JPS5842640B2 - カンツウコウオユウスル プリントハイセンキバン ノ セイゾウホウ - Google Patents
カンツウコウオユウスル プリントハイセンキバン ノ セイゾウホウInfo
- Publication number
- JPS5842640B2 JPS5842640B2 JP50117074A JP11707475A JPS5842640B2 JP S5842640 B2 JPS5842640 B2 JP S5842640B2 JP 50117074 A JP50117074 A JP 50117074A JP 11707475 A JP11707475 A JP 11707475A JP S5842640 B2 JPS5842640 B2 JP S5842640B2
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- foil
- thin
- thin metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 230000001681 protective effect Effects 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 13
- 238000005553 drilling Methods 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011151 fibre-reinforced plastic Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000935974 Paralichthys dentatus Species 0.000 description 2
- 241000242541 Trematoda Species 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000009963 fulling Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1388—Temporary protective conductive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE7412169A SE7412169L (sv) | 1974-09-27 | 1974-09-27 | Forfarande vid framstellning av genomgaende hal i ett laminat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5160955A JPS5160955A (en) | 1976-05-27 |
| JPS5842640B2 true JPS5842640B2 (ja) | 1983-09-21 |
Family
ID=20322242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50117074A Expired JPS5842640B2 (ja) | 1974-09-27 | 1975-09-26 | カンツウコウオユウスル プリントハイセンキバン ノ セイゾウホウ |
Country Status (9)
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432763A (en) * | 1977-08-18 | 1979-03-10 | Hitachi Ltd | Method of making print wire board |
| US4323421A (en) * | 1978-04-28 | 1982-04-06 | Bell Telephone Laboratories, Incorporated | Fabrication of conductor-clad composites using molding compounds and techniques |
| US4393111A (en) * | 1980-02-15 | 1983-07-12 | Bell Telephone Laboratories, Incorporated | Fabrication of conductor-clad composites using molding compounds and techniques |
| DE3008143C2 (de) * | 1980-03-04 | 1982-04-08 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von gedruckten Leiterplatten mit Lochungen, deren Wandungen metallisiert sind |
| JPS60244091A (ja) * | 1984-05-18 | 1985-12-03 | 富士通株式会社 | バリ除去方法 |
| JPS627194A (ja) * | 1985-07-04 | 1987-01-14 | 旭化成株式会社 | スル−ホ−ル回路 |
| US5004521A (en) * | 1988-11-21 | 1991-04-02 | Yamaha Corporation | Method of making a lead frame by embossing, grinding and etching |
| US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
| US5528826A (en) * | 1994-04-04 | 1996-06-25 | Hughes Aircraft Company | Method of constructing high yield, fine line, multilayer printed wiring board panel |
| GB9420182D0 (en) * | 1994-10-06 | 1994-11-23 | Int Computers Ltd | Printed circuit manufacture |
| US5590854A (en) * | 1994-11-02 | 1997-01-07 | Shatz; Solomon | Movable sheet for laminar flow and deicing |
| EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
| TNSN97123A1 (fr) * | 1996-07-18 | 1999-12-31 | Droz Francois | Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede |
| US6129990A (en) * | 1998-04-10 | 2000-10-10 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| US6355360B1 (en) | 1998-04-10 | 2002-03-12 | R.E. Service Company, Inc. | Separator sheet laminate for use in the manufacture of printed circuit boards |
| US6129998A (en) * | 1998-04-10 | 2000-10-10 | R.E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| US6127051A (en) * | 1998-04-10 | 2000-10-03 | R. E. Service Company, Inc. | Copper/steel laminated sheet for use in manufacturing printed circuit boards |
| CA2387803C (en) | 1999-12-09 | 2010-02-09 | Valspar Sourcing, Inc. | Abrasion resistant coatings |
| US6783860B1 (en) | 2001-05-11 | 2004-08-31 | R. E. Service Company, Inc. | Laminated entry and exit material for drilling printed circuit boards |
| JP2003158358A (ja) * | 2001-11-26 | 2003-05-30 | Hitachi Via Mechanics Ltd | レーザー穴あけ加工方法及び装置 |
| US20050112344A1 (en) * | 2003-08-20 | 2005-05-26 | Redfern Sean M. | Apparatus and method for use in printed circuit board drilling applications |
| US7618514B2 (en) * | 2006-02-03 | 2009-11-17 | United Technologies Corporation | Photo-etched EDM electrode |
| EP2191701B1 (en) | 2007-09-28 | 2013-03-20 | Tri-Star Laminates, Inc. | Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards |
| CN103317298A (zh) * | 2013-05-08 | 2013-09-25 | 孙树峰 | 飞秒激光辅助抑制微切削零件毛刺形成的方法 |
| CN105409334B (zh) * | 2013-06-21 | 2019-12-20 | 桑米纳公司 | 使用可去除覆盖层形成具有电镀透孔的层叠结构的方法 |
| EP2853619A1 (en) | 2013-09-25 | 2015-04-01 | ATOTECH Deutschland GmbH | Method for treatment of recessed structures in dielectric materials for smear removal |
| SG11201608609UA (en) * | 2014-02-21 | 2016-11-29 | Mitsui Mining & Smelting Co | Copper clad laminate provided with protective layer and multilayered printed wiring board |
| CN104923925B (zh) * | 2015-05-12 | 2017-11-17 | 中国科学院微电子研究所 | 一种降低激光热效应的玻璃通孔制作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653997A (en) * | 1970-06-22 | 1972-04-04 | North American Rockwell | Conditioning and shaping solution for circuit boards |
| US3719536A (en) * | 1971-02-12 | 1973-03-06 | Alumet Corp | Mechanochemical sheet metal blanking system |
| US3936548A (en) * | 1973-02-28 | 1976-02-03 | Perstorp Ab | Method for the production of material for printed circuits and material for printed circuits |
-
1974
- 1974-09-27 SE SE7412169A patent/SE7412169L/xx unknown
-
1975
- 1975-08-26 US US05/607,939 patent/US4023998A/en not_active Expired - Lifetime
- 1975-09-03 NL NL7510374A patent/NL7510374A/xx not_active Application Discontinuation
- 1975-09-05 GB GB36747/75A patent/GB1502975A/en not_active Expired
- 1975-09-10 IT IT27095/75A patent/IT1042430B/it active
- 1975-09-16 DE DE2541282A patent/DE2541282C2/de not_active Expired
- 1975-09-25 CH CH1246975A patent/CH596733A5/xx not_active IP Right Cessation
- 1975-09-26 JP JP50117074A patent/JPS5842640B2/ja not_active Expired
- 1975-09-26 FR FR7529527A patent/FR2286578A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2541282C2 (de) | 1983-11-17 |
| SE7412169L (sv) | 1976-03-29 |
| JPS5160955A (en) | 1976-05-27 |
| US4023998A (en) | 1977-05-17 |
| DE2541282A1 (de) | 1976-04-08 |
| IT1042430B (it) | 1980-01-30 |
| CH596733A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-03-15 |
| FR2286578A1 (fr) | 1976-04-23 |
| NL7510374A (nl) | 1976-03-30 |
| FR2286578B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1980-04-11 |
| GB1502975A (en) | 1978-03-08 |
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