JPH0741177Y2 - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JPH0741177Y2 JPH0741177Y2 JP1989024565U JP2456589U JPH0741177Y2 JP H0741177 Y2 JPH0741177 Y2 JP H0741177Y2 JP 1989024565 U JP1989024565 U JP 1989024565U JP 2456589 U JP2456589 U JP 2456589U JP H0741177 Y2 JPH0741177 Y2 JP H0741177Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic circuit
- circuit device
- leads
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 本考案は電子回路装置の構造、特に、リードを固着した
基板を内蔵せる電子回路装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure of an electronic circuit device, and more particularly, to an electronic circuit device having a built-in substrate to which leads are fixed.
配線基板に能動部品、受動部品等や外部装置接続用のリ
ードを実装した電子回路装置は従来からあり、第１図に
従来装置の部分断面構造図を示す。第１図において、基
板１に部品２（トランスを示す）のリード３を固着する
場合、基板１のスルーホールなどの穴４にリード３を挿
入し、３の先端を基板１の裏面Ａを越えて、突出せし
め、裏面Ａに設けたランド５の部分において、ハンダ付
部６を周知のソルダリング工程により形成して、リード
３を基板１に固着する。第１図においては、電子回路装
置の内、本考案の説明に必要な部分のみを図示し、必要
に応じて設けられるケース、充填樹脂、その他の部品、
構成品等の図示は省略している。第１図に示す従来装置
ではリード３は基板裏面Ａより突出し、更に、ハンダ付
部６により、下方への寸法が増加する。従って、全体の
高さが増し、薄形製品を製作する場合、不利となる。There is a conventional electronic circuit device in which active components, passive components, etc., and leads for connecting an external device are mounted on a wiring board, and FIG. 1 shows a partial sectional structural view of the conventional device. In FIG. 1, when the leads 3 of the component 2 (showing a transformer) are fixed to the substrate 1, the leads 3 are inserted into the holes 4 such as through holes of the substrate 1 and the tip of the 3 is crossed over the back surface A of the substrate 1. Then, the soldered portion 6 is formed in the portion of the land 5 provided on the back surface A by the known soldering process, and the lead 3 is fixed to the substrate 1. In FIG. 1, only a part of the electronic circuit device necessary for explaining the present invention is shown, and a case, a filling resin, other parts, etc., provided as necessary,
Illustration of components and the like is omitted. In the conventional device shown in FIG. 1, the lead 3 projects from the back surface A of the substrate, and the soldered portion 6 increases the downward dimension. Therefore, the overall height is increased, which is disadvantageous when manufacturing a thin product.
本考案は前記せる従来装置の欠点を解消し、簡単な構造
で背の低い薄形の電子回路装置を得ることを目的とす
る。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned drawbacks of the conventional device and to obtain a low profile electronic circuit device having a simple structure.
次に、本考案を図面によって説明する。Next, the present invention will be described with reference to the drawings.
第２図、第３図及び第４図は本考案の実施例を示す電子
回路装置の部分断面構造図であり、第１図と同一符号は
同一部分をあらわす。第２図は部品２がトランスであ
り、リード３が２の下面から導出している。第３図は部
品２が抵抗であり、リード３が軸方向に導出している。
又第４図は外部装置への接続用のリード３が基板１の上
方側に導出している。基板１に挿入されたリード３の先
端は基板１の裏面Ａを越えない程度に配置する。すなわ
ち、リード３の基板１に挿入される部分の長さを基板１
の厚さの１〜1/3程度に選択する。2, 3 and 4 are partial sectional structural views of an electronic circuit device showing an embodiment of the present invention, and the same reference numerals as those in FIG. 1 represent the same parts. In FIG. 2, the component 2 is a transformer, and the lead 3 is led out from the lower surface of 2. In FIG. 3, the component 2 is a resistor and the lead 3 is led out in the axial direction.
