JPS5861632A - 洗浄槽 - Google Patents

洗浄槽

Info

Publication number
JPS5861632A
JPS5861632A JP56160583A JP16058381A JPS5861632A JP S5861632 A JPS5861632 A JP S5861632A JP 56160583 A JP56160583 A JP 56160583A JP 16058381 A JP16058381 A JP 16058381A JP S5861632 A JPS5861632 A JP S5861632A
Authority
JP
Japan
Prior art keywords
wafer
water
holes
wafers
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56160583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242373B2 (enExample
Inventor
Itaru Yamanaka
山仲　格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56160583A priority Critical patent/JPS5861632A/ja
Publication of JPS5861632A publication Critical patent/JPS5861632A/ja
Publication of JPS6242373B2 publication Critical patent/JPS6242373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP56160583A 1981-10-07 1981-10-07 洗浄槽 Granted JPS5861632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56160583A JPS5861632A (ja) 1981-10-07 1981-10-07 洗浄槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56160583A JPS5861632A (ja) 1981-10-07 1981-10-07 洗浄槽

Publications (2)

Publication Number Publication Date
JPS5861632A true JPS5861632A (ja) 1983-04-12
JPS6242373B2 JPS6242373B2 (enExample) 1987-09-08

Family

ID=15718091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56160583A Granted JPS5861632A (ja) 1981-10-07 1981-10-07 洗浄槽

Country Status (1)

Country Link
JP (1) JPS5861632A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503171A (en) * 1992-12-26 1996-04-02 Tokyo Electron Limited Substrates-washing apparatus
US5873381A (en) * 1996-03-13 1999-02-23 Lg Semicon Co., Ltd. Wet treatment apparatus for semiconductor wafer
US5921257A (en) * 1996-04-24 1999-07-13 Steag Microtech Gmbh Device for treating substrates in a fluid container
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
KR100828279B1 (ko) 2006-11-09 2008-05-07 동부일렉트로닉스 주식회사 판형 순수공급판을 갖춘 린스 베스

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562245U (enExample) * 1979-06-20 1981-01-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562245U (enExample) * 1979-06-20 1981-01-10

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503171A (en) * 1992-12-26 1996-04-02 Tokyo Electron Limited Substrates-washing apparatus
US5873381A (en) * 1996-03-13 1999-02-23 Lg Semicon Co., Ltd. Wet treatment apparatus for semiconductor wafer
US5921257A (en) * 1996-04-24 1999-07-13 Steag Microtech Gmbh Device for treating substrates in a fluid container
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
KR100828279B1 (ko) 2006-11-09 2008-05-07 동부일렉트로닉스 주식회사 판형 순수공급판을 갖춘 린스 베스

Also Published As

Publication number Publication date
JPS6242373B2 (enExample) 1987-09-08

Similar Documents

Publication Publication Date Title
JPS5861632A (ja) 洗浄槽
JPH0431252Y2 (enExample)
JP7086317B1 (ja) めっき処理方法
JPS6457624A (en) Cleaning equipment
JPS6242372B2 (enExample)
JPS6242374B2 (enExample)
JPS60229339A (ja) 湿式洗浄装置
JP2698871B2 (ja) バレルメッキ装置
JP2845309B2 (ja) ウェット処理装置
JPH0448629A (ja) 半導体ウェーハの液処理装置
JPH0276837U (enExample)
JPH0298931A (ja) 半導体基板浸漬処理槽
JPH11319736A (ja) 基板処理方法及びその装置
JP2000031103A (ja) 洗浄方法、洗浄液置換方法、洗浄装置並びに洗浄槽
JP3437535B2 (ja) ウェハ洗浄処理装置及びその方法
JP3285006B2 (ja) めっき装置及びめっき処理方法
JPS623393Y2 (enExample)
JPH0647012Y2 (ja) メッキ装置
JP2549535Y2 (ja) 洗浄装置
JPH0661209A (ja) 洗浄装置及びこれを用いた半導体ウエハなどの基板の洗浄方法
JPH0385470U (enExample)
JPH01278730A (ja) 半導体ウェーハの洗浄装置
JP2001020095A (ja) めっき装置
JPH1022253A (ja) 洗浄槽
JPH0269939A (ja) ウェット処理槽