JPS5878652U - 半導体素子搭載用セラミツクパツケ−ジ - Google Patents
半導体素子搭載用セラミツクパツケ−ジInfo
- Publication number
- JPS5878652U JPS5878652U JP17450581U JP17450581U JPS5878652U JP S5878652 U JPS5878652 U JP S5878652U JP 17450581 U JP17450581 U JP 17450581U JP 17450581 U JP17450581 U JP 17450581U JP S5878652 U JPS5878652 U JP S5878652U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic package
- conductor
- semiconductor elements
- groove
- mounting semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17450581U JPS5878652U (ja) | 1981-11-24 | 1981-11-24 | 半導体素子搭載用セラミツクパツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17450581U JPS5878652U (ja) | 1981-11-24 | 1981-11-24 | 半導体素子搭載用セラミツクパツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5878652U true JPS5878652U (ja) | 1983-05-27 |
JPS6244536Y2 JPS6244536Y2 (enrdf_load_stackoverflow) | 1987-11-25 |
Family
ID=29966526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17450581U Granted JPS5878652U (ja) | 1981-11-24 | 1981-11-24 | 半導体素子搭載用セラミツクパツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5878652U (enrdf_load_stackoverflow) |
-
1981
- 1981-11-24 JP JP17450581U patent/JPS5878652U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6244536Y2 (enrdf_load_stackoverflow) | 1987-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5878652U (ja) | 半導体素子搭載用セラミツクパツケ−ジ | |
JPS5878653U (ja) | 半導体素子搭載用セラミツクパツケ−ジ | |
JPS6127256U (ja) | ワイヤボンデイングパツド | |
JPS58120662U (ja) | チツプキヤリヤ− | |
JPS5827939U (ja) | セラミツクパツケ−ジ | |
JPS5881951U (ja) | 半導体素子搭載用パツケ−ジ | |
JPS6144835U (ja) | 半導体装置 | |
JPS5860942U (ja) | 混成集積回路装置 | |
JPS6094836U (ja) | 半導体装置 | |
JPS5954944U (ja) | 樹脂封止型半導体装置 | |
JPS59123347U (ja) | 混成集積回路装置 | |
JPS60144253U (ja) | 半導体装置 | |
JPS6099551U (ja) | 半導体装置 | |
JPS63178336U (enrdf_load_stackoverflow) | ||
JPS6020159U (ja) | 集積回路半導体装置 | |
JPS59146967U (ja) | セラミツク配線基板 | |
JPH0183340U (enrdf_load_stackoverflow) | ||
JPS5822741U (ja) | 半導体パツケ−ジ | |
JPS6138954U (ja) | 半導体装置 | |
JPS5892763U (ja) | 厚膜多層基板 | |
JPS60149148U (ja) | 多層配線を有する半導体装置 | |
JPS6138947U (ja) | 半導体の回路基板構造 | |
JPS5856452U (ja) | ハイブリツド型電子部品 | |
JPS58170846U (ja) | 半導体装置用リ−ドフレ−ム | |
JPS6115743U (ja) | 半導体装置 |