JPS6144431Y2 - - Google Patents

Info

Publication number
JPS6144431Y2
JPS6144431Y2 JP1980132701U JP13270180U JPS6144431Y2 JP S6144431 Y2 JPS6144431 Y2 JP S6144431Y2 JP 1980132701 U JP1980132701 U JP 1980132701U JP 13270180 U JP13270180 U JP 13270180U JP S6144431 Y2 JPS6144431 Y2 JP S6144431Y2
Authority
JP
Japan
Prior art keywords
tape
mold
chip
cutting
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980132701U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5755953U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980132701U priority Critical patent/JPS6144431Y2/ja
Publication of JPS5755953U publication Critical patent/JPS5755953U/ja
Application granted granted Critical
Publication of JPS6144431Y2 publication Critical patent/JPS6144431Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1980132701U 1980-09-17 1980-09-17 Expired JPS6144431Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980132701U JPS6144431Y2 (enrdf_load_html_response) 1980-09-17 1980-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980132701U JPS6144431Y2 (enrdf_load_html_response) 1980-09-17 1980-09-17

Publications (2)

Publication Number Publication Date
JPS5755953U JPS5755953U (enrdf_load_html_response) 1982-04-01
JPS6144431Y2 true JPS6144431Y2 (enrdf_load_html_response) 1986-12-15

Family

ID=29492933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980132701U Expired JPS6144431Y2 (enrdf_load_html_response) 1980-09-17 1980-09-17

Country Status (1)

Country Link
JP (1) JPS6144431Y2 (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JP2709484B2 (ja) * 1988-09-17 1998-02-04 ローム株式会社 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52105779A (en) * 1976-03-01 1977-09-05 Dainippon Screen Mfg Device for bonding outer lead
JPS5449069A (en) * 1977-09-27 1979-04-18 Nec Corp Method and device for lead correction

Also Published As

Publication number Publication date
JPS5755953U (enrdf_load_html_response) 1982-04-01

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