JPS60157243A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable outside print wiring and the like to be easily performed by a method wherein the upper part of the outer package is provided inside with holes or cutouts so that outer terminals may come into the position securely. CONSTITUTION:An insulation substrate 2 is placed on a heat dissipation plate 1 via solder thin piece. Next, a collector electrode 3C, a base electrode 3B, an emitter electrode 3E are mounted on this insulation substrate 2 via solder thin piece, respectively; further, a transistor element 4 is arranged on the collector electrode 3C via solder thin piece. Then, respective electrodes 3B, 3C, and 3E corresponding to bonding pads on the transistor element 4 are wire-bonded with aluminum wires. The tips of the respective electrodes 3B, 3C, and 3E are bent and raised upward, and are then connected to the outer terminals 9-15 by soldering or the like. In the case of adhering the outer package 5 on the heat dissipation plate 1, the outer terminals 9-15 are inserted into the holes 8. Thereafter, the lower layer inside the package 5 is sealed with a gelled sealing resin 6, and the upper layer with a hardened type sealing resin 7 to fix the terminals 9-15.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to improvements in semiconductor devices used in power semiconductor modules and the like.

[Prior art]

2. Description of the Related Art In recent years, electronic devices have made remarkable progress, and their size and weight are rapidly decreasing. These factors are based on the miniaturization and reliability of semiconductor devices. Among these, applications are becoming more active as medium-capacity power semiconductor devices as the current capacity of transistors increases, and applications are also increasing in the field of power modules that are smaller and lighter.

Konoyo 5 Navawa module's features are its light weight and low price, and for this purpose it is resin-sealed.

A power module incorporates a plurality of semiconductor chips, and the semiconductor chips themselves become larger as the current capacity increases, so the external dimensions are considerably larger than those of conventional resin-sealed semiconductor devices. Recently, 6-element (transistor chip) is used.

A power module with a flywheel diode and a speed-up diode (6 times each chip) has also been put into practical use. For this reason, resin sealing of power modules requires a structure different from conventional ones.

Among these, the biggest problem is that as the external size increases, the volume of resin filled in the container increases, and the temperature rises due to heat generation of the semiconductor chip, which causes distortion due to expansion of the sealing resin and contraction when the temperature drops. may be added to the chip and aluminum wire, causing cracking of the chip and breakage of the aluminum wire.

In order to prevent this, recently the lower layer inside each container is sealed with a gel-like soft resin as an insulating material to surround the chip and aluminum wire, and the upper layer is filled and hardened to make it stronger. The number of double resin-sealed structures that are sealed with an increasingly expensive sealing resin, retains the external terminals pulled out, and mechanically preserves the module is increasing. It is shown in perspective view in Figure 1. FIG. 2 is a sectional view showing an enlarged main part of FIG. 1. These figures show the case of a transistor used in a power module. Reference numeral 1 denotes a heat sink, and an insulating substrate 2 made of alumina material or the like is fixed to the upper surface. On this insulating substrate 2 are a base electrode 3B, a collector electrode 3C, and an emitter electrode 3E.
is fixed. A transistor element 4 is fixed on the collector electrode 3C. Also, from the base electrode 3B to the external terminal 14. It is drawn out to the external terminal 15 from the emitter 4-pole 3E. A base plate 4113B corresponding to the pace bonding butt and the emitter head ink butt on the upper surface of the transistor element 4.

Each emitter voltage ti3B is connected by bonding with an aluminum wire.

Next, the assembly of the above conventional device will be explained.

First, a metallized layer is applied to both sides of the insulating substrate 20 at the required soldering locations. An insulating substrate 2 is placed on a heat sink 1 with a thin solder piece interposed therebetween. Next, the collector kjt413C, the base electric! 3B
, place the emitter electrode 3E.

Furthermore, the transistor element 4 is placed on the collector electrode 3C via a thin solder piece. In this way, the heat sink 1 on which each component is mounted is placed on the heat plate (not shown) of the assembly equipment,
Heat and solder fuse each part. Next, each electrode 3B corresponding to the ponting pad on the upper surface of the transistor element 4
, 3C, and 3E are each wire-pounded using aluminum wire.

The tips of each electrode 3B, 3C, 3 are bent upward and connected to external terminals 9 to 15 of the electrodes by soldering or the like. Next, the outer container 5 is glued onto the heat dissipation plate 1 with adhesive or the like, the lower layer inside the outer container 5 is sealed with a gel-like sealing resin 6 as an insulating material, and the upper layer of the outer container 5 is sealed with each external The product is completed by sealing the terminals 9 to 15 with a hardened sealing resin 1 for fixation.

