JPS59185834U - 試験システム用接続装置 - Google Patents
試験システム用接続装置Info
- Publication number
- JPS59185834U JPS59185834U JP1984061563U JP6156384U JPS59185834U JP S59185834 U JPS59185834 U JP S59185834U JP 1984061563 U JP1984061563 U JP 1984061563U JP 6156384 U JP6156384 U JP 6156384U JP S59185834 U JPS59185834 U JP S59185834U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- conductive region
- circuit board
- connection device
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は、本考案の良好な実施例によるプログラム可能
界面接触装置の一部断面の斜視図、第2図は、本考案の
良好な実施例によるプログラム可能界面接触装置の第1
図の線2−2に沿って得られた断面図、第3薗は、第1
図及び第2図のプログラム可能界面接触構造体の空間変
換器構造体2の上段プレート6の部分の断面図で、第3
図に示された該上段プレート6は代表的なポゴ導電体1
3.14を含み、且つ、該ポゴ導電体がどの様な状態で
上記上段プレート6内に備え付けられるかを示し、第4
図は1、第1図及び第2図のプログラム可能界面接触装
置の部品番号印刷回路の一部分の断面図を示し、更に柱
環21を有したピンをも示す図、第5図は、第1図及び
第2図のプログラム可能界面接触装置の空間変換器構造
体2の一部分の断面図、第6図は、第1図及び第2図の
プログラム可能界面接触装置の空間変換器構造体2の電
力供給印刷回路板9の平面図、第7図は、第6図の電力
供給印刷回路板の一部分の断面図であ6°1 =i!。 mittami、200.ゆ□−一。 体、9・・・電力供給印刷回路板、11.12・・・導
電線、31・・・探査針、42・・・芒験される装置。
界面接触装置の一部断面の斜視図、第2図は、本考案の
良好な実施例によるプログラム可能界面接触装置の第1
図の線2−2に沿って得られた断面図、第3薗は、第1
図及び第2図のプログラム可能界面接触構造体の空間変
換器構造体2の上段プレート6の部分の断面図で、第3
図に示された該上段プレート6は代表的なポゴ導電体1
3.14を含み、且つ、該ポゴ導電体がどの様な状態で
上記上段プレート6内に備え付けられるかを示し、第4
図は1、第1図及び第2図のプログラム可能界面接触装
置の部品番号印刷回路の一部分の断面図を示し、更に柱
環21を有したピンをも示す図、第5図は、第1図及び
第2図のプログラム可能界面接触装置の空間変換器構造
体2の一部分の断面図、第6図は、第1図及び第2図の
プログラム可能界面接触装置の空間変換器構造体2の電
力供給印刷回路板9の平面図、第7図は、第6図の電力
供給印刷回路板の一部分の断面図であ6°1 =i!。 mittami、200.ゆ□−一。 体、9・・・電力供給印刷回路板、11.12・・・導
電線、31・・・探査針、42・・・芒験される装置。
Claims (2)
- (1)複数個の導電性パッドを有する半導体装置を試験
するための試験システムに用いる接続装置であって、−
表面に複数個の電気的コネクタを有し他表面に該コネク
タに接続する導電性領域を有する回路板と、−表面に上
記導電性領域に接触する導電性領域を有するスペース変
換器と、上記スペース変換器の導電性領域のそれぞれを
試験すべき半導体装置の導電性パッドに電気的に接続す
るための複数個の探査針とを有し、上′記試験すべき半
導体装置に応じた素子を上記回路板の電気コネクタに接
続して該半導体装置の試験を行なうようにしたことを特
徴とする上記接続装置。 - (2)上記スペース変換器は、−表面に上記回路板の導
電性領域に接触する導電性領域を有し他表面に該導電性
領域に接続する電気接点を有する第1の平坦部材及び該
第1の平坦部材に平行に設けられた第2の平行部材を有
し、該第2の平坦部材は上記電気接点に接続する該電気
接点よりも狭い間隔で設けられた導電性領域を有する登
録請求の範囲第(1)項の接続装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/548,659 US3963986A (en) | 1975-02-10 | 1975-02-10 | Programmable interface contactor structure |
US548659 | 1975-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59185834U true JPS59185834U (ja) | 1984-12-10 |
JPS6138191Y2 JPS6138191Y2 (ja) | 1986-11-05 |
Family
ID=24189825
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51006744A Pending JPS51100680A (ja) | 1975-02-10 | 1976-01-26 | |
JP1984061563U Granted JPS59185834U (ja) | 1975-02-10 | 1984-04-27 | 試験システム用接続装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51006744A Pending JPS51100680A (ja) | 1975-02-10 | 1976-01-26 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3963986A (ja) |
JP (2) | JPS51100680A (ja) |
DE (1) | DE2604837A1 (ja) |
FR (1) | FR2300486A1 (ja) |
GB (1) | GB1514060A (ja) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4038599A (en) * | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
