JPH0337760B2 - - Google Patents
Info
- Publication number
- JPH0337760B2 JPH0337760B2 JP58213094A JP21309483A JPH0337760B2 JP H0337760 B2 JPH0337760 B2 JP H0337760B2 JP 58213094 A JP58213094 A JP 58213094A JP 21309483 A JP21309483 A JP 21309483A JP H0337760 B2 JPH0337760 B2 JP H0337760B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- tape
- vinyl acetate
- adhesive
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21309483A JPS60105260A (ja) | 1983-11-11 | 1983-11-11 | 小型電子部品用搬送体の構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21309483A JPS60105260A (ja) | 1983-11-11 | 1983-11-11 | 小型電子部品用搬送体の構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60105260A JPS60105260A (ja) | 1985-06-10 |
JPH0337760B2 true JPH0337760B2 (enrdf_load_stackoverflow) | 1991-06-06 |
Family
ID=16633457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21309483A Granted JPS60105260A (ja) | 1983-11-11 | 1983-11-11 | 小型電子部品用搬送体の構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60105260A (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5346628B2 (enrdf_load_stackoverflow) * | 1974-08-26 | 1978-12-15 | ||
JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS5620193A (en) * | 1979-07-25 | 1981-02-25 | Sumitomo Electric Ind Ltd | Preparation of plated wire |
-
1983
- 1983-11-11 JP JP21309483A patent/JPS60105260A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60105260A (ja) | 1985-06-10 |
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