JPS61179771U - - Google Patents

Info

Publication number
JPS61179771U
JPS61179771U JP6270285U JP6270285U JPS61179771U JP S61179771 U JPS61179771 U JP S61179771U JP 6270285 U JP6270285 U JP 6270285U JP 6270285 U JP6270285 U JP 6270285U JP S61179771 U JPS61179771 U JP S61179771U
Authority
JP
Japan
Prior art keywords
circuit board
soldering
printed circuit
electronic components
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6270285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6270285U priority Critical patent/JPS61179771U/ja
Publication of JPS61179771U publication Critical patent/JPS61179771U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す図、第2図は
その一部拡大図、第3図は本考案の説明図、第4
図はプリント基板に対する電子部品の従来の半田
付け構造を示す図、第5図はその一部拡大図であ
る。 1……枠部材、2……プリント基板、3a〜3
f……半田付けパターン部、4a〜4c……チツ
プ部品、6a〜6f……切欠き。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a partially enlarged view thereof, Fig. 3 is an explanatory diagram of the present invention, and Fig. 4 is a diagram showing an embodiment of the present invention.
The figure shows a conventional soldering structure for electronic components to a printed circuit board, and FIG. 5 is a partially enlarged view. 1...Frame member, 2...Printed circuit board, 3a-3
f... Soldering pattern portion, 4a to 4c... Chip parts, 6a to 6f... Notch.

Claims (1)

【実用新案登録請求の範囲】 (1) プリント基板上の電子部品の半田付けパタ
ーン部と上記基板の支持部材との間の基板部を切
欠いたことを特徴とするプリント基板に対する電
子部品の半田付け構造。 (2) 前記切欠きが複数個所前記基板部に設けら
れた実用新案登録請求の範囲第1項記載のプリン
ト基板に対する電子部品の半田付け構造。
[Claims for Utility Model Registration] (1) Soldering of electronic components to a printed circuit board, characterized in that the circuit board section between the soldering pattern section of the electronic component on the printed circuit board and the supporting member of the circuit board is cut out. structure. (2) A structure for soldering electronic components to a printed circuit board according to claim 1, wherein the notches are provided in a plurality of places on the circuit board.
JP6270285U 1985-04-26 1985-04-26 Pending JPS61179771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6270285U JPS61179771U (en) 1985-04-26 1985-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6270285U JPS61179771U (en) 1985-04-26 1985-04-26

Publications (1)

Publication Number Publication Date
JPS61179771U true JPS61179771U (en) 1986-11-10

Family

ID=30592166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6270285U Pending JPS61179771U (en) 1985-04-26 1985-04-26

Country Status (1)

Country Link
JP (1) JPS61179771U (en)

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