US4045735A (en) * | 1976-02-17 | 1977-08-30 | E-H Research Laboratories, Inc. | Apparatus for testing electronic devices having a high density array of pin leads |
DE3038665C2 (de) * | 1980-10-13 | 1990-03-29 | Riba-Prüftechnik GmbH, 7801 Schallstadt | Prüfeinrichtung zum Überprüfen von mit Leiterbahnen versehenen Leiterplatten |
US4500836A (en) * | 1980-10-31 | 1985-02-19 | Pacific Western Systems, Inc. | Automatic wafer prober with programmable tester interface |
US4443756A (en) * | 1980-11-25 | 1984-04-17 | Lightbody James D | Apparatus and method for testing circuit boards |
US4488111A (en) * | 1982-06-01 | 1984-12-11 | At&T Technologies, Inc. | Coupling devices for operations such as testing |
US4585991A (en) * | 1982-06-03 | 1986-04-29 | Texas Instruments Incorporated | Solid state multiprobe testing apparatus |
JPS59143340A (ja) * | 1983-02-05 | 1984-08-16 | Rohm Co Ltd | プロ−ブカ−ド |
US4567432A (en) * | 1983-06-09 | 1986-01-28 | Texas Instruments Incorporated | Apparatus for testing integrated circuits |
US4574236A (en) * | 1983-10-27 | 1986-03-04 | At&T Technologies, Inc. | High frequency test fixture |
DE3340179C1 (de) * | 1983-11-07 | 1985-05-09 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH | Anordnung an einem Leiterplattenpruefgeraet zur Anpassung der Abstaende von Kontakten |
DK291184D0 (da) * | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
JPS6113932U (ja) * | 1984-06-28 | 1986-01-27 | 富士通株式会社 | 半導体集積回路試験装置 |
US4694245A (en) * | 1984-09-07 | 1987-09-15 | Precision Drilling, Inc. | Vacuum-actuated top access test probe fixture |
US4734046A (en) * | 1984-09-21 | 1988-03-29 | International Business Machines Corporation | Coaxial converter with resilient terminal |
US4672312A (en) * | 1984-12-20 | 1987-06-09 | Hughes Aircraft Company | Giga-hertz test jig |
US4712062A (en) * | 1984-12-20 | 1987-12-08 | Hughes Aircraft Company | Ground shield apparatus for giga-hertz test jig |
US4825155A (en) * | 1984-12-20 | 1989-04-25 | Hughes Aircraft Company | X-band logic test jig |
US4771236A (en) * | 1985-12-16 | 1988-09-13 | Banks Sherman M | Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same |
US4827211A (en) * | 1987-01-30 | 1989-05-02 | Cascade Microtech, Inc. | Wafer probe |
DE3882563D1 (de) * | 1987-03-31 | 1993-09-02 | Siemens Ag | Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten. |
JPS63274154A (ja) * | 1987-04-29 | 1988-11-11 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | プローブ・カード装置 |
US4862077A (en) * | 1987-04-29 | 1989-08-29 | International Business Machines Corporation | Probe card apparatus and method of providing same with reconfigurable probe card circuitry |
US4983907A (en) * | 1987-05-14 | 1991-01-08 | Intel Corporation | Driven guard probe card |
JPH0429561Y2 (ja) * | 1987-08-18 | 1992-07-17 | ||
US4935694A (en) * | 1988-09-20 | 1990-06-19 | Electro Scientific Industries, Inc. | Probe card fixture |
US5014002A (en) * | 1989-04-18 | 1991-05-07 | Vlsi Technology, Inc. | ATE jumper programmable interface board |
