JPS60149195A - プリント配線基板の製造方法 - Google Patents
プリント配線基板の製造方法Info
- Publication number
- JPS60149195A JPS60149195A JP522584A JP522584A JPS60149195A JP S60149195 A JPS60149195 A JP S60149195A JP 522584 A JP522584 A JP 522584A JP 522584 A JP522584 A JP 522584A JP S60149195 A JPS60149195 A JP S60149195A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- wall surface
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 14
- 239000004020 conductor Substances 0.000 claims description 17
- 238000007772 electroless plating Methods 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 24
- 238000007747 plating Methods 0.000 description 13
- 239000000047 product Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000005530 etching Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522584A JPS60149195A (ja) | 1984-01-13 | 1984-01-13 | プリント配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522584A JPS60149195A (ja) | 1984-01-13 | 1984-01-13 | プリント配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60149195A true JPS60149195A (ja) | 1985-08-06 |
| JPH0336319B2 JPH0336319B2 (enrdf_load_stackoverflow) | 1991-05-31 |
Family
ID=11605245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP522584A Granted JPS60149195A (ja) | 1984-01-13 | 1984-01-13 | プリント配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149195A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62169493A (ja) * | 1986-01-22 | 1987-07-25 | 株式会社日立製作所 | プリント配線板の製造方法 |
| JPS62189791A (ja) * | 1986-02-15 | 1987-08-19 | 株式会社日立製作所 | 配線板 |
| JP2011134681A (ja) * | 2009-12-25 | 2011-07-07 | Panasonic Electric Works Co Ltd | オス型コネクタブロック及びメス型コネクタブロック及びコネクタ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715495A (en) * | 1980-07-01 | 1982-01-26 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
| JPS5766696A (en) * | 1980-10-13 | 1982-04-22 | Kanto Kasei Kogyo | Method of producing printed circuit board |
-
1984
- 1984-01-13 JP JP522584A patent/JPS60149195A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715495A (en) * | 1980-07-01 | 1982-01-26 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
| JPS5766696A (en) * | 1980-10-13 | 1982-04-22 | Kanto Kasei Kogyo | Method of producing printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62169493A (ja) * | 1986-01-22 | 1987-07-25 | 株式会社日立製作所 | プリント配線板の製造方法 |
| JPS62189791A (ja) * | 1986-02-15 | 1987-08-19 | 株式会社日立製作所 | 配線板 |
| JP2011134681A (ja) * | 2009-12-25 | 2011-07-07 | Panasonic Electric Works Co Ltd | オス型コネクタブロック及びメス型コネクタブロック及びコネクタ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0336319B2 (enrdf_load_stackoverflow) | 1991-05-31 |
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