By the way, the conventional semiconductor device described above has external terminals 9 to 15.
It is very difficult to position the external terminals 9 to 15, and it takes a lot of time to correct the positions of the external terminals 9 to 15. Also, positioning cannot be done without using jigs and tools, which takes a lot of work time. There was a drawback.

[Summary of the invention]

This invention was made in order to eliminate the above-mentioned drawbacks, and by providing a hole or a notch inside the upper part of the outer container to ensure that the external terminal is in a predetermined position. The object of the present invention is to provide a semiconductor device that can be easily printed wiring.

[Embodiment J of the invention This invention will be explained below.

Figures 3 and 4 show an embodiment of the present invention. Figure 3 is a perspective view showing a transistor-powered semiconductor device used in a module, and Figure 4 is an enlarged view of the main parts of Figure 3. FIG.

In these figures, the same reference numerals as in FIGS. 1 and 2 indicate the same parts, and 8 is a hole for ensuring that each external terminal 9 to 15 is positioned at a predetermined position inside the upper part of the outer container 5. A taper is formed downward.

Next, assembly of the above semiconductor device will be explained.

As shown in FIG. 4, an insulating substrate 2 is placed on a heat sink 1 with a thin solder piece interposed therebetween. Next, collector electrode #3C, base electrode 3B, and
An emitter electrode 3E is placed on the emitter electrode 3E, and a transistor element 4 is further placed on the collector electrode 3C via a thin solder piece. Next, each electrode 3B, 3C, 3B corresponding to the ponting pad on the upper surface of the transistor element 4 is wire bonded with an aluminum wire. The tips of each @m3B, 3C, and 3B are bent upward and connected to the external terminals 9 to 15 of each electrode 3B and 30.3H by soldering or the like. Next, when bonding the outer container 5 onto the heat sink 1 with an adhesive or the like, the external terminals 9 to 15 are inserted into the holes 8 of the outer container 5 and then bonded. Thereafter, the gel-like sealing resin 6. is added to the lower layer inside the outer container 5. The upper layer is sealed with a hardened sealing resin T to fix the external terminals 9 to 15 to complete the product.

FIG. 5 is a perspective view of essential parts showing another embodiment of the invention. In this embodiment, a notch 8' is used in place of the hole 8 in the embodiments of FIGS. 3 and 4. The effect is exactly the same as that for hole 8, but the external terminal 14.1
5 is easier to insert through the notch than through the hole 8.

Note that the external terminals 9 to 15 have a circular cross-sectional shape.

Any shape such as a rectangle may be used.

〔Effect of the invention〕

As described above, the present invention provides holes or cutouts for positioning each external terminal at a predetermined position inside the upper part of the semiconductor device, so that each external terminal can be accurately positioned. Therefore, when assembling an inverter set using the power module, it is possible to use printed wiring, etc., and at the same time, the connection of external terminals can be integrated, reducing the number of assembly steps.

, 4. Brief description of the drawings FIGS. 1 and 2 are perspective views showing a conventional semiconductor device, and a sectional view showing an enlarged main part of FIG. 1. FIGS. FIG. 5 is a perspective view showing an embodiment of the present invention and a sectional view showing an enlarged main part of FIG. 3, and FIG. 5 is a perspective view of the main part showing another embodiment of the present invention.

In the figure, 1 is a heat sink, 2 is an insulating substrate, 3B is a base electrode,
3C is a collector electrode, 3B is an emitter electrode, 4 is a transistor element, 5 is an outer container, 6 is a glue-shaped sealing resin, 7 is a hardened sealing resin, 8 is a hole, B is a notch, 9j 10, 11
, 12, 13, 14, and 15 are external terminals.

Note that the same reference numerals in the figures indicate the same or corresponding parts.

Agent: Masuo Oiwa (2 others) Figure 1 1q Figure 2 (3C, 3E) Figure 3 Figure 5 Figure 4

Claims (1)

[Claims] An insulating substrate is fixed on a heat sink, and a few types of electrodes are arranged and fixed on this insulating substrate, and a predetermined W of these electrodes is
A semiconductor chip is mounted on the tax, external terminals are drawn upward from each of the predetermined electrodes, and a glue-like seal is attached to the lower layer of the outer container, which is fixed along the periphery of the heat sink and insulated. In a semiconductor device in which a resin is sealed and the upper layer of the outer container is sealed with a hardened sealing resin for fixing the external terminals, each of the external terminals is positioned at a predetermined position inside the upper part of the outer container. 1. A semiconductor device characterized by having a hole or cutout for the purpose.