JPS60106187A - 両面スルホ−ルフレキシブル印刷配線板 - Google Patents
両面スルホ−ルフレキシブル印刷配線板Info
- Publication number
- JPS60106187A JPS60106187A JP21547383A JP21547383A JPS60106187A JP S60106187 A JPS60106187 A JP S60106187A JP 21547383 A JP21547383 A JP 21547383A JP 21547383 A JP21547383 A JP 21547383A JP S60106187 A JPS60106187 A JP S60106187A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed wiring
- hole
- wiring board
- coverlay film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012787 coverlay film Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21547383A JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21547383A JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60106187A true JPS60106187A (ja) | 1985-06-11 |
JPH0422036B2 JPH0422036B2 (enrdf_load_html_response) | 1992-04-15 |
Family
ID=16672950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21547383A Granted JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106187A (enrdf_load_html_response) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216666A (ja) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | 電子機器 |
JP2018107209A (ja) * | 2016-12-22 | 2018-07-05 | 日本メクトロン株式会社 | 伸縮性配線基板及び伸縮性基板の製造方法 |
JP2022050595A (ja) * | 2020-02-03 | 2022-03-30 | 大日本印刷株式会社 | 貫通電極基板 |
-
1983
- 1983-11-15 JP JP21547383A patent/JPS60106187A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216666A (ja) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | 電子機器 |
JP2018107209A (ja) * | 2016-12-22 | 2018-07-05 | 日本メクトロン株式会社 | 伸縮性配線基板及び伸縮性基板の製造方法 |
JP2022050595A (ja) * | 2020-02-03 | 2022-03-30 | 大日本印刷株式会社 | 貫通電極基板 |
Also Published As
Publication number | Publication date |
---|---|
JPH0422036B2 (enrdf_load_html_response) | 1992-04-15 |
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