JPS51100680A - - Google Patents

Info

Publication number
JPS51100680A
JPS51100680A JP51006744A JP674476A JPS51100680A JP S51100680 A JPS51100680 A JP S51100680A JP 51006744 A JP51006744 A JP 51006744A JP 674476 A JP674476 A JP 674476A JP S51100680 A JPS51100680 A JP S51100680A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51006744A
Inventor
Emu Mooton Robaato
Eru Paaruman Ariru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS51100680A publication Critical patent/JPS51100680A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
JP51006744A 1975-02-10 1976-01-26 Pending JPS51100680A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/548,659 US3963986A (en) 1975-02-10 1975-02-10 Programmable interface contactor structure

Publications (1)

Publication Number Publication Date
JPS51100680A true JPS51100680A (ja) 1976-09-06

Family

ID=24189825

Family Applications (2)

Application Number Title Priority Date Filing Date
JP51006744A Pending JPS51100680A (ja) 1975-02-10 1976-01-26
JP1984061563U Granted JPS59185834U (ja) 1975-02-10 1984-04-27 試験システム用接続装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1984061563U Granted JPS59185834U (ja) 1975-02-10 1984-04-27 試験システム用接続装置

Country Status (5)

Country Link
US (1) US3963986A (ja)
JP (2) JPS51100680A (ja)
DE (1) DE2604837A1 (ja)
FR (1) FR2300486A1 (ja)
GB (1) GB1514060A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143340A (ja) * 1983-02-05 1984-08-16 Rohm Co Ltd プロ−ブカ−ド
JPS6113932U (ja) * 1984-06-28 1986-01-27 富士通株式会社 半導体集積回路試験装置

