JPH0422036B2 - - Google Patents
Info
- Publication number
- JPH0422036B2 JPH0422036B2 JP21547383A JP21547383A JPH0422036B2 JP H0422036 B2 JPH0422036 B2 JP H0422036B2 JP 21547383 A JP21547383 A JP 21547383A JP 21547383 A JP21547383 A JP 21547383A JP H0422036 B2 JPH0422036 B2 JP H0422036B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- wiring board
- flexible printed
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012787 coverlay film Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21547383A JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21547383A JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60106187A JPS60106187A (ja) | 1985-06-11 |
| JPH0422036B2 true JPH0422036B2 (enrdf_load_html_response) | 1992-04-15 |
Family
ID=16672950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21547383A Granted JPS60106187A (ja) | 1983-11-15 | 1983-11-15 | 両面スルホ−ルフレキシブル印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60106187A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5161994B2 (ja) * | 2011-03-31 | 2013-03-13 | 株式会社東芝 | 電子機器 |
| JP6691474B2 (ja) * | 2016-12-22 | 2020-04-28 | 日本メクトロン株式会社 | 伸縮性配線基板及び伸縮性基板の製造方法 |
| JP7010314B2 (ja) * | 2020-02-03 | 2022-01-26 | 大日本印刷株式会社 | 貫通電極基板 |
-
1983
- 1983-11-15 JP JP21547383A patent/JPS60106187A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60106187A (ja) | 1985-06-11 |
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