JPS60187537A - Preparation of epoxy resin laminate panel - Google Patents

Abstract

PURPOSE:To obtain a laminate panel prevented from the generation of blister and delamination and having excellent heat resistance, by impregnating a base material with varnish which is prepared by dissolving an epoxy resin containing an alpha-diol group in specific content in an org. solvent and, after drying, heating a necessary number of the obtained prepregs under pressure. CONSTITUTION:A base material is impregnated with varnish, which is prepared by dissolving an epoxy resin containing 12 milliequivalent/100g or less of an alpha- diol group in an org. solvent and dried to obtain a prepreg. A necessary number of thus formed prepregs are pressed under heating to prepare an epoxy resin laminate panel. In said epoxy resin, it is pref. that the content of the alpha-diol group is 6 milliequivalent/100g or less, the 30wt% or less of the epoxy resin is a novolac type epoxy resin of which the content of the alpha-diol group is 20 milliequivalent/100g or less and the content of the alpha-diol group in the total epoxy resin is 10 milliequivalent/100g or less.

Description

Detailed Description of the Invention (Industrial Field of Application) Manufacture of epoxy resin laminates which are inventively used as electrical insulating materials for core laminates, copper laminated boards, multilayer printed wiring boards, etc. Regarding the law.

(Prior art) Epoxy resin has mechanical properties, electrical properties, thermal properties,
Because it is superior in various properties such as chemical resistance) adhesiveness,
Widely used in electrical and electronic packaging as a-layer board
Teii.

In such a nuclear laminate, heating process (such as immersion in a hot bath for parts mounting in the wiring board manufacturing process) occurs during the heating process.
As a result, the heat resistance of the nuclear layer plate is significantly reduced due to the moisture absorption under high humidity conditions. It is 11
There are 11 problems (object of the invention) The present invention has been developed in view of the above points, and 1I
Excellent IIIPP property/L-laminated board production ε is the product provided by 0 (Structure of the invention aZ) Unexcusable rJα diol group content: 12 mm/-1 t/
Under ILIOg, epoxy m fat is commonly used as an organic bath additive 6
Using Zetra Fes as the base material, miya immersion, dry preservation, and samurai prepreg, the virgin number of this prepreg is exactly what it is.

to the α diol group.

薯CHn CCHn (R: HXt, 1'7" kill group)
1 Of(OH) Since the reactivity is extremely poor, a constant force P is not easily taken out of the reaction line under heat, so it has a negative influence on the heat resistance. According to the present invention
Epoxy position (amount of α-diol groups in the layer 012 milliequivalents/100 g or less, preferably σ6 milliequivalents/1
00g or less.

As the epoxy resin, poly-rich epoxy resin such as bisphenol A, glycidyl ether type epoxy toilet fat, novolak type epoxy resin, etc. is used.

By using a novolak type epoxy resin with an α/ol content of 20 mm/100 g or less and using 30% by weight or less of the epoxy resin, the crosslinking density is higher than that of the epoxy resin, and the heat resistance is increased. As a hardening agent, an amine thread thickening agent is preferably used, and the weight used is preferably 0.6 to 1.4 equivalent weight relative to the epoxy resin. , dicyandiamide.

Aliphatic polyamines such as diethylene trilamine.

Aromatic polyamines such as metaphenylenediamine and diaminodiphenylmethane, tris (dimethylaminomethyl)
One type or mixture of secondary and triamines such as phenol, etc., is used as the T'L core.

σ, 2 edel 4 methylimidazole 2 as curing accelerator
Imidazoles such as enylimidazole, benzylcymedelamine 2, 6-tertiary amines such as 6-tris(dimethylaminomethyl)phenol, and
Epoxy resin 10 Q @ (Mums hereinafter PJ C)
K N L O, 1 to 1 modulus 7 L) O As the organic bath agent, acetone, methyl ethyl ketone, somemeter formamide, methyl seron le futoluene, xylene, etc. are used. 1Ls inhalation
ff40-80% (1 roe%.

I love IIJJ (below).

The base material, glass cloth or glass moth-free cloth, is impregnated with dry powder at a temperature of 100 to 200°C ['P of 0.5 to
3t13 part 1l) 3t 13 part 1l) 0 prepreg resin molecule, r
So~7o% is good. Furthermore, the pregregs produced by F2 were used at a pressure of 10 to 1 oakg/an', m 16
0 = 180 "C, time 30 ~ ldO minutes heat to the edge D press and produce laminated & 〇-j1! Example 1 (alpha diol 4 milliak / 100 g oil conversion product name) r101j15 methyl Dissolved in a bath of 25 parts of Ethergton, 4 parts of dicyan/amide as a hardening agent, and 50% of nonaluglycol. A glass cloth (manufactured by Nitto Boseki, product name: WE-18W epoxy silane treatment) was coated with resin and dried at 160°C for 5 minutes at 160°C for 5 minutes. ]8
The pressure was 40 kg/af, the temperature was 165°C, the heat of the mouth μσ was 1,6 in 120 minutes, and the temperature was 1.6.
ma+L7) plate thickness of copper clad plate τ was manufactured
5 (A 1 mm test piece was tested and subjected to a pressure cooker treatment (processed in steam at 121°C for the treatment time shown in the attached table) and a heat-resistant pickle (260'C 30 seconds I!II! dipping). .The result is τ force VC.

Ebicor MO+] 1 (α diol 10 milliequivalents/+
00g made by Yuka Shell W4 (trade name) Example 1.2 Ekiko zoom (α diol 19
Milli Touki/iL] Og 7'llll eyes Hischel ■# Song name), Epicote R-601 (α Diol 14 mm Touki/
10 [] Using 100 copies of Mitsui Petrochemical Epoxy (product name), 100 copies were added (same 4M as in 11), prepreg, copper conductor laminate [manufactured] Attachment property γ of IL is in the attached table. show.

Below'1. ′, white (effect of invention) As explained above, due to non-invention! Is it heat resistant? c.
It is possible to make epoxy resin plate.

Claims (1)

[Claims] 1. Content of α-diol group is 12 mm/100 g
In the following, epoxy resin is soaked in a base material using an organic bath agent, dried, and prepared as a prepreg. [) Preparation of numbers] 1 for jEmi. Z An epoxy resin in which the functional at of the α diol group is 6 meq. % or less of α-diol groups is a novolac type epoxy resin with a content of α-diol groups of 20 meq/100g or less, and the content of α-)7′-l groups in the total epoxy resin is 10 meq/100g or less Production method similar to the epoxy*II'tIa layer listed in Category I21I Item 1 mt
A method for producing an epoxy resin laminated M plate according to claim 1, 2 or 3.