JPS60105260A - 小型電子部品用搬送体の構造 - Google Patents

小型電子部品用搬送体の構造

Info

Publication number
JPS60105260A
JPS60105260A JP21309483A JP21309483A JPS60105260A JP S60105260 A JPS60105260 A JP S60105260A JP 21309483 A JP21309483 A JP 21309483A JP 21309483 A JP21309483 A JP 21309483A JP S60105260 A JPS60105260 A JP S60105260A
Authority
JP
Japan
Prior art keywords
carrier
tape
vinyl acetate
shaped
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21309483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337760B2 (enrdf_load_stackoverflow
Inventor
Tatsuo Kurono
黒野　龍夫
Yasushi Ishihara
石原　寧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP21309483A priority Critical patent/JPS60105260A/ja
Publication of JPS60105260A publication Critical patent/JPS60105260A/ja
Publication of JPH0337760B2 publication Critical patent/JPH0337760B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP21309483A 1983-11-11 1983-11-11 小型電子部品用搬送体の構造 Granted JPS60105260A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21309483A JPS60105260A (ja) 1983-11-11 1983-11-11 小型電子部品用搬送体の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21309483A JPS60105260A (ja) 1983-11-11 1983-11-11 小型電子部品用搬送体の構造

Publications (2)

Publication Number Publication Date
JPS60105260A true JPS60105260A (ja) 1985-06-10
JPH0337760B2 JPH0337760B2 (enrdf_load_stackoverflow) 1991-06-06

Family

ID=16633457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21309483A Granted JPS60105260A (ja) 1983-11-11 1983-11-11 小型電子部品用搬送体の構造

Country Status (1)

Country Link
JP (1) JPS60105260A (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125060A (enrdf_load_stackoverflow) * 1974-08-26 1976-03-01 Nippon Steel Corp
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS5620193A (en) * 1979-07-25 1981-02-25 Sumitomo Electric Ind Ltd Preparation of plated wire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125060A (enrdf_load_stackoverflow) * 1974-08-26 1976-03-01 Nippon Steel Corp
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS5620193A (en) * 1979-07-25 1981-02-25 Sumitomo Electric Ind Ltd Preparation of plated wire

Also Published As

Publication number Publication date
JPH0337760B2 (enrdf_load_stackoverflow) 1991-06-06

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