JPS5918647A - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置

Info

Publication number
JPS5918647A
JPS5918647A JP57127925A JP12792582A JPS5918647A JP S5918647 A JPS5918647 A JP S5918647A JP 57127925 A JP57127925 A JP 57127925A JP 12792582 A JP12792582 A JP 12792582A JP S5918647 A JPS5918647 A JP S5918647A
Authority
JP
Japan
Prior art keywords
lead
leads
outer lead
junction board
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57127925A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364900B2 (enrdf_load_html_response
Inventor
Tsutomu Taoka
勉 田岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57127925A priority Critical patent/JPS5918647A/ja
Publication of JPS5918647A publication Critical patent/JPS5918647A/ja
Publication of JPS6364900B2 publication Critical patent/JPS6364900B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57127925A 1982-07-22 1982-07-22 半導体装置の製造装置 Granted JPS5918647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57127925A JPS5918647A (ja) 1982-07-22 1982-07-22 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57127925A JPS5918647A (ja) 1982-07-22 1982-07-22 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS5918647A true JPS5918647A (ja) 1984-01-31
JPS6364900B2 JPS6364900B2 (enrdf_load_html_response) 1988-12-14

Family

ID=14972020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57127925A Granted JPS5918647A (ja) 1982-07-22 1982-07-22 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS5918647A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106339A (ja) * 1985-11-05 1987-05-16 Toray Ind Inc 光学繊維の光伝送損失の高精度測定法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106339A (ja) * 1985-11-05 1987-05-16 Toray Ind Inc 光学繊維の光伝送損失の高精度測定法

Also Published As

Publication number Publication date
JPS6364900B2 (enrdf_load_html_response) 1988-12-14

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