Further, in FIG. 4, leads 3 for connecting to an external device are led out to the upper side of the substrate 1. The tips of the leads 3 inserted into the substrate 1 are arranged so as not to exceed the back surface A of the substrate 1. That is, the length of the portion of the lead 3 to be inserted into the substrate 1 is determined by
Select from 1 to 1/3 of the thickness.
リード３挿入後、基板１の表面に設けたランド５とリー
ド３をハンダ付けして、基板１にリード３を固着する。
ハンダ付部６はランド５の部分に形成するが、穴４の内
面等に及んでもよい。しかし裏面Ａから下方に突出する
ことは目的から勘案して好ましくない。このようにし
て、樹脂やセラミック等の配線基板に構成部品やリード
を実装し、必要に応じて、ケースに収容し、エポキシ樹
脂などを注入充填して電子回路装置を構成する。After inserting the leads 3, the lands 5 provided on the surface of the substrate 1 and the leads 3 are soldered to fix the leads 3 to the substrate 1.
The soldered portion 6 is formed on the land 5, but may extend to the inner surface of the hole 4 or the like. However, it is not preferable to project downward from the back surface A in consideration of the purpose. In this way, components and leads are mounted on a wiring board made of resin, ceramics, etc., and if necessary, they are housed in a case and epoxy resin or the like is injected and filled to form an electronic circuit device.
その他、種々の構造上の変形、各部分への付加、配置等
の変更があっても本考案の要旨の範囲で本願に含まれる
のは当然である。Of course, various structural modifications, additions to each part, changes in arrangement, etc. are naturally included in the scope of the present invention within the scope of the gist of the present invention.
以上のごとく、本考案の実施によって、背の低い薄形の
モジュール、混成集積回路等による電子回路装置を提供
することができ、実用上の効果大なるものである。As described above, by implementing the present invention, it is possible to provide an electronic circuit device including a low-profile thin module, a hybrid integrated circuit, and the like, which is a great practical effect.
第１図は従来装置の部分断面構造図、第２図、第３図、
第４図は本考案の実施例を示す部分断面構造図であり、
１は基板、２は部品、３はリード、４穴、５はランド、
６はハンダ付部、Ａは１の裏面、Ｂは１の表面である。FIG. 1 is a partial sectional structural view of a conventional device, FIG. 2, FIG.
FIG. 4 is a partial sectional structural view showing an embodiment of the present invention.
1 is a substrate, 2 is a component, 3 is a lead, 4 holes, 5 is a land,
6 is a soldered portion, A is a back surface of 1, and B is a front surface of 1.
Claims (1)
配線基板において、前記基板表面より電子部品を挿入し
かつ、前記電子部品のリードは前記基板の裏面を越えな
いような長さにし、かつ前記リードは基板表面からはん
だづけするようにしたことを特徴とする電子回路装置。1. A printed wiring board having a cylindrical hole into which an electronic component is inserted, wherein the electronic component is inserted from the front surface of the substrate and the lead of the electronic component has a length that does not extend beyond the back surface of the substrate. The electronic circuit device is characterized in that the leads are soldered from the surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024565U JPH0741177Y2 (en) | 1989-03-03 | 1989-03-03 | Electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024565U JPH0741177Y2 (en) | 1989-03-03 | 1989-03-03 | Electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02114963U JPH02114963U (en) | 1990-09-14 |
| JPH0741177Y2 true JPH0741177Y2 (en) | 1995-09-20 |
Family
ID=31244519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989024565U Expired - Lifetime JPH0741177Y2 (en) | 1989-03-03 | 1989-03-03 | Electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741177Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62229896A (en) * | 1986-03-29 | 1987-10-08 | 株式会社東芝 | Printed wiring board |
| JPS63155669U (en) * | 1987-03-30 | 1988-10-12 |
-
1989
- 1989-03-03 JP JP1989024565U patent/JPH0741177Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02114963U (en) | 1990-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |