JPS60157243A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60157243A
JPS60157243A JP1371984A JP1371984A JPS60157243A JP S60157243 A JPS60157243 A JP S60157243A JP 1371984 A JP1371984 A JP 1371984A JP 1371984 A JP1371984 A JP 1371984A JP S60157243 A JPS60157243 A JP S60157243A
Authority
JP
Japan
Prior art keywords
electrode
terminals
sealing resin
sealed
external terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1371984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0228261B2 (enrdf_load_stackoverflow
Inventor
Yoshio Takagi
義夫 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1371984A priority Critical patent/JPS60157243A/ja
Publication of JPS60157243A publication Critical patent/JPS60157243A/ja
Publication of JPH0228261B2 publication Critical patent/JPH0228261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1371984A 1984-01-25 1984-01-25 半導体装置 Granted JPS60157243A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1371984A JPS60157243A (ja) 1984-01-25 1984-01-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1371984A JPS60157243A (ja) 1984-01-25 1984-01-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS60157243A true JPS60157243A (ja) 1985-08-17
JPH0228261B2 JPH0228261B2 (enrdf_load_stackoverflow) 1990-06-22

Family

ID=11841048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1371984A Granted JPS60157243A (ja) 1984-01-25 1984-01-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS60157243A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169844U (enrdf_load_stackoverflow) * 1984-10-12 1986-05-13
JPH02114981U (enrdf_load_stackoverflow) * 1989-03-03 1990-09-14
US5285106A (en) * 1990-01-18 1994-02-08 Kabushiki Kaisha Toshiba Semiconductor device parts
WO1998052221A1 (de) * 1997-05-09 1998-11-19 Eupec Europäische Gesellschaft Für Leistungshalbleiter Mbh + Co. Kg Leistungshalbleitermodul mit keramiksubstrat
JP2014143373A (ja) * 2013-01-25 2014-08-07 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
DE112008003425B4 (de) 2007-12-20 2023-08-31 Aisin Aw Co., Ltd. Verfahren zum Herstellen eines Halbleiterbauelements

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192064A (enrdf_load_stackoverflow) * 1975-02-11 1976-08-12
JPS5412386A (en) * 1977-06-28 1979-01-30 Teijin Ltd Isocarbostyril derivative
JPS5435666A (en) * 1977-08-25 1979-03-15 Fujitsu Ltd Timing extraction system
JPS56145850U (enrdf_load_stackoverflow) * 1980-04-02 1981-11-04
JPS57177547A (en) * 1981-04-08 1982-11-01 Thomson Csf Case for middle output semiconductor element and method of producing same
JPS587346A (ja) * 1981-07-07 1983-01-17 株式会社東海理化電機製作所 プラスチツク積層体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192064A (enrdf_load_stackoverflow) * 1975-02-11 1976-08-12
JPS5412386A (en) * 1977-06-28 1979-01-30 Teijin Ltd Isocarbostyril derivative
JPS5435666A (en) * 1977-08-25 1979-03-15 Fujitsu Ltd Timing extraction system
JPS56145850U (enrdf_load_stackoverflow) * 1980-04-02 1981-11-04
JPS57177547A (en) * 1981-04-08 1982-11-01 Thomson Csf Case for middle output semiconductor element and method of producing same
JPS587346A (ja) * 1981-07-07 1983-01-17 株式会社東海理化電機製作所 プラスチツク積層体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169844U (enrdf_load_stackoverflow) * 1984-10-12 1986-05-13
JPH02114981U (enrdf_load_stackoverflow) * 1989-03-03 1990-09-14
US5285106A (en) * 1990-01-18 1994-02-08 Kabushiki Kaisha Toshiba Semiconductor device parts
WO1998052221A1 (de) * 1997-05-09 1998-11-19 Eupec Europäische Gesellschaft Für Leistungshalbleiter Mbh + Co. Kg Leistungshalbleitermodul mit keramiksubstrat
DE112008003425B4 (de) 2007-12-20 2023-08-31 Aisin Aw Co., Ltd. Verfahren zum Herstellen eines Halbleiterbauelements
JP2014143373A (ja) * 2013-01-25 2014-08-07 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0228261B2 (enrdf_load_stackoverflow) 1990-06-22

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