JPS59187447A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JPS59187447A
JPS59187447A JP58058675A JP5867583A JPS59187447A JP S59187447 A JPS59187447 A JP S59187447A JP 58058675 A JP58058675 A JP 58058675A JP 5867583 A JP5867583 A JP 5867583A JP S59187447 A JPS59187447 A JP S59187447A
Authority
JP
Japan
Prior art keywords
workpiece
carrier
whetstone
rotating body
position detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58058675A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6150749B2 (enrdf_load_stackoverflow
Inventor
Takashi Miyatani
孝 宮谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58058675A priority Critical patent/JPS59187447A/ja
Publication of JPS59187447A publication Critical patent/JPS59187447A/ja
Publication of JPS6150749B2 publication Critical patent/JPS6150749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP58058675A 1983-04-05 1983-04-05 研磨装置 Granted JPS59187447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58058675A JPS59187447A (ja) 1983-04-05 1983-04-05 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58058675A JPS59187447A (ja) 1983-04-05 1983-04-05 研磨装置

Publications (2)

Publication Number Publication Date
JPS59187447A true JPS59187447A (ja) 1984-10-24
JPS6150749B2 JPS6150749B2 (enrdf_load_stackoverflow) 1986-11-05

Family

ID=13091148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58058675A Granted JPS59187447A (ja) 1983-04-05 1983-04-05 研磨装置

Country Status (1)

Country Link
JP (1) JPS59187447A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226253A (ja) * 1985-03-30 1986-10-08 Mitsubishi Metal Corp 平行平面自動研削装置
JPS62136364A (ja) * 1985-12-04 1987-06-19 Toshiba Mach Co Ltd ポリシヤ−におけるワ−ク搬入出装置
JPS62236672A (ja) * 1986-04-07 1987-10-16 Toshiba Mach Co Ltd 研磨装置におけるキヤリア位置決め方法
US4916868A (en) * 1987-09-14 1990-04-17 Peter Wolters Ag Honing, lapping or polishing machine
JPH0425375A (ja) * 1990-05-16 1992-01-29 Showa Alum Corp 研磨装置
US5333413A (en) * 1991-12-18 1994-08-02 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
CN115625570A (zh) * 2022-12-23 2023-01-20 新乡市斯凯夫机械有限公司 一种带有自动上下料机构的双端面研磨机

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226253A (ja) * 1985-03-30 1986-10-08 Mitsubishi Metal Corp 平行平面自動研削装置
JPS62136364A (ja) * 1985-12-04 1987-06-19 Toshiba Mach Co Ltd ポリシヤ−におけるワ−ク搬入出装置
JPS62236672A (ja) * 1986-04-07 1987-10-16 Toshiba Mach Co Ltd 研磨装置におけるキヤリア位置決め方法
US4916868A (en) * 1987-09-14 1990-04-17 Peter Wolters Ag Honing, lapping or polishing machine
JPH0425375A (ja) * 1990-05-16 1992-01-29 Showa Alum Corp 研磨装置
US5333413A (en) * 1991-12-18 1994-08-02 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
CN115625570A (zh) * 2022-12-23 2023-01-20 新乡市斯凯夫机械有限公司 一种带有自动上下料机构的双端面研磨机

Also Published As

Publication number Publication date
JPS6150749B2 (enrdf_load_stackoverflow) 1986-11-05

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