JPS5877292A - 印刷配線板の製造方法 - Google Patents

印刷配線板の製造方法

Info

Publication number
JPS5877292A
JPS5877292A JP56176091A JP17609181A JPS5877292A JP S5877292 A JPS5877292 A JP S5877292A JP 56176091 A JP56176091 A JP 56176091A JP 17609181 A JP17609181 A JP 17609181A JP S5877292 A JPS5877292 A JP S5877292A
Authority
JP
Japan
Prior art keywords
plating
printed
conductor
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56176091A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137877B2 (cs
Inventor
瑛一 綱島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56176091A priority Critical patent/JPS5877292A/ja
Publication of JPS5877292A publication Critical patent/JPS5877292A/ja
Publication of JPH0137877B2 publication Critical patent/JPH0137877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP56176091A 1981-11-02 1981-11-02 印刷配線板の製造方法 Granted JPS5877292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56176091A JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56176091A JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS5877292A true JPS5877292A (ja) 1983-05-10
JPH0137877B2 JPH0137877B2 (cs) 1989-08-09

Family

ID=16007542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56176091A Granted JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS5877292A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124295A (ja) * 1987-11-09 1989-05-17 Fujitsu Ltd プリント配線板の部品取付け孔の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124295A (ja) * 1987-11-09 1989-05-17 Fujitsu Ltd プリント配線板の部品取付け孔の形成方法

Also Published As

Publication number Publication date
JPH0137877B2 (cs) 1989-08-09

Similar Documents

Publication Publication Date Title
US4770900A (en) Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
US2965952A (en) Method for manufacturing etched circuitry
US6013417A (en) Process for fabricating circuitry on substrates having plated through-holes
US3060076A (en) Method of making bases for printed electric circuits
JPH09307216A (ja) 配線基板の製造方法及び配線基板
JPS5877292A (ja) 印刷配線板の製造方法
JPS58134497A (ja) 印刷配線板の製造方法及び印刷配線板
JP2566424B2 (ja) 導電性回路転写箔およびその製造法
JPH08228066A (ja) 電子部品搭載基板およびその製造方法
JPH10335779A (ja) パターン形成方法
JPS61102093A (ja) プリント基板の製造方法
JPH10284814A (ja) 回路パターン及びその形成方法
JPS648478B2 (cs)
JPS588600B2 (ja) リヨウメンプリントハイセンバンノセイゾウホウホウ
JPS5877287A (ja) 印刷配線板の製造方法
JPS5828890A (ja) 電気配線回路基板およびその製造方法
JPS6372189A (ja) 回路板の製造方法
JP2522968B2 (ja) 印刷回路転写箔およびその製造法
JPH01266789A (ja) モールド回路基版の製造方法
JPH04360596A (ja) 回路基板の製造方法
JPS61147595A (ja) 両面プリント配線基板の製造方法
JPS6235595A (ja) 転写シ−トの製造方法
JPS59121895A (ja) プリント配線基板の製造方法
JPS58121698A (ja) 多層配線基板
JPH0384989A (ja) 立体配線基板の製造方法