JPS5924717A - エポキシ樹脂用潜在性硬化剤 - Google Patents
エポキシ樹脂用潜在性硬化剤Info
- Publication number
 - JPS5924717A JPS5924717A JP57134453A JP13445382A JPS5924717A JP S5924717 A JPS5924717 A JP S5924717A JP 57134453 A JP57134453 A JP 57134453A JP 13445382 A JP13445382 A JP 13445382A JP S5924717 A JPS5924717 A JP S5924717A
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - curing agent
 - epoxy resin
 - storage stability
 - hydrazide
 - latent curing
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Granted
 
Links
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 22
 - 239000003822 epoxy resin Substances 0.000 title claims abstract description 15
 - 229920000647 polyepoxide Polymers 0.000 title claims abstract description 15
 - 239000000203 mixture Substances 0.000 abstract description 8
 - NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 abstract description 5
 - IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 abstract description 5
 - -1 alkyl m- Chemical compound 0.000 abstract description 4
 - 125000003700 epoxy group Chemical group 0.000 abstract description 4
 - 239000000945 filler Substances 0.000 abstract description 2
 - FJKROLUGYXJWQN-UHFFFAOYSA-M 4-hydroxybenzoate Chemical compound OC1=CC=C(C([O-])=O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-M 0.000 abstract 1
 - 125000005250 alkyl acrylate group Chemical group 0.000 abstract 1
 - 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
 - YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 abstract 1
 - OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
 - 230000015572 biosynthetic process Effects 0.000 description 4
 - 238000003786 synthesis reaction Methods 0.000 description 4
 - BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 3
 - HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
 - 239000002253 acid Substances 0.000 description 3
 - GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
 - 238000011156 evaluation Methods 0.000 description 3
 - LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
 - RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
 - WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
 - 150000008065 acid anhydrides Chemical class 0.000 description 2
 - 238000004458 analytical method Methods 0.000 description 2
 - PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
 - 150000001875 compounds Chemical class 0.000 description 2
 - 239000013078 crystal Substances 0.000 description 2
 - 238000000921 elemental analysis Methods 0.000 description 2
 - 238000010438 heat treatment Methods 0.000 description 2
 - 238000002844 melting Methods 0.000 description 2
 - 230000008018 melting Effects 0.000 description 2
 - YKUCHDXIBAQWSF-UHFFFAOYSA-N methyl 3-hydroxybenzoate Chemical compound COC(=O)C1=CC=CC(O)=C1 YKUCHDXIBAQWSF-UHFFFAOYSA-N 0.000 description 2
 - LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 description 2
 - 239000000243 solution Substances 0.000 description 2
 - 239000000126 substance Substances 0.000 description 2
 - XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
 - VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
 - NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
 - KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
 - PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
 - 229930185605 Bisphenol Natural products 0.000 description 1
 - LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
 - ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
 - 239000004593 Epoxy Substances 0.000 description 1
 - UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
 - 229920000877 Melamine resin Polymers 0.000 description 1
 - ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
 - 239000000853 adhesive Substances 0.000 description 1
 - 230000001070 adhesive effect Effects 0.000 description 1
 - IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
 - 150000001412 amines Chemical class 0.000 description 1
 - 239000007864 aqueous solution Substances 0.000 description 1
 - UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
 - IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
 - 229910052796 boron Inorganic materials 0.000 description 1
 - 238000006243 chemical reaction Methods 0.000 description 1
 - 238000013329 compounding Methods 0.000 description 1
 - 239000012141 concentrate Substances 0.000 description 1
 - ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
 - QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
 - 238000004455 differential thermal analysis Methods 0.000 description 1
 - 150000002148 esters Chemical class 0.000 description 1
 - 150000002170 ethers Chemical class 0.000 description 1
 - 238000001914 filtration Methods 0.000 description 1
 - 239000001257 hydrogen Substances 0.000 description 1
 - 229910052739 hydrogen Inorganic materials 0.000 description 1
 - 230000001771 impaired effect Effects 0.000 description 1
 - 230000000977 initiatory effect Effects 0.000 description 1
 - 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
 - 230000007774 longterm Effects 0.000 description 1
 - 239000000463 material Substances 0.000 description 1
 - JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
 - 229910052751 metal Inorganic materials 0.000 description 1
 - 239000002184 metal Substances 0.000 description 1
 - 238000000034 method Methods 0.000 description 1
 - 239000004292 methyl p-hydroxybenzoate Substances 0.000 description 1
 - 235000010270 methyl p-hydroxybenzoate Nutrition 0.000 description 1
 - 239000011259 mixed solution Substances 0.000 description 1
 - 238000002156 mixing Methods 0.000 description 1
 - 239000004570 mortar (masonry) Substances 0.000 description 1
 - IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
 - 229910052757 nitrogen Inorganic materials 0.000 description 1
 - QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
 - 239000003973 paint Substances 0.000 description 1
 - 229920001568 phenolic resin Polymers 0.000 description 1
 - 229920000642 polymer Polymers 0.000 description 1
 - 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
 - 239000002994 raw material Substances 0.000 description 1
 - 239000012925 reference material Substances 0.000 description 1
 - 238000010992 reflux Methods 0.000 description 1
 - 229920005989 resin Polymers 0.000 description 1
 - 239000011347 resin Substances 0.000 description 1
 - 150000003839 salts Chemical class 0.000 description 1
 - 238000006467 substitution reaction Methods 0.000 description 1
 - 150000003512 tertiary amines Chemical class 0.000 description 1
 
