JPH0557291B2 - - Google Patents
Info
- Publication number
- JPH0557291B2 JPH0557291B2 JP59043239A JP4323984A JPH0557291B2 JP H0557291 B2 JPH0557291 B2 JP H0557291B2 JP 59043239 A JP59043239 A JP 59043239A JP 4323984 A JP4323984 A JP 4323984A JP H0557291 B2 JPH0557291 B2 JP H0557291B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- content
- producing
- diol
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 150000002009 diols Chemical group 0.000 claims description 5
- 239000002966 varnish Substances 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- DBKWLERLIZHXIJ-UHFFFAOYSA-N 2-ethyl-5-methyl-1h-imidazole;2-phenyl-1h-imidazole Chemical compound CCC1=NC=C(C)N1.C1=CNC(C=2C=CC=CC=2)=N1 DBKWLERLIZHXIJ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940083124 ganglion-blocking antiadrenergic secondary and tertiary amines Drugs 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- MFAQUHXPJRDBSP-UHFFFAOYSA-N n,n-dimethyl-1-phenylmethanamine;2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=CC=C1.CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 MFAQUHXPJRDBSP-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/001—Producing wall or panel-like structures, e.g. for hulls, fuselages, or buildings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
- Epoxy Resins (AREA)
Description
（産業上の利用分野）
本発明は電気絶縁材料である積層板、銅張積層
板および多層印刷配線板等に利用される。エポキ
シ樹脂積層板の製造法に関する。
（従来技術）
エポキシ樹脂は機械的特性、電気的特性、熱的
特性、耐薬品性、接着性等の諸特性において優れ
ているため、積層板として電気および電子分野に
おいて広く利用されている。
このような積層板においてその加工工程で生じ
る加熱工程（配線板製造工程の部品装着のはんだ
浴浸漬等）により積層板のふくれ、はがれが発生
し、加工上での問題点が発生し、さらに高温高湿
下において吸湿させた積層板はその耐熱性が著し
く低下することが問題となつている。
（発明の目的）
本発明はこのような点に鑑みてなされたもの
で、耐熱性に優れる積層板の製造法を提供するも
のである。
（発明の構成）
本発明はαジオール基の含有量が12ミリ当量／
100ｇ以下であるエポキシ樹脂を有機溶剤に溶解
させたワニスを基材に含浸、乾燥させプリプレグ
を得、このプリプレグの必要枚数を加熱加圧する
ことを特徴とするものである。
αジオール基は、
(Industrial Application Field) The present invention is utilized for electrically insulating materials such as laminates, copper-clad laminates, and multilayer printed wiring boards. This invention relates to a method for producing an epoxy resin laminate. (Prior Art) Epoxy resins have excellent properties such as mechanical properties, electrical properties, thermal properties, chemical resistance, and adhesive properties, and are therefore widely used as laminates in the electrical and electronic fields. The heating process that occurs during the processing of such laminates (such as immersion in a solder bath for mounting components in the wiring board manufacturing process) causes the laminate to bulge and peel, causing problems in processing, and furthermore, A problem has been that the heat resistance of laminates that have been allowed to absorb moisture under high humidity conditions is significantly reduced. (Object of the Invention) The present invention has been made in view of the above points, and provides a method for manufacturing a laminate having excellent heat resistance. (Structure of the invention) The present invention has an α-diol group content of 12 milliequivalents/
This method is characterized by impregnating a base material with a varnish made by dissolving 100 g or less of epoxy resin in an organic solvent, drying it to obtain a prepreg, and heating and pressurizing the required number of prepregs. The α diol group is
【式】（Ｒ：Ｈ又はアルキル基）
で示され、反応性が極めて悪いために一定加熱後
では反応系外に取り残されるためその量が耐熱性
に悪影響を与えることを見い出したことにより本
発明はなされたものである。