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4045735A (en) * 1976-02-17 1977-08-30 E-H Research Laboratories, Inc. Apparatus for testing electronic devices having a high density array of pin leads
DE3038665C2 (de) * 1980-10-13 1990-03-29 Riba-Prüftechnik GmbH, 7801 Schallstadt Prüfeinrichtung zum Überprüfen von mit Leiterbahnen versehenen Leiterplatten
US4500836A (en) * 1980-10-31 1985-02-19 Pacific Western Systems, Inc. Automatic wafer prober with programmable tester interface
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4488111A (en) * 1982-06-01 1984-12-11 At&T Technologies, Inc. Coupling devices for operations such as testing
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
US4567432A (en) * 1983-06-09 1986-01-28 Texas Instruments Incorporated Apparatus for testing integrated circuits
US4574236A (en) * 1983-10-27 1986-03-04 At&T Technologies, Inc. High frequency test fixture
DE3340179C1 (de) * 1983-11-07 1985-05-09 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Anordnung an einem Leiterplattenpruefgeraet zur Anpassung der Abstaende von Kontakten
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
US4694245A (en) * 1984-09-07 1987-09-15 Precision Drilling, Inc. Vacuum-actuated top access test probe fixture
US4734046A (en) * 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US4712062A (en) * 1984-12-20 1987-12-08 Hughes Aircraft Company Ground shield apparatus for giga-hertz test jig
US4672312A (en) * 1984-12-20 1987-06-09 Hughes Aircraft Company Giga-hertz test jig
US4825155A (en) * 1984-12-20 1989-04-25 Hughes Aircraft Company X-band logic test jig
US4771236A (en) * 1985-12-16 1988-09-13 Banks Sherman M Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
US4827211A (en) * 1987-01-30 1989-05-02 Cascade Microtech, Inc. Wafer probe
DE3882563D1 (de) * 1987-03-31 1993-09-02 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
JPS63274154A (ja) * 1987-04-29 1988-11-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン プローブ・カード装置
US4862077A (en) * 1987-04-29 1989-08-29 International Business Machines Corporation Probe card apparatus and method of providing same with reconfigurable probe card circuitry
US4983907A (en) * 1987-05-14 1991-01-08 Intel Corporation Driven guard probe card
JPH0429561Y2 (ja) * 1987-08-18 1992-07-17
US4935694A (en) * 1988-09-20 1990-06-19 Electro Scientific Industries, Inc. Probe card fixture
US5014002A (en) * 1989-04-18 1991-05-07 Vlsi Technology, Inc. ATE jumper programmable interface board
US5162728A (en) * 1990-09-11 1992-11-10 Cray Computer Corporation Functional at speed test system for integrated circuits on undiced wafers
US5132612A (en) * 1991-03-14 1992-07-21 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for electrostatic discharge (ESD) stress/testing
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
US5304921A (en) * 1991-08-07 1994-04-19 Hewlett-Packard Company Enhanced grounding system for short-wire lengthed fixture
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5491426A (en) * 1994-06-30 1996-02-13 Vlsi Technology, Inc. Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
EP0779989A4 (en) * 1994-09-09 1998-01-07 Micromodule Systems Inc SCANING CIRCUITS WITH A MEMBRANE PROBE
US5672981A (en) * 1994-09-16 1997-09-30 At&T Global Information Solutions Company Universal power interface adapter for burn-in board
US5563376A (en) * 1995-01-03 1996-10-08 W. L. Gore & Associates, Inc High performance coaxial cable providing high density interface connections and method of making same
US20100065963A1 (en) * 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
EP0886894B1 (en) * 1995-05-26 2005-09-28 Formfactor, Inc. Contact carriers for populating substrates with spring contacts
US5597317A (en) * 1995-08-11 1997-01-28 W. L. Gore & Associates, Inc. Surface mating electrical connector
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5659483A (en) * 1996-07-12 1997-08-19 National Center For Manufacturing Sciences System and method for analyzing conductor formation processes
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6586954B2 (en) * 1998-02-10 2003-07-01 Celadon Systems, Inc. Probe tile for probing semiconductor wafer
US6201402B1 (en) 1997-04-08 2001-03-13 Celadon Systems, Inc. Probe tile and platform for large area wafer probing
US6103978A (en) * 1997-12-18 2000-08-15 Lucent Technologies Inc. Printed wiring board having inner test-layer for improved test probing
US6256572B1 (en) 1999-03-30 2001-07-03 Kelsey-Hayes Company Remote programming of an ABS electronic control module
US6255827B1 (en) 1999-04-30 2001-07-03 International Business Machines Corporation Search routine for 2-point electrical tester
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
TW578910U (en) * 2003-05-21 2004-03-01 Mjc Probe Inc Integrated circuit probe card
US6992495B2 (en) * 2002-06-28 2006-01-31 Celadon Systems, Inc. Shielded probe apparatus for probing semiconductor wafer
US7170305B2 (en) * 2005-02-24 2007-01-30 Celadon Systems, Inc. Apparatus and method for terminating probe apparatus of semiconductor wafer
US6963207B2 (en) * 2003-03-06 2005-11-08 Celadon Systems, Inc. Apparatus and method for terminating probe apparatus of semiconductor wafer
US6975128B1 (en) 2003-03-28 2005-12-13 Celadon Systems, Inc. Electrical, high temperature test probe with conductive driven guard
US7307437B1 (en) 2005-03-24 2007-12-11 Hewlett-Packard Development Company, L.P. Arrangement with conductive pad embedment
US7728609B2 (en) 2007-05-25 2010-06-01 Celadon Systems, Inc. Replaceable probe apparatus for probing semiconductor wafer
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
CN107942223A (zh) * 2016-10-12 2018-04-20 肖敏 用于芯片测试和编程的装置及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117811Y2 (ja) * 1972-03-09 1976-05-13
US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes
US3866119A (en) * 1973-09-10 1975-02-11 Probe Rite Inc Probe head-probing machine coupling adaptor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143340A (ja) * 1983-02-05 1984-08-16 Rohm Co Ltd プロ−ブカ−ド
JPS6113932U (ja) * 1984-06-28 1986-01-27 富士通株式会社 半導体集積回路試験装置
JPH0341464Y2 (ja) * 1984-06-28 1991-08-30

Also Published As

Publication number Publication date
FR2300486A1 (fr) 1976-09-03
GB1514060A (en) 1978-06-14
US3963986A (en) 1976-06-15
FR2300486B1 (ja) 1978-11-10
DE2604837A1 (de) 1976-08-19
JPS6138191Y2 (ja) 1986-11-05
JPS59185834U (ja) 1984-12-10

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