Classifications
- 
        
- C—CHEMISTRY; METALLURGY
 - C07—ORGANIC CHEMISTRY
 - C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
 - C07C243/00—Compounds containing chains of nitrogen atoms singly-bound to each other, e.g. hydrazines, triazanes
 - C07C243/24—Hydrazines having nitrogen atoms of hydrazine groups acylated by carboxylic acids
 - C07C243/38—Hydrazines having nitrogen atoms of hydrazine groups acylated by carboxylic acids with acylating carboxyl groups bound to carbon atoms of six-membered aromatic rings
 
 - 
        
- C—CHEMISTRY; METALLURGY
 - C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
 - C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
 - C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
 - C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
 - C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
 - C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
 - C08G59/4014—Nitrogen containing compounds
 - C08G59/4035—Hydrazines; Hydrazides
 
 
Landscapes
- Chemical & Material Sciences (AREA)
 - Organic Chemistry (AREA)
 - Health & Medical Sciences (AREA)
 - Chemical Kinetics & Catalysis (AREA)
 - Medicinal Chemistry (AREA)
 - Polymers & Plastics (AREA)
 - Epoxy Resins (AREA)
 
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP57134453A JPS5924717A (ja) | 1982-07-30 | 1982-07-30 | エポキシ樹脂用潜在性硬化剤 | 
| EP83304255A EP0100633B1 (en) | 1982-07-30 | 1983-07-22 | Latent curing agents for epoxy resins | 
| US06/516,332 US4448949A (en) | 1982-07-30 | 1983-07-22 | Latent curing agents for epoxy resins | 
| DE8383304255T DE3362918D1 (en) | 1982-07-30 | 1983-07-22 | Latent curing agents for epoxy resins | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP57134453A JPS5924717A (ja) | 1982-07-30 | 1982-07-30 | エポキシ樹脂用潜在性硬化剤 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS5924717A true JPS5924717A (ja) | 1984-02-08 | 
| JPH0160167B2 JPH0160167B2 (en, 2012) | 1989-12-21 | 
Family
ID=15128694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP57134453A Granted JPS5924717A (ja) | 1982-07-30 | 1982-07-30 | エポキシ樹脂用潜在性硬化剤 | 
Country Status (4)
| Country | Link | 
|---|---|
| US (1) | US4448949A (en, 2012) | 
| EP (1) | EP0100633B1 (en, 2012) | 
| JP (1) | JPS5924717A (en, 2012) | 
| DE (1) | DE3362918D1 (en, 2012) | 
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS61174220A (ja) * | 1985-01-28 | 1986-08-05 | Hitachi Chem Co Ltd | 半導体装置封止用エポキシ樹脂組成物 | 
| JPS63157080U (en, 2012) * | 1987-03-31 | 1988-10-14 | ||