エポキシ樹脂中のαジオール基の含有量は12ミ
リ当量／100ｇ以下、望ましくは６ミリ当量／100
ｇ以下である。
エポキシ樹脂としてはビスフエノールＡのジグ
リシジルエーテル型エポキシ樹脂、ノボラツク型
エポキシ樹脂等の通常のエポキシ樹脂が使用され
る。
αジオールの含有量が20ミリ当量／100ｇ以下
のノボラツク型エポキシ樹脂をエポキシ樹脂の30
重量％以下使用することによりエポキシ樹脂のよ
り架橋密度が向上し耐熱性に優れた積層板を得る
ことが出来る。
硬化剤としては、アミン系硬化剤が好ましく使
用量は、エポキシ樹脂に対し0.3〜1.4当量が好ま
しい。
アミン系硬化剤としてはジシアンジアミド、ジ
エチレントリアミン等の脂肪族ポリアミン、メタ
フエニレンジアミン、ジアミノジフエニルメタン
等の芳香族ポリアミン、トリス（ジメチルアミノ
メチル）フエノール等の第二、三アミン、等の一
種又は混合物が使用される。
硬化促進剤としては、２エチル４メチルイミダ
ゾール２フエニルイミダゾールのようなイミダゾ
ール類、ベンジルジメチルアミン２，４，６−ト
リス（ジメチルアミノメチル）フエノールのよう
な第３級アミンが使用されエポキシ樹脂100部
（重量部、以下同じ）に対し0.1〜１部配合され
る。
有機溶剤としては、アセトン、メチルエチルケ
トン、ジメチルホルムアミド、メチルセロソルブ
トルエン、キシレン等が使用されワニス中エポキ
シ樹脂の濃度は40〜80％（重量％、以下同じ）が
好ましい。
基材となる紙、ガラス布あるいはガラス不織布
に含浸し、100〜200℃の温度の乾燥装置中で0.5
〜30分間乾燥し、半硬化状態のエポキシ樹脂プリ
プレグを製造する。プリプレグの樹脂分は30〜70
％が好ましい。さらに製造したプリプレグを使用
し圧力10〜100Kg／cm2、温度130〜180℃、時間30
〜180分間加熱加圧し積層板を製造する。
実施例 １
エポキシ樹脂としてはエピコート1001（αジオ
ール４ミリ当量／100ｇ油化シエル(株)製商品名）
を100部メチルエチルケトン25部に溶解した。さ
らに硬化剤としてジシアンジアミド４部をメチル
−グリコール50部に溶解させ、２エチル４メチル
イミダゾールを0.2部添加しワニスとした。この
ワニスに基材であるガラス布（日東紡績(株)製、商
品名WE−18Wエポキシシラン処理）を含浸し樹
脂分38〜42％のプリプレグを130℃５分間乾燥さ
せた。得られたプリプレグ（プリプレグ特性別表
に示す）８枚を用いて常法にしたがい、圧力40
Kg／cm2加熱温度165℃加熱時間120分の条件で1.6
mmの板厚の銅張積層板を製造した。
この銅張り積層板の銅はくをエツチング除去し
50mm×50mmの試験片を作成し、プレツシヤークツ
カー処理（121℃の水蒸気中で別表の処理時間処
理）後はんだ耐熱性試験（260℃30秒浸漬）を行
なつた。その結果を別表に示す。
実施例 ２
エピコート1001（αジオール10ミリ当量／100ｇ
油化シエル(株)製商品名）を使用する以外はすべて
実施例１と同様にしてプリプレグ、銅張り積層板
を製造しその特性を別表に示す。
比較例 １，２
エポキシ樹脂としてエピコート1001（αジオー
ル19ミリ当量／100ｇ油化シエル(株)製商品名）、エ
ピコートＲ−301（αジオール14ミリ当量／100ｇ
三井石油化学エポキシ(株)製商品名）を100部使用
する以外は実施例１と同様にしてプリプレグ、銅
張積層板を製造したそれぞれの特性を別表に示
す。[Formula] (R:H or alkyl group) is represented by R:H or an alkyl group, and due to its extremely poor reactivity, it is left behind outside the reaction system after constant heating, and the amount of it has an adverse effect on heat resistance.The present invention was based on this discovery. It has been announced. The content of α-diol groups in the epoxy resin is 12 meq/100g or less, preferably 6 meq/100g.
g or less. As the epoxy resin, common epoxy resins such as bisphenol A diglycidyl ether type epoxy resin and novolak type epoxy resin are used. A novolak type epoxy resin with an alpha diol content of 20 meq/100g or less is used as an epoxy resin.
By using less than % by weight, the crosslinking density of the epoxy resin is improved and a laminate with excellent heat resistance can be obtained. As the curing agent, an amine curing agent is preferable, and the amount used is preferably 0.3 to 1.4 equivalents based on the epoxy resin. Examples of the amine curing agent include dicyandiamide, aliphatic polyamines such as diethylenetriamine, aromatic polyamines such as metaphenylenediamine and diaminodiphenylmethane, and secondary and tertiary amines such as tris(dimethylaminomethyl)phenol, etc., or a mixture thereof. is used. As curing accelerators, imidazoles such as 2-ethyl-4-methylimidazole-2-phenylimidazole and tertiary amines such as benzyldimethylamine 2,4,6-tris(dimethylaminomethyl)phenol are used. 0.1 to 1 part (by weight, same hereinafter). As the organic solvent, acetone, methyl ethyl ketone, dimethyl formamide, methyl cellosolbutluene, xylene, etc. are used, and the concentration of the epoxy resin in the varnish is preferably 40 to 80% (weight %, the same applies hereinafter). Impregnate paper, glass cloth, or glass nonwoven fabric as a base material, and dry in a drying device at a temperature of 100 to 200°C.