US5162728A (en) * | 1990-09-11 | 1992-11-10 | Cray Computer Corporation | Functional at speed test system for integrated circuits on undiced wafers |
US5132612A (en) * | 1991-03-14 | 1992-07-21 | The United States Of America As Represented By The Secretary Of The Air Force | Apparatus for electrostatic discharge (ESD) stress/testing |
US5144228A (en) * | 1991-04-23 | 1992-09-01 | International Business Machines Corporation | Probe interface assembly |
US5304921A (en) * | 1991-08-07 | 1994-04-19 | Hewlett-Packard Company | Enhanced grounding system for short-wire lengthed fixture |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6741085B1 (en) * | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US5491426A (en) * | 1994-06-30 | 1996-02-13 | Vlsi Technology, Inc. | Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations |
WO1996007924A1 (en) * | 1994-09-09 | 1996-03-14 | Micromodule Systems | Membrane probing of circuits |
US5672981A (en) * | 1994-09-16 | 1997-09-30 | At&T Global Information Solutions Company | Universal power interface adapter for burn-in board |
US5563376A (en) * | 1995-01-03 | 1996-10-08 | W. L. Gore & Associates, Inc | High performance coaxial cable providing high density interface connections and method of making same |
EP0886894B1 (en) * | 1995-05-26 | 2005-09-28 | Formfactor, Inc. | Contact carriers for populating substrates with spring contacts |
US20100065963A1 (en) * | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
US5597317A (en) * | 1995-08-11 | 1997-01-28 | W. L. Gore & Associates, Inc. | Surface mating electrical connector |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5659483A (en) * | 1996-07-12 | 1997-08-19 | National Center For Manufacturing Sciences | System and method for analyzing conductor formation processes |
US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
US6201402B1 (en) | 1997-04-08 | 2001-03-13 | Celadon Systems, Inc. | Probe tile and platform for large area wafer probing |
US6586954B2 (en) * | 1998-02-10 | 2003-07-01 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
US6103978A (en) * | 1997-12-18 | 2000-08-15 | Lucent Technologies Inc. | Printed wiring board having inner test-layer for improved test probing |
US6256572B1 (en) | 1999-03-30 | 2001-07-03 | Kelsey-Hayes Company | Remote programming of an ABS electronic control module |
US6255827B1 (en) | 1999-04-30 | 2001-07-03 | International Business Machines Corporation | Search routine for 2-point electrical tester |
US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
US7262611B2 (en) * | 2000-03-17 | 2007-08-28 | Formfactor, Inc. | Apparatuses and methods for planarizing a semiconductor contactor |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
TW578910U (en) * | 2003-05-21 | 2004-03-01 | Mjc Probe Inc | Integrated circuit probe card |
TWI318300B (en) * | 2002-06-28 | 2009-12-11 | Celadon Systems Inc | Shielded probe apparatus for probing semiconductor wafer |