| JPS63157081U (en, 2012) * | 1987-03-31 | 1988-10-14 | 
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS60110719A (ja) * | 1983-11-21 | 1985-06-17 | Ajinomoto Co Inc | エポキシ樹脂用潜在性硬化剤 | 
| US5213897A (en) * | 1991-04-03 | 1993-05-25 | Elf Atochem North America, Inc. | Epoxy resins containing bound light stabilizing groups | 
| KR100979477B1 (ko) * | 2002-07-08 | 2010-09-02 | 다이닛쿠 가부시키가이샤 | 흡습성 성형체, 당해 흡습성 성형체를 갖는 유기 el 소자, 당해 흡습성 성형체를 이용한 밀폐 분위기 내의 수분을 제거하는 방법, 및 당해 흡습성 성형체를 이용한 유기 el 소자의 다크 스팟 발생을 억제하는 방법 | 
| GB2475066A (en) * | 2009-11-04 | 2011-05-11 | Hexcel Composites Ltd | Curing a syntactic paste to produce a syntactic foam | 
| CN112341975B (zh) * | 2020-11-25 | 2022-03-08 | 中路交科科技股份有限公司 | 一种二阶环氧粘层油、制备方法及其应用方法 | 
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US2847395A (en) * | 1955-06-13 | 1958-08-12 | Minnesota Mining & Mfg | Stable heat-curing epoxy resin compositions | 
| US3294748A (en) * | 1962-05-23 | 1966-12-27 | Westinghouse Electric Corp | Curing agents for epoxy resins | 
| US3467707A (en) * | 1965-10-01 | 1969-09-16 | Gen Mills Inc | Certain amino substituted hydrazide epoxy resin curing agents | 
| US3530173A (en) * | 1967-01-17 | 1970-09-22 | Gen Mills Inc | Certain acids and hydrazides | 
| GB1219937A (en) * | 1967-06-07 | 1971-01-20 | Motorola Inc | Frequency sensitive d.c. voltage control circuit | 
| US3876606A (en) * | 1973-06-14 | 1975-04-08 | Minnesota Mining & Mfg | Thermosetting epoxy resin powder highly filled with barium sulfate, calcium carbonate and mica | 
- 
        1982
        
- 1982-07-30 JP JP57134453A patent/JPS5924717A/ja active Granted
 
 - 
        1983
        
- 1983-07-22 US US06/516,332 patent/US4448949A/en not_active Expired - Fee Related
 - 1983-07-22 EP EP83304255A patent/EP0100633B1/en not_active Expired
 - 1983-07-22 DE DE8383304255T patent/DE3362918D1/de not_active Expired
 
 
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS61174220A (ja) * | 1985-01-28 | 1986-08-05 | Hitachi Chem Co Ltd | 半導体装置封止用エポキシ樹脂組成物 | 
| JPS63157080U (en, 2012) * | 1987-03-31 | 1988-10-14 | ||
| JPS63157081U (en, 2012) * | 1987-03-31 | 1988-10-14 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| EP0100633A3 (en) | 1984-04-18 | 
| US4448949A (en) | 1984-05-15 | 
| EP0100633A2 (en) | 1984-02-15 | 
| EP0100633B1 (en) | 1986-04-09 | 
| JPH0160167B2 (en, 2012) | 1989-12-21 | 
| DE3362918D1 (en) | 1986-05-15 | 
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