JPS60121728A - 半導体装置用樹脂封止金型 - Google Patents

半導体装置用樹脂封止金型

Info

Publication number
JPS60121728A
JPS60121728A JP22970183A JP22970183A JPS60121728A JP S60121728 A JPS60121728 A JP S60121728A JP 22970183 A JP22970183 A JP 22970183A JP 22970183 A JP22970183 A JP 22970183A JP S60121728 A JPS60121728 A JP S60121728A
Authority
JP
Japan
Prior art keywords
resin
mold
cavity
semiconductor device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22970183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH043106B2 (enrdf_load_stackoverflow
Inventor
Hidemi Mori
森　秀美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22970183A priority Critical patent/JPS60121728A/ja
Publication of JPS60121728A publication Critical patent/JPS60121728A/ja
Publication of JPH043106B2 publication Critical patent/JPH043106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP22970183A 1983-12-05 1983-12-05 半導体装置用樹脂封止金型 Granted JPS60121728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22970183A JPS60121728A (ja) 1983-12-05 1983-12-05 半導体装置用樹脂封止金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22970183A JPS60121728A (ja) 1983-12-05 1983-12-05 半導体装置用樹脂封止金型

Publications (2)

Publication Number Publication Date
JPS60121728A true JPS60121728A (ja) 1985-06-29
JPH043106B2 JPH043106B2 (enrdf_load_stackoverflow) 1992-01-22

Family

ID=16896341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22970183A Granted JPS60121728A (ja) 1983-12-05 1983-12-05 半導体装置用樹脂封止金型

Country Status (1)

Country Link
JP (1) JPS60121728A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290491A (ja) * 1994-04-27 1995-11-07 Nec Corp モールド金型

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839889U (ja) * 1981-09-10 1983-03-16 株式会社パイロット 万年筆

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839889U (ja) * 1981-09-10 1983-03-16 株式会社パイロット 万年筆

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290491A (ja) * 1994-04-27 1995-11-07 Nec Corp モールド金型

Also Published As

Publication number Publication date
JPH043106B2 (enrdf_load_stackoverflow) 1992-01-22

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