JPS59170254A - 無電解めっき方法 - Google Patents

無電解めっき方法

Info

Publication number
JPS59170254A
JPS59170254A JP4473983A JP4473983A JPS59170254A JP S59170254 A JPS59170254 A JP S59170254A JP 4473983 A JP4473983 A JP 4473983A JP 4473983 A JP4473983 A JP 4473983A JP S59170254 A JPS59170254 A JP S59170254A
Authority
JP
Japan
Prior art keywords
plating
film
plating bath
nickel
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4473983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0429739B2 (enrdf_load_stackoverflow
Inventor
Fumio Goto
文男 後藤
Tetsuya Aisaka
哲彌 逢坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4473983A priority Critical patent/JPS59170254A/ja
Publication of JPS59170254A publication Critical patent/JPS59170254A/ja
Publication of JPH0429739B2 publication Critical patent/JPH0429739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP4473983A 1983-03-17 1983-03-17 無電解めっき方法 Granted JPS59170254A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4473983A JPS59170254A (ja) 1983-03-17 1983-03-17 無電解めっき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4473983A JPS59170254A (ja) 1983-03-17 1983-03-17 無電解めっき方法

Publications (2)

Publication Number Publication Date
JPS59170254A true JPS59170254A (ja) 1984-09-26
JPH0429739B2 JPH0429739B2 (enrdf_load_stackoverflow) 1992-05-19

Family

ID=12699810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4473983A Granted JPS59170254A (ja) 1983-03-17 1983-03-17 無電解めっき方法

Country Status (1)

Country Link
JP (1) JPS59170254A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280080A (ja) * 1988-09-16 1990-03-20 Takara Co Ltd 装飾装置
US6273943B1 (en) * 1999-01-12 2001-08-14 C. Uyemura & Co., Ltd. Electroless composite Plating Solution and Electroless composite plating method
JP2011099161A (ja) * 2009-10-09 2011-05-19 Tosoh Corp ニッケルメッキ液
CN103469055A (zh) * 2013-08-01 2013-12-25 西安建筑科技大学 一种笔头用含铅易切削不锈钢冶炼中的加铅工艺
JP2015137394A (ja) * 2014-01-22 2015-07-30 株式会社クオルテック 無電解Ni−Pめっき液及び無電解Ni−Pめっき方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526252A (en) * 1975-07-01 1977-01-18 Kazuo Fujita Collapsible-type stage device.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526252A (en) * 1975-07-01 1977-01-18 Kazuo Fujita Collapsible-type stage device.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0280080A (ja) * 1988-09-16 1990-03-20 Takara Co Ltd 装飾装置
US6273943B1 (en) * 1999-01-12 2001-08-14 C. Uyemura & Co., Ltd. Electroless composite Plating Solution and Electroless composite plating method
JP2011099161A (ja) * 2009-10-09 2011-05-19 Tosoh Corp ニッケルメッキ液
CN103469055A (zh) * 2013-08-01 2013-12-25 西安建筑科技大学 一种笔头用含铅易切削不锈钢冶炼中的加铅工艺
CN103469055B (zh) * 2013-08-01 2015-07-01 西安建筑科技大学 一种笔头用含铅易切削不锈钢冶炼中的加铅工艺
JP2015137394A (ja) * 2014-01-22 2015-07-30 株式会社クオルテック 無電解Ni−Pめっき液及び無電解Ni−Pめっき方法

Also Published As

Publication number Publication date
JPH0429739B2 (enrdf_load_stackoverflow) 1992-05-19

Similar Documents

Publication Publication Date Title
JPS59170254A (ja) 無電解めっき方法
JPH0766034A (ja) 軟磁性材料膜及びその製造方法
JPS59215474A (ja) 無電解めつき浴
JP3533880B2 (ja) 無電解ニッケルめっき液及び無電解ニッケルめっき方法
US3905776A (en) Method of making a thin, ferro-magnetic memory layer and article made thereby
JPS62270778A (ja) 無電解めつき浴
JPS613316A (ja) 磁気記録媒体およびその製造方法
JPS62274076A (ja) 無電解ニツケル−リンめつき浴
JPS60149785A (ja) 無電解めつき浴
JPH0476811A (ja) 磁気記録媒体
JPH0229753B2 (ja) Mudenkaimetsukihoho
JPS6115985A (ja) 無電解めつき浴
JPH06120028A (ja) コバルト・ニッケル・燐合金磁性膜及びその磁気記録媒体並びにその製造方法
JPH02156090A (ja) 無電解めっき浴
JPS6154028A (ja) 磁気記録媒体およびその製造方法
JPS60103181A (ja) 無電解めつき浴
JPS6381622A (ja) 磁気記録体およびその製造方法
JPS6283474A (ja) 無電解めつき浴
JPS6383281A (ja) 無電解めつき浴
JPS6270580A (ja) 無電解めつき浴
JPS6292229A (ja) 磁気記録媒体の製造方法
JPS61235570A (ja) 無電解メツキ浴
JPS63241187A (ja) 無電解めつき浴
JPH04276083A (ja) 無電解めっき液
JPS5817824B2 (ja) 無電解メツキ浴