JPS6219063B2 - - Google Patents
Info
- Publication number
- JPS6219063B2 JPS6219063B2 JP57141452A JP14145282A JPS6219063B2 JP S6219063 B2 JPS6219063 B2 JP S6219063B2 JP 57141452 A JP57141452 A JP 57141452A JP 14145282 A JP14145282 A JP 14145282A JP S6219063 B2 JPS6219063 B2 JP S6219063B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- outer container
- gel
- chamber
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57141452A JPS5931044A (ja) | 1982-08-12 | 1982-08-12 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57141452A JPS5931044A (ja) | 1982-08-12 | 1982-08-12 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931044A JPS5931044A (ja) | 1984-02-18 |
| JPS6219063B2 true JPS6219063B2 (enrdf_load_stackoverflow) | 1987-04-25 |
Family
ID=15292236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57141452A Granted JPS5931044A (ja) | 1982-08-12 | 1982-08-12 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931044A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3621994A1 (de) * | 1986-07-01 | 1988-01-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
| JPH01144635A (ja) * | 1987-11-30 | 1989-06-06 | Mitsubishi Electric Corp | 電子部品の固定方法 |
| EP0706221B8 (en) * | 1994-10-07 | 2008-09-03 | Hitachi, Ltd. | Semiconductor device comprising a plurality of semiconductor elements |
| JP2021052094A (ja) | 2019-09-25 | 2021-04-01 | 株式会社ミツバ | ドライバ |
-
1982
- 1982-08-12 JP JP57141452A patent/JPS5931044A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931044A (ja) | 1984-02-18 |
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