JPS60167378A - 半導体不揮発性記憶装置 - Google Patents
半導体不揮発性記憶装置Info
- Publication number
- JPS60167378A JPS60167378A JP59272906A JP27290684A JPS60167378A JP S60167378 A JPS60167378 A JP S60167378A JP 59272906 A JP59272906 A JP 59272906A JP 27290684 A JP27290684 A JP 27290684A JP S60167378 A JPS60167378 A JP S60167378A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- mask
- silicon dioxide
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000012535 impurity Substances 0.000 claims abstract description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims 8
- 239000000377 silicon dioxide Substances 0.000 claims 8
- 239000010408 film Substances 0.000 abstract description 47
- 238000004519 manufacturing process Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 18
- 230000003647 oxidation Effects 0.000 abstract description 14
- 238000007254 oxidation reaction Methods 0.000 abstract description 14
- 239000010409 thin film Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 9
- 238000001259 photo etching Methods 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Static Random-Access Memory (AREA)
- Read Only Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59272906A JPS60167378A (ja) | 1984-12-26 | 1984-12-26 | 半導体不揮発性記憶装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59272906A JPS60167378A (ja) | 1984-12-26 | 1984-12-26 | 半導体不揮発性記憶装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7573205A Division JPS5910074B2 (ja) | 1975-08-15 | 1975-08-15 | 半導体不揮発性記憶装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60167378A true JPS60167378A (ja) | 1985-08-30 |
| JPH022311B2 JPH022311B2 (ko) | 1990-01-17 |
Family
ID=17520402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59272906A Granted JPS60167378A (ja) | 1984-12-26 | 1984-12-26 | 半導体不揮発性記憶装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167378A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188976A (en) * | 1990-07-13 | 1993-02-23 | Hitachi, Ltd. | Manufacturing method of non-volatile semiconductor memory device |
| JP2012074708A (ja) * | 1997-08-29 | 2012-04-12 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654614U (ja) * | 1992-12-29 | 1994-07-26 | 東洋運搬機株式会社 | ローラコンベヤの回転ロック装置 |
-
1984
- 1984-12-26 JP JP59272906A patent/JPS60167378A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188976A (en) * | 1990-07-13 | 1993-02-23 | Hitachi, Ltd. | Manufacturing method of non-volatile semiconductor memory device |
| JP2012074708A (ja) * | 1997-08-29 | 2012-04-12 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH022311B2 (ko) | 1990-01-17 |
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