節装置 |
-
1984
- 1984-03-07 JP JP59043239A patent/JPS60187537A/ja active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3413320A (en) * | 1960-03-14 | 1968-11-26 | Shell Oil Co | High purity diepoxide |
| JPS509100A (enrdf_load_stackoverflow) * | 1973-05-30 | 1975-01-30 | ||
| JPS543900A (en) * | 1977-06-13 | 1979-01-12 | Mitsubishi Petrochem Co Ltd | Novel alpha-glycol resin composition and its preparation |
| JPS5482100A (en) * | 1977-12-13 | 1979-06-29 | Hitachi Chemical Co Ltd | Preeplague composite mica sheet provided with backing material |
| JPS5490400A (en) * | 1977-12-20 | 1979-07-18 | Shell Int Research | Preparation of polyglycidyl ethers |
| JPS5626961A (en) * | 1979-07-06 | 1981-03-16 | Toyo Seikan Kaisha Ltd | Metal can paint having excellent adhesiveness with time |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
| US4412056A (en) * | 1981-12-22 | 1983-10-25 | Shell Oil Company | Polyglycidyl ethers, their preparation and use in curable compositions |
| JPS58141235A (ja) * | 1982-02-15 | 1983-08-22 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| JPS59184250A (ja) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | 電子部品封止または積層用樹脂組成物 |
| JPS61211345A (ja) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | エポキシ樹脂積層板の製造法 |
| JPS6226649A (ja) * | 1985-07-29 | 1987-02-04 | Mitsubishi Electric Corp | 光学ヘツド装置 |
| JPH0557291A (ja) * | 1991-08-30 | 1993-03-09 | Tokai Univ | ｐＨ調節材及びｐＨ調節装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195934A (ja) * | 1984-10-17 | 1986-05-14 | 東芝ケミカル株式会社 | 銅張積層板 |
| JPS61207424A (ja) * | 1985-03-11 | 1986-09-13 | Sumitomo Chem Co Ltd | 耐薬品性に優れたエポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0557291B2 (enrdf_load_stackoverflow) | 1993-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |