JPS60164388A - フレキシブルプリント基板 - Google Patents
フレキシブルプリント基板Info
- Publication number
- JPS60164388A JPS60164388A JP1838184A JP1838184A JPS60164388A JP S60164388 A JPS60164388 A JP S60164388A JP 1838184 A JP1838184 A JP 1838184A JP 1838184 A JP1838184 A JP 1838184A JP S60164388 A JPS60164388 A JP S60164388A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- film
- printed circuit
- circuit board
- isocyanuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000011342 resin composition Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 241001137219 Zoogoneticus quitzeoensis Species 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1838184A JPS60164388A (ja) | 1984-02-06 | 1984-02-06 | フレキシブルプリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1838184A JPS60164388A (ja) | 1984-02-06 | 1984-02-06 | フレキシブルプリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60164388A true JPS60164388A (ja) | 1985-08-27 |
| JPH0347594B2 JPH0347594B2 (enrdf_load_stackoverflow) | 1991-07-19 |
Family
ID=11970131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1838184A Granted JPS60164388A (ja) | 1984-02-06 | 1984-02-06 | フレキシブルプリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60164388A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04137808U (ja) * | 1991-06-14 | 1992-12-22 | 株式会社日立工機原町 | 超仕上鉋盤における切粉排除装置 |
-
1984
- 1984-02-06 JP JP1838184A patent/JPS60164388A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04137808U (ja) * | 1991-06-14 | 1992-12-22 | 株式会社日立工機原町 | 超仕上鉋盤における切粉排除装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0347594B2 (enrdf_load_stackoverflow) | 1991-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3504500B2 (ja) | 熱硬化性接着剤及びそれを用いたフレキシブル印刷配線板材料 | |
| JP2000501551A (ja) | 導電性反応樹脂混合物 | |
| JPS60164388A (ja) | フレキシブルプリント基板 | |
| JPH04227936A (ja) | ポリイミドフィルムの接着方法及び印刷回路基板 | |
| JPH1046122A (ja) | 接着剤組成物 | |
| JPS60243180A (ja) | フレキシブル印刷回路用基板 | |
| JP4042886B2 (ja) | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料 | |
| JP2003027028A (ja) | 接着剤組成物及びこれを用いたフレキシブル印刷配線用基板、カバーレイフィルム | |
| JPS60164387A (ja) | フレキシブルプリント基板 | |
| JPH02202973A (ja) | フレキシブル印刷配線板用接着剤組成物 | |
| JP3700243B2 (ja) | Ｔａｂ用接着剤付きテープおよび半導体装置 | |
| JP3558139B2 (ja) | 熱硬化性樹脂組成物とその製造方法 | |
| JPS588773A (ja) | 接着用組成物 | |
| KR0181011B1 (ko) | 내열성 접착 테이프용 접착제 조성물 | |
| JPH05239426A (ja) | 接着剤組成物 | |
| JP2001115126A (ja) | 可撓性プリント配線回路用エポキシ樹脂接着剤 | |
| JPH078978B2 (ja) | アクリル系接着剤組成物 | |
| KR100827756B1 (ko) | 열경화성 접착제 및 이것을 사용한 접착체 필름 | |
| JP2799873B2 (ja) | エポキシ樹脂接着剤組成物 | |
| JP3440446B2 (ja) | 導電性ペースト | |
| JPS6056622B2 (ja) | 芳香族ポリアミドイミド積層物 | |
| JP2001139680A (ja) | ポリヒドロキシエーテル、熱硬化性接着剤組成物及び接着剤物品 | |
| JPH0721134B2 (ja) | 電子部品接着用接着剤組成物 | |
| JPH05239183A (ja) | 熱硬化性樹脂 | |
| JPS58175890A (ja) | 可撓性印刷配線基板の製造方法 |