Dry for ~30 minutes to produce a semi-cured epoxy resin prepreg. The resin content of prepreg is 30 to 70
% is preferred. Furthermore, using the prepared prepreg, the pressure was 10 to 100 Kg/ cm2 , the temperature was 130 to 180℃, and the time was 30.
Heat and press for ~180 minutes to produce a laminate. Example 1 The epoxy resin used was Epicote 1001 (4 milliequivalents of α-diol/100 g, trade name manufactured by Yuka Ciel Co., Ltd.)
was dissolved in 25 parts of methyl ethyl ketone. Furthermore, 4 parts of dicyandiamide as a hardening agent was dissolved in 50 parts of methyl glycol, and 0.2 parts of 2-ethyl-4-methylimidazole was added to prepare a varnish. This varnish was impregnated with a glass cloth (manufactured by Nitto Boseki Co., Ltd., trade name: WE-18W epoxy silane treated), and a prepreg with a resin content of 38 to 42% was dried at 130°C for 5 minutes. Using 8 sheets of the obtained prepreg (shown in the attached table of prepreg properties), a pressure of 40
Kg/ cm2 1.6 at heating temperature 165℃ heating time 120 minutes
Copper-clad laminates with a thickness of mm were manufactured. The copper foil of this copper-clad laminate is removed by etching.
A test piece of 50 mm x 50 mm was prepared and subjected to a soldering heat resistance test (immersion at 260° C. for 30 seconds) after being subjected to a pressure vacuum treatment (processing in water vapor at 121° C. for the treatment time shown in the attached table). The results are shown in the attached table. Example 2 Epicote 1001 (α diol 10 meq/100g
A prepreg and a copper-clad laminate were manufactured in the same manner as in Example 1, except that Yuka Ciel Co., Ltd. (trade name) was used, and the properties are shown in the attached table. Comparative Examples 1, 2 Epoxy resins such as Epicote 1001 (trade name manufactured by Yuka Ciel Co., Ltd.), Epicote R-301 (α diol 14 milliequivalents/100 g) were used as epoxy resins.
A prepreg and a copper-clad laminate were manufactured in the same manner as in Example 1 except that 100 parts of Mitsui Petrochemical Epoxy (trade name) manufactured by Mitsui Petrochemicals Epoxy Co., Ltd. were used. The characteristics of each are shown in the attached table.
【表】
（発明の効果）
以上説明したように本発明により耐熱性に優れ
たエポキシ樹脂積層板を製造することが出来る。[Table] (Effects of the Invention) As explained above, according to the present invention, an epoxy resin laminate having excellent heat resistance can be manufactured.
Claims (1)
以下であるエポキシ樹脂を有機溶剤に溶解させた
ワニスを基材に含浸、乾燥させプリプレグを得、
このプリプレグの必要枚数を加熱加圧することを
特徴とするエポキシ樹脂積層板の製造法。 ２ αジオール基の含有量が６ミリ当量／100ｇ
以下であるエポキシ樹脂である特許請求の範囲第
１項記載のエポキシ樹脂積層板の製造法。 ３ エポキシ樹脂の30重量％以下がαジオール基
の含有量が20ミリ当量／100ｇ以下のノボラツク
型エポキシ樹脂で、全エポキシ樹脂中のαジオー
ル基の含有量が10ミリ当量／100ｇ以下である特
許請求の範囲第１項記載のエポキシ樹脂積層板の
製造法。 ４ エポキシ樹脂に、アミン系硬化剤を混合する
特許請求の範囲第１項、第２項又は第３項記載の
エポキシ樹脂積層板の製造法。[Claims] 1. Content of α-diol group is 12 milliequivalents/100g
A prepreg is obtained by impregnating the base material with a varnish made by dissolving the following epoxy resin in an organic solvent and drying it.
