JPS60111448A - リ−ドフレ−ム材料 - Google Patents

リ−ドフレ−ム材料

Info

Publication number
JPS60111448A
JPS60111448A JP21907083A JP21907083A JPS60111448A JP S60111448 A JPS60111448 A JP S60111448A JP 21907083 A JP21907083 A JP 21907083A JP 21907083 A JP21907083 A JP 21907083A JP S60111448 A JPS60111448 A JP S60111448A
Authority
JP
Japan
Prior art keywords
resin
oxide film
alloy
thickness
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21907083A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523064B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Tsutomu Inui
乾　勉
Kazu Sasaki
計 佐々木
Daiji Sakamoto
坂本　大司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP21907083A priority Critical patent/JPS60111448A/ja
Publication of JPS60111448A publication Critical patent/JPS60111448A/ja
Publication of JPH0523064B2 publication Critical patent/JPH0523064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49586—Insulating layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21907083A 1983-11-21 1983-11-21 リ−ドフレ−ム材料 Granted JPS60111448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21907083A JPS60111448A (ja) 1983-11-21 1983-11-21 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21907083A JPS60111448A (ja) 1983-11-21 1983-11-21 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS60111448A true JPS60111448A (ja) 1985-06-17
JPH0523064B2 JPH0523064B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-31

Family

ID=16729793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21907083A Granted JPS60111448A (ja) 1983-11-21 1983-11-21 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS60111448A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228213A (ja) * 1985-04-01 1986-10-11 Matsushita Electric Ind Co Ltd 燃焼装置
JPS6235548A (ja) * 1985-08-08 1987-02-16 Sumitomo Electric Ind Ltd リ−ドフレ−ム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825618A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-08-06 1973-04-03
JPS53149810A (en) * 1977-05-04 1978-12-27 Hitachi Metals Ltd Alloy for sealing glass
JPS55122855A (en) * 1979-03-12 1980-09-20 Daido Steel Co Ltd High strength low thermal expansion alloy
JPS5842758A (ja) * 1981-09-07 1983-03-12 Daido Steel Co Ltd 封着用合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825618A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-08-06 1973-04-03
JPS53149810A (en) * 1977-05-04 1978-12-27 Hitachi Metals Ltd Alloy for sealing glass
JPS55122855A (en) * 1979-03-12 1980-09-20 Daido Steel Co Ltd High strength low thermal expansion alloy
JPS5842758A (ja) * 1981-09-07 1983-03-12 Daido Steel Co Ltd 封着用合金

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228213A (ja) * 1985-04-01 1986-10-11 Matsushita Electric Ind Co Ltd 燃焼装置
JPS6235548A (ja) * 1985-08-08 1987-02-16 Sumitomo Electric Ind Ltd リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH0523064B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-31

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