JPH0214779B2 - - Google Patents
Info
- Publication number
- JPH0214779B2 JPH0214779B2 JP57199203A JP19920382A JPH0214779B2 JP H0214779 B2 JPH0214779 B2 JP H0214779B2 JP 57199203 A JP57199203 A JP 57199203A JP 19920382 A JP19920382 A JP 19920382A JP H0214779 B2 JPH0214779 B2 JP H0214779B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- substrate
- protrusion
- protrusions
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/093—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H10W72/012—
-
- H10W72/01204—
-
- H10W72/20—
-
- H10W72/251—
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199203A JPS5988860A (ja) | 1982-11-12 | 1982-11-12 | 金属リ−ドへの金属突起物形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199203A JPS5988860A (ja) | 1982-11-12 | 1982-11-12 | 金属リ−ドへの金属突起物形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988860A JPS5988860A (ja) | 1984-05-22 |
| JPH0214779B2 true JPH0214779B2 (enExample) | 1990-04-10 |
Family
ID=16403851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57199203A Granted JPS5988860A (ja) | 1982-11-12 | 1982-11-12 | 金属リ−ドへの金属突起物形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988860A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
| US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
| WO1996037332A1 (en) * | 1995-05-26 | 1996-11-28 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
| US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
| EP1441232A3 (en) * | 1994-11-15 | 2009-11-04 | FormFactor, Inc. | Method for connecting electronic components |
| US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
| US7084650B2 (en) | 2002-12-16 | 2006-08-01 | Formfactor, Inc. | Apparatus and method for limiting over travel in a probe card assembly |
| US7528618B2 (en) | 2006-05-02 | 2009-05-05 | Formfactor, Inc. | Extended probe tips |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56147680A (en) * | 1980-04-16 | 1981-11-16 | Kurita Water Ind Ltd | Treatment of waste water |
-
1982
- 1982-11-12 JP JP57199203A patent/JPS5988860A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5988860A (ja) | 1984-05-22 |
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