JPH01156580U - - Google Patents
Info
- Publication number
- JPH01156580U JPH01156580U JP5425188U JP5425188U JPH01156580U JP H01156580 U JPH01156580 U JP H01156580U JP 5425188 U JP5425188 U JP 5425188U JP 5425188 U JP5425188 U JP 5425188U JP H01156580 U JPH01156580 U JP H01156580U
- Authority
- JP
- Japan
- Prior art keywords
- attachment
- integrated circuit
- components
- attached
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図および第２図は本考案の一実施例を示す
図、第３図は本考案の他の実施例を示す図、第４
図は本考案の一実施例の集積回路装置のアタツチ
メント台への取付けを説明する図、第５図は本考
案の他の実施例の集積回路装置の取付けを説明す
る図、第６図は本考案の集積回路実装用アタツチ
メントのプリント基板７への実装例を示す図、第
７図は従来のプリント基板実装例を示す図である
。
１……アタツチメント台、２……アタツチメン
ト支柱、３……ハンダ付け孔、４……銅箔、５…
…集積回路、６……リードピン、７……プリント
基板、８……その他部品。
1 and 2 are views showing one embodiment of the present invention, FIG. 3 is a view showing another embodiment of the present invention, and FIG. 4 is a view showing another embodiment of the present invention.
The figure is a diagram explaining the attachment of an integrated circuit device according to one embodiment of the present invention to an attachment stand, FIG. 5 is a diagram explaining the attachment of an integrated circuit device according to another embodiment of the present invention, and FIG. FIG. 7 is a diagram showing an example of mounting the invented integrated circuit mounting attachment on a printed circuit board 7, and FIG. 7 is a diagram showing an example of conventional printed circuit board mounting. 1... Attachment stand, 2... Attachment post, 3... Soldering hole, 4... Copper foil, 5...
...Integrated circuit, 6...Lead pin, 7...Printed circuit board, 8...Other parts.
Claims (1)
リント基板の該部品の取り付けられていない部分
に固着し、該部品の高さより高くのびるアタツチ
メント支柱と、該アタツチメント支柱に固着して
該部品上を延在するアタツチメント台とを具備し
、該アタツチメント台に集積回路装置を取り付け
たことを特徴とする集積回路装置の実装構造。 A printed circuit board to which a plurality of components are attached; an attachment column that is fixed to a portion of the printed circuit board where the components are not attached and extends higher than the height of the components; and an attachment column that is fixed to the attachment column and extends above the component. 1. A mounting structure for an integrated circuit device, characterized in that the integrated circuit device is provided with an attachment stand, and an integrated circuit device is attached to the attachment stand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425188U JPH01156580U (en) | 1988-04-21 | 1988-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5425188U JPH01156580U (en) | 1988-04-21 | 1988-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156580U true JPH01156580U (en) | 1989-10-27 |
Family
ID=31280187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5425188U Pending JPH01156580U (en) | 1988-04-21 | 1988-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156580U (en) |
-
1988
- 1988-04-21 JP JP5425188U patent/JPH01156580U/ja active Pending
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