JPH0611537Y2 - Resin-sealed electronic circuit device - Google Patents
Resin-sealed electronic circuit deviceInfo
- Publication number
- JPH0611537Y2 JPH0611537Y2 JP1989024568U JP2456889U JPH0611537Y2 JP H0611537 Y2 JPH0611537 Y2 JP H0611537Y2 JP 1989024568 U JP1989024568 U JP 1989024568U JP 2456889 U JP2456889 U JP 2456889U JP H0611537 Y2 JPH0611537 Y2 JP H0611537Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic circuit
- circuit device
- lead
- sealed electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【考案の詳細な説明】 本考案は樹脂封止型電子回路装置、特に充填樹脂のリー
ドにおけるはい上りを制限した樹脂封止型電子回路装置
の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin-sealed electronic circuit device, and more particularly to a structure of a resin-sealed electronic circuit device in which rising of a lead of a filling resin is restricted.
電子回路装置としてモジュールや混成集積回路で配線基
板に構成し、樹脂又は金属の開口部を有する箱状のケー
ス内にその基板を収容し、エポキシ等の樹脂を充填して
封止する構造が知られている。第１図に従来の樹脂封止
型電子回路装置の部分断面構造図を示す。A structure is known in which a circuit board is composed of a module or a hybrid integrated circuit as an electronic circuit device, the board is housed in a box-shaped case having an opening of resin or metal, and a resin such as epoxy is filled and sealed. Has been. FIG. 1 shows a partial cross-sectional structural view of a conventional resin-sealed electronic circuit device.
１は樹脂やセラミックによる配線基板であり、２は基板
１にハンダ付等により実装した部品である。又、基板１
側から外部に導出するリード３は充填樹脂４から外部に
導出される部分において、充填樹脂４のはい上り部Ａを
生ずる。Reference numeral 1 is a wiring board made of resin or ceramic, and 2 is a component mounted on the board 1 by soldering or the like. Also, substrate 1
The lead 3 led out to the outside from the side forms a rising portion A of the filled resin 4 in the portion led out from the filled resin 4.
はい上り部Ａは図の上面側を他の装置等（図示していな
い）に取付ける場合に不都合を生じたり、外観不良等の
要因となる。The ascending portion A causes a problem when the upper surface side of the drawing is attached to another device or the like (not shown) or causes a defective appearance.
本考案は前記せる欠点を解消し、リード部における充填
樹止はい上がりを制限し、外形寸法精度の高い、製作を
容易とする樹脂封止型電子回路装置の提供を目的とす
る。更にリード位置精度の向上を図る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a resin-sealed type electronic circuit device which solves the above-mentioned drawbacks, restricts the rising of the filling resin in the lead portion, has a high external dimension accuracy, and is easy to manufacture. Further, the lead position accuracy is improved.
第２図及び第３図は本考案の実施例を示す斜視構造図、
及び部分断面構造図である。第１図と同一符号は同一部
分をあらわにしており、第２はケース５内に部品２等を
実装した基板１を収容する前の状態すなわち、樹脂を充
填していない状態を示している。第２図、第３図（ａ）
（ｂ）（ｃ）に示すごとく、ガイド６はリード３を貫通
するごとく設ける。そのガイド６のリード３を貫通する
穴はリード３の外周との間に注入される充填樹脂４がは
い上る程度の間隙が設けられる。又、ガイド６は基板１
やケース５などに設置するための脚部７をもっている。
ガイド６及びその脚部７の形状は第３図（ａ）（ｂ）
（ｃ）の実施例に示すように種々の変形を選びうる。2 and 3 are perspective structural views showing an embodiment of the present invention,
FIG. 6 is a partial cross-sectional structure diagram. The same reference numerals as in FIG. 1 represent the same parts, and the second shows the state before housing the substrate 1 on which the components 2 and the like are mounted in the case 5, that is, the state in which the resin is not filled. 2 and 3 (a)
As shown in (b) and (c), the guide 6 is provided so as to penetrate the lead 3. The hole that penetrates the lead 3 of the guide 6 is provided with a gap to the outer periphery of the lead 3 to the extent that the filled resin 4 rises. The guide 6 is the substrate 1
It has legs 7 to be installed on the case 5 and the like.
