JPH0557291B2 - - Google Patents

Info

Publication number
JPH0557291B2
JPH0557291B2 JP59043239A JP4323984A JPH0557291B2 JP H0557291 B2 JPH0557291 B2 JP H0557291B2 JP 59043239 A JP59043239 A JP 59043239A JP 4323984 A JP4323984 A JP 4323984A JP H0557291 B2 JPH0557291 B2 JP H0557291B2
Authority
JP
Japan
Prior art keywords
epoxy resin
content
producing
diol
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59043239A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60187537A (ja
Inventor
Shunichi Sato
Sunao Watanabe
Shunya Yokozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP59043239A priority Critical patent/JPS60187537A/ja
Publication of JPS60187537A publication Critical patent/JPS60187537A/ja
Publication of JPH0557291B2 publication Critical patent/JPH0557291B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D99/00Subject matter not provided for in other groups of this subclass
    • B29D99/001Producing wall or panel-like structures, e.g. for hulls, fuselages, or buildings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)
  • Epoxy Resins (AREA)
JP59043239A 1984-03-07 1984-03-07 エポキシ樹脂積層板の製造法 Granted JPS60187537A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59043239A JPS60187537A (ja) 1984-03-07 1984-03-07 エポキシ樹脂積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59043239A JPS60187537A (ja) 1984-03-07 1984-03-07 エポキシ樹脂積層板の製造法

Publications (2)

Publication Number Publication Date
JPS60187537A JPS60187537A (ja) 1985-09-25
JPH0557291B2 true JPH0557291B2 (enrdf_load_stackoverflow) 1993-08-23

Family

ID=12658346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59043239A Granted JPS60187537A (ja) 1984-03-07 1984-03-07 エポキシ樹脂積層板の製造法

Country Status (1)

Country Link
JP (1) JPS60187537A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6195934A (ja) * 1984-10-17 1986-05-14 東芝ケミカル株式会社 銅張積層板
JPS61207424A (ja) * 1985-03-11 1986-09-13 Sumitomo Chem Co Ltd 耐薬品性に優れたエポキシ樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413320A (en) * 1960-03-14 1968-11-26 Shell Oil Co High purity diepoxide
JPS549720B2 (enrdf_load_stackoverflow) * 1973-05-30 1979-04-26
JPS543900A (en) * 1977-06-13 1979-01-12 Mitsubishi Petrochem Co Ltd Novel alpha-glycol resin composition and its preparation
JPS5482100A (en) * 1977-12-13 1979-06-29 Hitachi Chemical Co Ltd Preeplague composite mica sheet provided with backing material
BE872673A (nl) * 1977-12-20 1979-06-12 Shell Int Research Werkwijze ter bereiding van polyglycidyl-ethers
JPS5626961A (en) * 1979-07-06 1981-03-16 Toyo Seikan Kaisha Ltd Metal can paint having excellent adhesiveness with time
JPS5717516A (en) * 1980-07-08 1982-01-29 Hitachi Ltd Prepreg sheet for electric insulation
US4412056A (en) * 1981-12-22 1983-10-25 Shell Oil Company Polyglycidyl ethers, their preparation and use in curable compositions
JPS58141235A (ja) * 1982-02-15 1983-08-22 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPS59184250A (ja) * 1983-04-04 1984-10-19 Sumitomo Chem Co Ltd 電子部品封止または積層用樹脂組成物
JPS61211345A (ja) * 1985-03-15 1986-09-19 Hitachi Chem Co Ltd エポキシ樹脂積層板の製造法
JP2600646B2 (ja) * 1985-07-29 1997-04-16 三菱電機株式会社 光学ヘツド装置
JPH0557291A (ja) * 1991-08-30 1993-03-09 Tokai Univ pH調節材及びpH調節装置

Also Published As

Publication number Publication date
JPS60187537A (ja) 1985-09-25

Similar Documents

Publication Publication Date Title
JPS58122927A (ja) プリプレグの製造方法
JPH0557291B2 (enrdf_load_stackoverflow)
JP2734345B2 (ja) 積層板用ガラス繊維不織布の製造法および積層板の製造法
JPH03249274A (ja) ガラス繊維基材およびこのガラス繊維基材を強化材とするガラス繊維強化樹脂積層板
JP4171952B2 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
JPS641511B2 (enrdf_load_stackoverflow)
JPS61211345A (ja) エポキシ樹脂積層板の製造法
JPS6183234A (ja) エポキシ樹脂積層板の製造法
JP3159390B2 (ja) 積層板の製造方法
JP3027385B2 (ja) 積層板用プリプレグ
JPS61215617A (ja) エポキシ樹脂積層板の製造法
JPS6253323A (ja) エポキシ樹脂積層板の製造法
JPS62169828A (ja) プリント回路用基板の製造方法
JPS6360053B2 (enrdf_load_stackoverflow)
JP3529118B2 (ja) エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JPH05147979A (ja) ガラス繊維基材およびそれを用いたガラス繊維強化樹脂積層板
JPS6341937B2 (enrdf_load_stackoverflow)
JPH0818417B2 (ja) エポキシ銅張積層板の製造方法
JPH03252336A (ja) ガラス繊維基材およびこのガラス繊維基材を強化材とするガラス繊維強化樹脂積層板
JPH0145418B2 (enrdf_load_stackoverflow)
JPH04296542A (ja) 積層板の製造方法
JPS6339424B2 (enrdf_load_stackoverflow)
JPH03110145A (ja) 積層板の製造方法
JPH0155659B2 (enrdf_load_stackoverflow)
JPS62260835A (ja) エポキシ樹脂積層板

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term