A method for producing an epoxy resin laminate, which is characterized by heating and pressing a required number of prepreg sheets. 2 α diol group content is 6 milliequivalents/100g
The method for producing an epoxy resin laminate according to claim 1, wherein the epoxy resin is as follows. 3. A patent in which 30% by weight or less of the epoxy resin is a novolac type epoxy resin in which the content of α-diol groups is 20 meq/100g or less, and the content of α-diol groups in the total epoxy resin is 10 meq/100g or less. A method for producing an epoxy resin laminate according to claim 1. 4. The method for producing an epoxy resin laminate according to claim 1, 2, or 3, which comprises mixing an amine curing agent with the epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59043239A JPS60187537A (en) | 1984-03-07 | 1984-03-07 | Preparation of epoxy resin laminate panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59043239A JPS60187537A (en) | 1984-03-07 | 1984-03-07 | Preparation of epoxy resin laminate panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60187537A JPS60187537A (en) | 1985-09-25 |
| JPH0557291B2 true JPH0557291B2 (en) | 1993-08-23 |
Family
ID=12658346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59043239A Granted JPS60187537A (en) | 1984-03-07 | 1984-03-07 | Preparation of epoxy resin laminate panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60187537A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195934A (en) * | 1984-10-17 | 1986-05-14 | 東芝ケミカル株式会社 | Copper lined laminated board |
| JPS61207424A (en) * | 1985-03-11 | 1986-09-13 | Sumitomo Chem Co Ltd | Epoxy resin composition excellent in chemical resistance |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3413320A (en) * | 1960-03-14 | 1968-11-26 | Shell Oil Co | High purity diepoxide |
| JPS509100A (en) * | 1973-05-30 | 1975-01-30 | ||
| JPS543900A (en) * | 1977-06-13 | 1979-01-12 | Mitsubishi Petrochem Co Ltd | Novel alpha-glycol resin composition and its preparation |
| JPS5482100A (en) * | 1977-12-13 | 1979-06-29 | Hitachi Chemical Co Ltd | Preeplague composite mica sheet provided with backing material |
| JPS5490400A (en) * | 1977-12-20 | 1979-07-18 | Shell Int Research | Preparation of polyglycidyl ethers |
| JPS5626961A (en) * | 1979-07-06 | 1981-03-16 | Toyo Seikan Kaisha Ltd | Metal can paint having excellent adhesiveness with time |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
| JPS58141235A (en) * | 1982-02-15 | 1983-08-22 | Matsushita Electric Works Ltd | Epoxy resin composition |
| US4412056A (en) * | 1981-12-22 | 1983-10-25 | Shell Oil Company | Polyglycidyl ethers, their preparation and use in curable compositions |
| JPS59184250A (en) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | Resin composition for use in laminating or sealing electronic part |
| JPS61211345A (en) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | Production of epoxy resin laminate |
| JPS6226649A (en) * | 1985-07-29 | 1987-02-04 | Mitsubishi Electric Corp | Optical head device |
| JPH0557291A (en) * | 1991-08-30 | 1993-03-09 | Tokai Univ | Ph regulating material and ph regulating device |
-
1984
- 1984-03-07 JP JP59043239A patent/JPS60187537A/en active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3413320A (en) * | 1960-03-14 | 1968-11-26 | Shell Oil Co | High purity diepoxide |
| JPS509100A (en) * | 1973-05-30 | 1975-01-30 | ||
| JPS543900A (en) * | 1977-06-13 | 1979-01-12 | Mitsubishi Petrochem Co Ltd | Novel alpha-glycol resin composition and its preparation |
| JPS5482100A (en) * | 1977-12-13 | 1979-06-29 | Hitachi Chemical Co Ltd | Preeplague composite mica sheet provided with backing material |
| JPS5490400A (en) * | 1977-12-20 | 1979-07-18 | Shell Int Research | Preparation of polyglycidyl ethers |
| JPS5626961A (en) * | 1979-07-06 | 1981-03-16 | Toyo Seikan Kaisha Ltd | Metal can paint having excellent adhesiveness with time |
| JPS5717516A (en) * | 1980-07-08 | 1982-01-29 | Hitachi Ltd | Prepreg sheet for electric insulation |
| US4412056A (en) * | 1981-12-22 | 1983-10-25 | Shell Oil Company | Polyglycidyl ethers, their preparation and use in curable compositions |
| JPS58141235A (en) * | 1982-02-15 | 1983-08-22 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPS59184250A (en) * | 1983-04-04 | 1984-10-19 | Sumitomo Chem Co Ltd | Resin composition for use in laminating or sealing electronic part |
| JPS61211345A (en) * | 1985-03-15 | 1986-09-19 | Hitachi Chem Co Ltd | Production of epoxy resin laminate |
| JPS6226649A (en) * | 1985-07-29 | 1987-02-04 | Mitsubishi Electric Corp | Optical head device |
| JPH0557291A (en) * | 1991-08-30 | 1993-03-09 | Tokai Univ | Ph regulating material and ph regulating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60187537A (en) | 1985-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |