JPS6016451A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPS6016451A
JPS6016451A JP58125301A JP12530183A JPS6016451A JP S6016451 A JPS6016451 A JP S6016451A JP 58125301 A JP58125301 A JP 58125301A JP 12530183 A JP12530183 A JP 12530183A JP S6016451 A JPS6016451 A JP S6016451A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed
semiconductor chip
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58125301A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0433133B2 (Sortimente
Inventor
Hiroyuki Fujii
博之 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP58125301A priority Critical patent/JPS6016451A/ja
Publication of JPS6016451A publication Critical patent/JPS6016451A/ja
Publication of JPH0433133B2 publication Critical patent/JPH0433133B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58125301A 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法 Granted JPS6016451A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58125301A JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58125301A JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6016451A true JPS6016451A (ja) 1985-01-28
JPH0433133B2 JPH0433133B2 (Sortimente) 1992-06-02

Family

ID=14906693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58125301A Granted JPS6016451A (ja) 1983-07-08 1983-07-08 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6016451A (Sortimente)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9562872B2 (en) 2012-05-29 2017-02-07 3M Innovative Properties Company Humidity sensor and sensor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9562872B2 (en) 2012-05-29 2017-02-07 3M Innovative Properties Company Humidity sensor and sensor element

Also Published As

Publication number Publication date
JPH0433133B2 (Sortimente) 1992-06-02

Similar Documents

Publication Publication Date Title
US4507675A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
EP0348361B1 (en) Hollow plastic package for semiconductor devices
JPS63205935A (ja) 放熱板付樹脂封止型半導体装置
US4981776A (en) Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink
JP3893301B2 (ja) 半導体装置の製造方法および半導体モジュールの製造方法
JPS60137042A (ja) 樹脂封止形半導体装置
JPS60137041A (ja) 樹脂封止形半導体装置
JPS6016451A (ja) 樹脂封止型半導体装置の製造方法
JP2001118961A (ja) 樹脂封止型電力用半導体装置及びその製造方法
JP2532826B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6223097Y2 (Sortimente)
JPS63213362A (ja) 樹脂封止型半導体装置
JP2970211B2 (ja) 樹脂封止型半導体装置
JP3350444B2 (ja) 半導体装置の製造方法
JPS5963736A (ja) 樹脂封止型半導体装置の製造方法
JPS61198658A (ja) 樹脂封止型半導体装置
JPS63296345A (ja) フイルムキヤリア
JP2551349B2 (ja) 樹脂封止型半導体装置
JPH08306849A (ja) 放熱部材及び該放熱部材を備えた半導体装置
JPS60110145A (ja) 樹脂封止型半導体装置
JPS60229352A (ja) 樹脂封止形半導体装置および樹脂封止方法
JPH01309337A (ja) 樹脂封止形半導体装置の製造方法
JPH0457104B2 (Sortimente)
JPH03234044A (ja) パッケージの組立方法とパッケージ
JPH06188281A (ja) 半導体パッケージの製造方法