US7170305B2 (en) | 2005-02-24 | 2007-01-30 | Celadon Systems, Inc. | Apparatus and method for terminating probe apparatus of semiconductor wafer |
US6963207B2 (en) * | 2003-03-06 | 2005-11-08 | Celadon Systems, Inc. | Apparatus and method for terminating probe apparatus of semiconductor wafer |
US6975128B1 (en) | 2003-03-28 | 2005-12-13 | Celadon Systems, Inc. | Electrical, high temperature test probe with conductive driven guard |
US7307437B1 (en) | 2005-03-24 | 2007-12-11 | Hewlett-Packard Development Company, L.P. | Arrangement with conductive pad embedment |
US7728609B2 (en) | 2007-05-25 | 2010-06-01 | Celadon Systems, Inc. | Replaceable probe apparatus for probing semiconductor wafer |
US10120020B2 (en) | 2016-06-16 | 2018-11-06 | Formfactor Beaverton, Inc. | Probe head assemblies and probe systems for testing integrated circuit devices |
CN107942223A (zh) * | 2016-10-12 | 2018-04-20 | 肖敏 | 用于芯片测试和编程的装置及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48104261U (ja) * | 1972-03-09 | 1973-12-05 | ||
JPS4991582A (ja) * | 1972-12-26 | 1974-09-02 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3866119A (en) * | 1973-09-10 | 1975-02-11 | Probe Rite Inc | Probe head-probing machine coupling adaptor |
-
1975
- 1975-02-10 US US05/548,659 patent/US3963986A/en not_active Expired - Lifetime
-
1976
- 1976-01-08 FR FR7600766A patent/FR2300486A1/fr active Granted
- 1976-01-21 GB GB2250/76A patent/GB1514060A/en not_active Expired
- 1976-01-26 JP JP51006744A patent/JPS51100680A/ja active Pending
- 1976-02-07 DE DE19762604837 patent/DE2604837A1/de not_active Withdrawn
-
1984
- 1984-04-27 JP JP1984061563U patent/JPS59185834U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48104261U (ja) * | 1972-03-09 | 1973-12-05 | ||
JPS4991582A (ja) * | 1972-12-26 | 1974-09-02 |
Also Published As
Publication number | Publication date |
---|---|
DE2604837A1 (de) | 1976-08-19 |
JPS6138191Y2 (ja) | 1986-11-05 |
US3963986A (en) | 1976-06-15 |
GB1514060A (en) | 1978-06-14 |
FR2300486B1 (ja) | 1978-11-10 |
JPS51100680A (ja) | 1976-09-06 |
FR2300486A1 (fr) | 1976-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59185834U (ja) | 試験システム用接続装置 | |
JPS60123666U (ja) | 回路基板等の検査装置 | |
JP2979364B2 (ja) | 多層コンタクター | |
JPS5968268U (ja) | プリント基板の試験装置 | |
JPS60185263U (ja) | 回路基板等の検査装置におけるコンタクトプロ−ブ | |
JP3172305B2 (ja) | 半導体装置の製造方法 | |
JPS60143372U (ja) | 半導体素子の電気特性測定装置 | |
JPS58138078U (ja) | Ic用試験端子装置 | |
JPS59163968U (ja) | プリント回路板検査装置 | |
JPS59154677U (ja) | 半導体装置の試験装置 | |
JPS60109279U (ja) | コネクタ | |
JPH022957A (ja) | プリント配線試験用プローズ装置 | |
JP2505822Y2 (ja) | 回路検査装置 | |
JPS63200477A (ja) | Ic用コンタクタ− | |
JPS61178482U (ja) | ||
JPS5832475U (ja) | ハンドリング装置の電極子 | |
JPS5878639U (ja) | プロ−ブカ−ド | |
JPH0627145A (ja) | コンタクター | |
JPS632174U (ja) | ||
JPS6231974A (ja) | Ic用ソケツト | |
JPS5945574U (ja) | 電子部品の特性測定装置 | |
JPS59280U (ja) | コネクタ | |
JPS60109326U (ja) | 半導体疑似試験装置 | |
JPS588169U (ja) | 試験回路選択装置 | |
JPS60111080U (ja) | 音響装置におけるコンポ−ネントの接続構造 |