The shapes of the guide 6 and its leg 7 are shown in FIGS. 3 (a) and 3 (b).
Various modifications can be selected as shown in the embodiment of (c).
これらガイド６の穴とリード３間の間隙に充填樹脂４は
侵入し、はい上り部Ａを形成する。このようにはい上り
部Ａはガイド６の穴の上端部近傍で正確にその高さが制
限される。又、第２図や第３図（ａ）のごとくガイド６
が枠体等によりケース５内に固定される場合、ガイド６
はリード３の位置決めの機能を果し、リード一精度を±
0.2以下に容易になし得る。The filling resin 4 enters the gap between the hole of the guide 6 and the lead 3 to form the rising portion A. Thus, the height of the rising portion A is accurately limited near the upper end of the hole of the guide 6. Further, as shown in FIGS. 2 and 3 (a), the guide 6
When the frame is fixed in the case 5 by a frame or the like, the guide 6
Has the function of positioning the lead 3, and the lead accuracy is ±
It can be easily adjusted to 0.2 or less.
図に示した本考案の実施例について、構造上の変形、各
部への付加、配置等を含む変更があっても本考案の要旨
の範囲で本願に含まれるのは当然である。以上本考案の
実施によって外形寸法精度の高い、製作が容易な樹脂封
止型電子回路装置を得ることができ、産業上の利用効果
大なるものである。It is a matter of course that the embodiment of the present invention shown in the drawings is included in the present application within the scope of the gist of the present invention even if there are structural changes, additions to respective parts, and changes such as arrangement. As described above, by implementing the present invention, it is possible to obtain a resin-sealed type electronic circuit device which has a high external dimension accuracy and is easy to manufacture, which has a great industrial application effect.
第１図は従来装置の部分断面構造図、第２図、第３図は
本考案の実施例を示す斜視構造図、及び部分断面構造図
であり、１は基板、２は部品、３はリード、４は充填樹
脂、５はケース、６はガイド、７は６の脚部、Ａははい
上り部である。FIG. 1 is a partial sectional structural view of a conventional device, FIGS. 2 and 3 are perspective structural views and partial sectional structural views showing an embodiment of the present invention, in which 1 is a substrate, 2 is a component, and 3 is a lead. Reference numeral 4 is a filling resin, 5 is a case, 6 is a guide, 7 is a leg portion of 6, and A is a rising portion.
Claims (1)
容し、樹脂により充填封止した樹脂封止型電子回路装置
において、上方に導出するリードに脚部をもつガイドを
貫通せしめ、該リードと貫通せしめた該ガイドの穴との
間隙に充填樹脂がはい上るようにしたことを特徴とする
樹脂封止型電子回路装置。1. In a resin-sealed electronic circuit device in which a board on which components are mounted is housed in a box-shaped case and filled and sealed with a resin, a lead having a leg portion is passed through a lead extending upward, A resin-sealed electronic circuit device characterized in that a filling resin is allowed to rise in a gap between the lead and a hole of the guide that has been penetrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024568U JPH0611537Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024568U JPH0611537Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02114981U JPH02114981U (en) | 1990-09-14 |
| JPH0611537Y2 true JPH0611537Y2 (en) | 1994-03-23 |
Family
ID=31244524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989024568U Expired - Lifetime JPH0611537Y2 (en) | 1989-03-03 | 1989-03-03 | Resin-sealed electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611537Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157243A (en) * | 1984-01-25 | 1985-08-17 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6238866A (en) * | 1985-08-12 | 1987-02-19 | Sumitomo Electric Ind Ltd | Gasoline suction device |
-
1989
- 1989-03-03 JP JP1989024568U patent/JPH0611537Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157243A (en) * | 1984-01-25 | 1985-08-17 | Mitsubishi Electric Corp | Semiconductor device |
| JPS6238866A (en) * | 1985-08-12 | 1987-02-19 | Sumitomo Electric Ind Ltd | Gasoline suction device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02114981U (en) | 1990-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |