FR2286578A1 - Procede pour la realisation de trous tranversants dans un stratifie - Google Patents

Procede pour la realisation de trous tranversants dans un stratifie

Info

Publication number
FR2286578A1
FR2286578A1 FR7529527A FR7529527A FR2286578A1 FR 2286578 A1 FR2286578 A1 FR 2286578A1 FR 7529527 A FR7529527 A FR 7529527A FR 7529527 A FR7529527 A FR 7529527A FR 2286578 A1 FR2286578 A1 FR 2286578A1
Authority
FR
France
Prior art keywords
laminate
realization
crossing holes
crossing
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7529527A
Other languages
English (en)
French (fr)
Other versions
FR2286578B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Perstorp AB
Original Assignee
Perstorp AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp AB filed Critical Perstorp AB
Publication of FR2286578A1 publication Critical patent/FR2286578A1/fr
Application granted granted Critical
Publication of FR2286578B1 publication Critical patent/FR2286578B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7529527A 1974-09-27 1975-09-26 Procede pour la realisation de trous tranversants dans un stratifie Granted FR2286578A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7412169A SE7412169L (sv) 1974-09-27 1974-09-27 Forfarande vid framstellning av genomgaende hal i ett laminat

Publications (2)

Publication Number Publication Date
FR2286578A1 true FR2286578A1 (fr) 1976-04-23
FR2286578B1 FR2286578B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-04-11

Family

ID=20322242

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7529527A Granted FR2286578A1 (fr) 1974-09-27 1975-09-26 Procede pour la realisation de trous tranversants dans un stratifie

Country Status (9)

Country Link
US (1) US4023998A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5842640B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH596733A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2541282C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2286578A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1502975A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1042430B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7510374A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE7412169L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2482406A1 (fr) * 1980-03-04 1981-11-13 Kollmorgen Tech Corp Procede de fabrication de plaques de conducteurs imprimees comportant des trous et dont les parois sont metallisees
EP0706309A1 (en) * 1994-10-06 1996-04-10 International Computers Limited Printed circuit manufacture
EP0676914A3 (en) * 1994-04-04 1997-03-05 Hughes Aircraft Co Process for producing a multilayer printed circuit board with fine conductor tracks and high yield.
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432763A (en) * 1977-08-18 1979-03-10 Hitachi Ltd Method of making print wire board
US4323421A (en) * 1978-04-28 1982-04-06 Bell Telephone Laboratories, Incorporated Fabrication of conductor-clad composites using molding compounds and techniques
US4393111A (en) * 1980-02-15 1983-07-12 Bell Telephone Laboratories, Incorporated Fabrication of conductor-clad composites using molding compounds and techniques
JPS60244091A (ja) * 1984-05-18 1985-12-03 富士通株式会社 バリ除去方法
JPS627194A (ja) * 1985-07-04 1987-01-14 旭化成株式会社 スル−ホ−ル回路
US5004521A (en) * 1988-11-21 1991-04-02 Yamaha Corporation Method of making a lead frame by embossing, grinding and etching
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5590854A (en) * 1994-11-02 1997-01-07 Shatz; Solomon Movable sheet for laminar flow and deicing
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
CA2387803C (en) 1999-12-09 2010-02-09 Valspar Sourcing, Inc. Abrasion resistant coatings
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
JP2003158358A (ja) * 2001-11-26 2003-05-30 Hitachi Via Mechanics Ltd レーザー穴あけ加工方法及び装置
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
US7618514B2 (en) * 2006-02-03 2009-11-17 United Technologies Corporation Photo-etched EDM electrode
EP2191701B1 (en) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
CN103317298A (zh) * 2013-05-08 2013-09-25 孙树峰 飞秒激光辅助抑制微切削零件毛刺形成的方法
CN105409334B (zh) * 2013-06-21 2019-12-20 桑米纳公司 使用可去除覆盖层形成具有电镀透孔的层叠结构的方法
EP2853619A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method for treatment of recessed structures in dielectric materials for smear removal
SG11201608609UA (en) * 2014-02-21 2016-11-29 Mitsui Mining & Smelting Co Copper clad laminate provided with protective layer and multilayered printed wiring board
CN104923925B (zh) * 2015-05-12 2017-11-17 中国科学院微电子研究所 一种降低激光热效应的玻璃通孔制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653997A (en) * 1970-06-22 1972-04-04 North American Rockwell Conditioning and shaping solution for circuit boards
US3719536A (en) * 1971-02-12 1973-03-06 Alumet Corp Mechanochemical sheet metal blanking system
US3936548A (en) * 1973-02-28 1976-02-03 Perstorp Ab Method for the production of material for printed circuits and material for printed circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2482406A1 (fr) * 1980-03-04 1981-11-13 Kollmorgen Tech Corp Procede de fabrication de plaques de conducteurs imprimees comportant des trous et dont les parois sont metallisees
EP0676914A3 (en) * 1994-04-04 1997-03-05 Hughes Aircraft Co Process for producing a multilayer printed circuit board with fine conductor tracks and high yield.
EP0706309A1 (en) * 1994-10-06 1996-04-10 International Computers Limited Printed circuit manufacture
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board

Also Published As

Publication number Publication date
DE2541282C2 (de) 1983-11-17
SE7412169L (sv) 1976-03-29
JPS5160955A (en) 1976-05-27
US4023998A (en) 1977-05-17
DE2541282A1 (de) 1976-04-08
IT1042430B (it) 1980-01-30
CH596733A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-03-15
NL7510374A (nl) 1976-03-30
FR2286578B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-04-11
GB1502975A (en) 1978-03-08
JPS5842640B2 (ja) 1983-09-21

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Legal Events

Date Code Title Description
ST Notification of lapse