JPS59139636A - ボンデイング方法 - Google Patents

ボンデイング方法

Info

Publication number
JPS59139636A
JPS59139636A JP58008366A JP836683A JPS59139636A JP S59139636 A JPS59139636 A JP S59139636A JP 58008366 A JP58008366 A JP 58008366A JP 836683 A JP836683 A JP 836683A JP S59139636 A JPS59139636 A JP S59139636A
Authority
JP
Japan
Prior art keywords
metal
protrusion
lead
semiconductor element
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58008366A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0158864B2 (enExample
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58008366A priority Critical patent/JPS59139636A/ja
Publication of JPS59139636A publication Critical patent/JPS59139636A/ja
Publication of JPH0158864B2 publication Critical patent/JPH0158864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58008366A 1983-01-20 1983-01-20 ボンデイング方法 Granted JPS59139636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58008366A JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58008366A JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59139636A true JPS59139636A (ja) 1984-08-10
JPH0158864B2 JPH0158864B2 (enExample) 1989-12-13

Family

ID=11691236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58008366A Granted JPS59139636A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59139636A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63288033A (ja) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd フイルムキヤリア
US5058800A (en) * 1988-05-30 1991-10-22 Canon Kabushiki Kaisha Method of making electric circuit device
JPH03290937A (ja) * 1989-12-29 1991-12-20 Orient Watch Co Ltd バンプ付き金属リード及びその製造方法
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
US5197892A (en) * 1988-05-31 1993-03-30 Canon Kabushiki Kaisha Electric circuit device having an electric connecting member and electric circuit components
US5323535A (en) * 1991-02-25 1994-06-28 Canon Kabushiki Kaisha Electrical connecting member and method of manufacturing the same
US5819406A (en) * 1990-08-29 1998-10-13 Canon Kabushiki Kaisha Method for forming an electrical circuit member
US5860818A (en) * 1991-02-22 1999-01-19 Canon Kabushiki Kaisha Electrical connecting member
US6015081A (en) * 1991-02-25 2000-01-18 Canon Kabushiki Kaisha Electrical connections using deforming compression

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323257U (enExample) * 1989-07-17 1991-03-11
JPH0394468U (enExample) * 1990-01-19 1991-09-26
JPH0684067U (ja) * 1993-05-19 1994-12-02 株式会社荒井製作所 往復動用オイルシール

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63288033A (ja) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd フイルムキヤリア
US5058800A (en) * 1988-05-30 1991-10-22 Canon Kabushiki Kaisha Method of making electric circuit device
US5197892A (en) * 1988-05-31 1993-03-30 Canon Kabushiki Kaisha Electric circuit device having an electric connecting member and electric circuit components
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
JPH03290937A (ja) * 1989-12-29 1991-12-20 Orient Watch Co Ltd バンプ付き金属リード及びその製造方法
US5819406A (en) * 1990-08-29 1998-10-13 Canon Kabushiki Kaisha Method for forming an electrical circuit member
US5860818A (en) * 1991-02-22 1999-01-19 Canon Kabushiki Kaisha Electrical connecting member
US6511607B1 (en) 1991-02-22 2003-01-28 Canon Kabushiki Kaisha Method of making an electrical connecting member
US5323535A (en) * 1991-02-25 1994-06-28 Canon Kabushiki Kaisha Electrical connecting member and method of manufacturing the same
US6015081A (en) * 1991-02-25 2000-01-18 Canon Kabushiki Kaisha Electrical connections using deforming compression

Also Published As

Publication number Publication date
JPH0158864B2 (enExample) 1989-12-13

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