JPS60121749A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS60121749A
JPS60121749A JP59152894A JP15289484A JPS60121749A JP S60121749 A JPS60121749 A JP S60121749A JP 59152894 A JP59152894 A JP 59152894A JP 15289484 A JP15289484 A JP 15289484A JP S60121749 A JPS60121749 A JP S60121749A
Authority
JP
Japan
Prior art keywords
tab
lead
leads
frame
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59152894A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470778B2 (enExample
Inventor
Keizo Otsuki
大槻　桂三
Hidetoshi Mochizuki
秀俊 望月
Akira Suzuki
明 鈴木
Yoshio Adachi
足達　嘉雄
Hideki Kosaka
小坂　秀樹
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59152894A priority Critical patent/JPS60121749A/ja
Publication of JPS60121749A publication Critical patent/JPS60121749A/ja
Publication of JPH0470778B2 publication Critical patent/JPH0470778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59152894A 1984-07-25 1984-07-25 リ−ドフレ−ム Granted JPS60121749A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59152894A JPS60121749A (ja) 1984-07-25 1984-07-25 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59152894A JPS60121749A (ja) 1984-07-25 1984-07-25 リ−ドフレ−ム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9360778A Division JPS5521128A (en) 1978-08-02 1978-08-02 Lead frame used for semiconductor device and its assembling

Publications (2)

Publication Number Publication Date
JPS60121749A true JPS60121749A (ja) 1985-06-29
JPH0470778B2 JPH0470778B2 (enExample) 1992-11-11

Family

ID=15550451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59152894A Granted JPS60121749A (ja) 1984-07-25 1984-07-25 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS60121749A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100312A (ja) * 2004-09-28 2006-04-13 Fuji Electric Device Technology Co Ltd 光半導体装置および測距モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100312A (ja) * 2004-09-28 2006-04-13 Fuji Electric Device Technology Co Ltd 光半導体装置および測距モジュール

Also Published As

Publication number Publication date
JPH0470778B2 (enExample) 1992-11-11

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