JPS60124960A - 半導体素子結線用線 - Google Patents

半導体素子結線用線

Info

Publication number
JPS60124960A
JPS60124960A JP58233353A JP23335383A JPS60124960A JP S60124960 A JPS60124960 A JP S60124960A JP 58233353 A JP58233353 A JP 58233353A JP 23335383 A JP23335383 A JP 23335383A JP S60124960 A JPS60124960 A JP S60124960A
Authority
JP
Japan
Prior art keywords
wire
copper
ball
purity
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58233353A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216580B2 (index.php
Inventor
Kazuo Sawada
澤田　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58233353A priority Critical patent/JPS60124960A/ja
Publication of JPS60124960A publication Critical patent/JPS60124960A/ja
Publication of JPH0216580B2 publication Critical patent/JPH0216580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP58233353A 1983-12-09 1983-12-09 半導体素子結線用線 Granted JPS60124960A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58233353A JPS60124960A (ja) 1983-12-09 1983-12-09 半導体素子結線用線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58233353A JPS60124960A (ja) 1983-12-09 1983-12-09 半導体素子結線用線

Publications (2)

Publication Number Publication Date
JPS60124960A true JPS60124960A (ja) 1985-07-04
JPH0216580B2 JPH0216580B2 (index.php) 1990-04-17

Family

ID=16953814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58233353A Granted JPS60124960A (ja) 1983-12-09 1983-12-09 半導体素子結線用線

Country Status (1)

Country Link
JP (1) JPS60124960A (index.php)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS6120694A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS6152333A (ja) * 1984-08-21 1986-03-15 Toshiba Corp ボンデイングワイヤ−
JPS61258463A (ja) * 1985-05-13 1986-11-15 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS61259555A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンデイングワイヤ
JPS62256927A (ja) * 1986-04-30 1987-11-09 Kobe Steel Ltd 銅又は銅合金細線及びその製造方法
JPS633424A (ja) * 1986-06-24 1988-01-08 Tatsuta Electric Wire & Cable Co Ltd 配線性に優れた半導体素子用銅ボンディング線の製造方法
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
WO2015022837A1 (ja) * 2013-08-12 2015-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子およびバスバー

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS6120694A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS6152333A (ja) * 1984-08-21 1986-03-15 Toshiba Corp ボンデイングワイヤ−
JPS61258463A (ja) * 1985-05-13 1986-11-15 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS61259555A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンデイングワイヤ
JPS62256927A (ja) * 1986-04-30 1987-11-09 Kobe Steel Ltd 銅又は銅合金細線及びその製造方法
JPS633424A (ja) * 1986-06-24 1988-01-08 Tatsuta Electric Wire & Cable Co Ltd 配線性に優れた半導体素子用銅ボンディング線の製造方法
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
WO2015022837A1 (ja) * 2013-08-12 2015-02-19 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子およびバスバー
CN105452502A (zh) * 2013-08-12 2016-03-30 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金薄板、电子电气设备用零件、端子及母线
US10392680B2 (en) 2013-08-12 2019-08-27 Mitsubishi Materials Corporation Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar

Also Published As

Publication number Publication date
JPH0216580B2 (index.php) 1990-04-17

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