JPS584955A - 金めつきされた電子部品パツケ−ジ - Google Patents

金めつきされた電子部品パツケ−ジ

Info

Publication number
JPS584955A
JPS584955A JP56102743A JP10274381A JPS584955A JP S584955 A JPS584955 A JP S584955A JP 56102743 A JP56102743 A JP 56102743A JP 10274381 A JP10274381 A JP 10274381A JP S584955 A JPS584955 A JP S584955A
Authority
JP
Japan
Prior art keywords
gold
plating
package
thickness
gold plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56102743A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243343B2 (cg-RX-API-DMAC10.html
Inventor
Shinichi Wakabayashi
信一 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP56102743A priority Critical patent/JPS584955A/ja
Priority to GB08217956A priority patent/GB2103420B/en
Publication of JPS584955A publication Critical patent/JPS584955A/ja
Publication of JPS6243343B2 publication Critical patent/JPS6243343B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W70/66—
    • H10W72/00—
    • H10W72/30—
    • H10W76/157—
    • H10W76/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10W72/075—
    • H10W72/5524—
    • H10W72/884—
    • H10W72/952—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP56102743A 1981-06-30 1981-06-30 金めつきされた電子部品パツケ−ジ Granted JPS584955A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56102743A JPS584955A (ja) 1981-06-30 1981-06-30 金めつきされた電子部品パツケ−ジ
GB08217956A GB2103420B (en) 1981-06-30 1982-06-21 Gold-plated package for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56102743A JPS584955A (ja) 1981-06-30 1981-06-30 金めつきされた電子部品パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS584955A true JPS584955A (ja) 1983-01-12
JPS6243343B2 JPS6243343B2 (cg-RX-API-DMAC10.html) 1987-09-12

Family

ID=14335709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56102743A Granted JPS584955A (ja) 1981-06-30 1981-06-30 金めつきされた電子部品パツケ−ジ

Country Status (2)

Country Link
JP (1) JPS584955A (cg-RX-API-DMAC10.html)
GB (1) GB2103420B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0229850B1 (en) * 1985-07-16 1992-06-10 Nippon Telegraph and Telephone Corporation Connection terminals between substrates and method of producing the same
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
FR2610451B1 (fr) * 1987-01-30 1989-04-21 Radiotechnique Compelec Dispositif opto-electronique comprenant au moins un composant monte sur un support
DE3704200A1 (de) * 1987-02-11 1988-08-25 Bbc Brown Boveri & Cie Verfahren zur herstellung einer verbindung zwischen einem bonddraht und einer kontaktflaeche bei hybriden dickschicht-schaltkreisen
CA2092165C (en) * 1992-03-23 2001-05-15 Tuyosi Nagano Chip carrier for optical device
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置
FR2713401B1 (fr) * 1993-09-29 1997-01-17 Mitsubishi Electric Corp Dispositif à semiconducteurs optique.
JP2606115B2 (ja) * 1993-12-27 1997-04-30 日本電気株式会社 半導体実装基板用素子接合パッド
DE102008021435A1 (de) * 2008-04-29 2009-11-19 Schott Ag Gehäuse für LEDs mit hoher Leistung
CN119297161A (zh) * 2024-11-18 2025-01-10 中国振华集团永光电子有限公司（国营第八七三厂） 一种贴片式功率混合集成电路模块封装方法及其封装结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609472A (en) * 1969-05-21 1971-09-28 Trw Semiconductors Inc High-temperature semiconductor and method of fabrication
JPS4829186A (cg-RX-API-DMAC10.html) * 1971-08-18 1973-04-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609472A (en) * 1969-05-21 1971-09-28 Trw Semiconductors Inc High-temperature semiconductor and method of fabrication
JPS4829186A (cg-RX-API-DMAC10.html) * 1971-08-18 1973-04-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961155A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
GB2103420A (en) 1983-02-16
GB2103420B (en) 1986-01-29
JPS6243343B2 (cg-RX-API-DMAC10.html) 1987-09-12

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