JPS5931044A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5931044A
JPS5931044A JP57141452A JP14145282A JPS5931044A JP S5931044 A JPS5931044 A JP S5931044A JP 57141452 A JP57141452 A JP 57141452A JP 14145282 A JP14145282 A JP 14145282A JP S5931044 A JPS5931044 A JP S5931044A
Authority
JP
Japan
Prior art keywords
sealing resin
relief chamber
outer container
gel
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57141452A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219063B2 (enrdf_load_stackoverflow
Inventor
Takayuki Kitamura
北村　孝幸
Shinobu Takahama
忍 高浜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57141452A priority Critical patent/JPS5931044A/ja
Publication of JPS5931044A publication Critical patent/JPS5931044A/ja
Publication of JPS6219063B2 publication Critical patent/JPS6219063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57141452A 1982-08-12 1982-08-12 半導体装置 Granted JPS5931044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57141452A JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57141452A JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS5931044A true JPS5931044A (ja) 1984-02-18
JPS6219063B2 JPS6219063B2 (enrdf_load_stackoverflow) 1987-04-25

Family

ID=15292236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57141452A Granted JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS5931044A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251260A1 (de) * 1986-07-01 1988-01-07 BROWN, BOVERI & CIE Aktiengesellschaft Leistungshalbleitermodul
JPH01144635A (ja) * 1987-11-30 1989-06-06 Mitsubishi Electric Corp 電子部品の固定方法
EP0706221A3 (en) * 1994-10-07 1997-11-05 Hitachi, Ltd. Semiconductor device comprising a plurality of semiconductor elements
WO2021059549A1 (ja) * 2019-09-25 2021-04-01 株式会社ミツバ ドライバ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251260A1 (de) * 1986-07-01 1988-01-07 BROWN, BOVERI & CIE Aktiengesellschaft Leistungshalbleitermodul
JPH01144635A (ja) * 1987-11-30 1989-06-06 Mitsubishi Electric Corp 電子部品の固定方法
EP0706221A3 (en) * 1994-10-07 1997-11-05 Hitachi, Ltd. Semiconductor device comprising a plurality of semiconductor elements
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
WO2021059549A1 (ja) * 2019-09-25 2021-04-01 株式会社ミツバ ドライバ
US11452228B2 (en) 2019-09-25 2022-09-20 Mitsuba Corporation Driver

Also Published As

Publication number Publication date
JPS6219063B2 (enrdf_load_stackoverflow) 1987-04-25

Similar Documents

Publication Publication Date Title
US6261865B1 (en) Multi chip semiconductor package and method of construction
KR100399012B1 (ko) 반도체장치 및 그것의 제조방법
US7569920B2 (en) Electronic component having at least one vertical semiconductor power transistor
US7015587B1 (en) Stacked die package for semiconductor devices
KR970053679A (ko) 리드노출형 반도체 패키지
JP5518789B2 (ja) マルチチップモジュール
KR102172689B1 (ko) 반도체 패키지 및 그 제조방법
JPH0677357A (ja) 改良された半導体パッケージ、集積回路デバイスをパッケージする改良された方法、および半導体デバイスを冷却する方法
EP1703554A2 (en) Power semiconductor module
JPS5931044A (ja) 半導体装置
JPH08213547A (ja) 半導体装置
US8232635B2 (en) Hermetic semiconductor package
USH73H (en) Integrated circuit packages
JPH0228261B2 (enrdf_load_stackoverflow)
JPH047590B2 (enrdf_load_stackoverflow)
JPH0334863B2 (enrdf_load_stackoverflow)
JPS6148947A (ja) 半導体装置
JPH0870066A (ja) 半導体装置
JP2005347390A (ja) 半導体装置およびその製造方法
JPS64812B2 (enrdf_load_stackoverflow)
KR100431501B1 (ko) 고전력 패키지 구조 및 제조 방법
CN117790431A (zh) 一种功率模块的封装结构及其制备方法
JP3348973B2 (ja) 半導体装置
JPS6164144A (ja) 半導体装置
KR900001744B1 (ko) 반도체장치